Industry sources indicate that while the Japanese government maintains high expectations for Rapidus, contingency plans are being developed. Recently appointed Shigeru Ishiba, Japan's new Prime Minister, has pledged over JPY10 trillion (US$64.7 billion) to strengthen the domestic semiconductor and AI industries over the next seven years, with Rapidus as a primary focus. The package may include financial incentives to attract TSMC to establish a third wafer fab in Japan
The US is reportedly poised to implement new restrictions on semiconductor exports to China, potentially affecting around 200 Chinese chip firms. The move could strengthen Taiwan's IC design sector against Chinese competition
Japanese space communications pioneers are charting an alternative path in the global satellite internet race, pushing beyond traditional satellite networks with a comprehensive strategy that spans from ocean to space. The initiative aims to address the growing demands of Beyond 5G/6G communications while facilitating the transition to a decentralized society
TSMC has halted providing advanced AI chips at 7 nanometers and below to Chinese customers, highlighting mounting challenges for China's semiconductor industry. The suspension follows the discovery of TSMC-produced chips in Huawei devices and comes as the incoming Trump administration signals potential stricter sanctions. At the IC China 2024 in Beijing, industry leaders expressed both caution and resolve, calling for intensified efforts in generative AI and semiconductor technology to capitalize on China's vast market potential
Huawei is reportedly advancing its plans to mass-produce the Ascend 910C AI chip in the first quarter of 2025, even as the company grapples with extremely low wafer yields. Simultaneously, China's AI chip development faces mounting barriers under intense scrutiny from the US Department of Commerce
President-elect Donald Trump's pick of Scott Bessent as Treasury secretary may give Beijing room to negotiate with the US over their trade tensions, in part due to his moderate stance on tariffs
Apple CEO Tim Cook joined more than 20 corporate leaders in discussions with China's premier Monday, as global companies grapple with potential trade disruptions and economic uncertainty
STMicroelectronics unveiled a strategic partnership with China's Hua Hong Semiconductor, with a plan to commence production of 40nm process MCUs in Shenzhen by the end of 2025. STMicroelectronics noted the importance of establishing a local manufacturing footprint in China to retain a competitive edge in the EV market
On November 8, news broke that China's 7nm chip manufacturing supply was cut off, prompting major foundries like TSMC and Samsung Foundry to remain silent. However, recent reports from multiple Chinese media sources have begun to clarify the situation
According to findings from China's semiconductor think tank, ICwise, the US Department of Commerce's (DOC) recent sanctions differ slightly from previous measures
In 2024, Samsung Electronics and SK Hynix saw their US semiconductor revenue surge, driven by robust demand from AI-focused tech firms and data centers. This growth stemmed from increased sales of premium semiconductor products such as HBM and DDR5 modules
In the rapidly evolving landscape of global offshore wind energy, China has emerged as the undisputed frontrunner, while India is just beginning to explore this sector. Industry experts from Rystad Energy and S&P Global offer insights into the different paths taken by these two Asian giants in the offshore wind market
Japan Display Inc. (JDI) anticipates its eleventh consecutive year of net losses and plans to pivot from displays to growth sectors such as semiconductor packaging substrates and AI data centers, though the transition will require time
During Nvidia's earnings call for the third quarter of fiscal year 2025, CEO Jensen Huang expressed gratitude to supply chain partners including TSMC and SK Hynix for their contribution to the next-generation Blackwell chips. However, Samsung Electronics (Samsung) was notably absent from this acknowledgment, sparking speculation about the availability of its HBM3E
