The Japanese government is preparing to provide over JPY10 trillion (approx. US$65 billion) in support for the semiconductor and AI industries by the fiscal year 2030 (April 2030 to March 2031). This plan includes an allocation of JPY6 trillion for subsidies aimed at R&D and production investments, while the remaining JPY4 trillion is expected to be financed through government-backed loans and other financial support

The foldable smartphone market is set to expand significantly in 2024, with a projected growth rate of 22%, far surpassing the overall smartphone market's estimated 5.8% growth, according to IDC. This rapid growth underscores the increasing consumer demand for innovative mobile technology

President-elect Donald Trump has announced his plan to name Howard Lutnick, a prominent China critic, as Secretary of Commerce. Lutnick will oversee the management of US tariffs and trade policies

Japanese photoresist leader JSR is building a production base in South Korea to manufacture metal-oxide resists (MOR), a critical material for extreme ultraviolet (EUV) lithography. Slated to begin mass production in 2026, this initiative aims to bolster the stability of South Korea's semiconductor supply chain

Japanese authorities have officially terminated subsidies for APB Corp, a pioneer in next-generation all-polymer battery technology, amid severe financial difficulties and leadership turmoil

It has been almost a month since China's solar industry set a floor price in order to curb cut-throat competition among its members, but some opportunists are taking advantage of loopholes to circumvent the restrictions, according to industry sources

At the 2024 World Internet Conference (WIC), Chinese President Xi Jinping emphasized that while AI empowers humanity to better understand and reshape the world, it also presents unpredictable risks and challenges. Xi urged the global community to adopt security as a core principle and collaborate to establish a "shared future in cyberspace," according to the South China Morning Post

This year's Auto Guangzhou exhibition features more than 1,000 vehicle models and 86 auto brands, with new entrants like Maextro drawing significant attention from visitors

The newest round of subsidies for trade-in programs made by China's government targeting TVs and consumer electronics has effectively boosted LCD TV demand in the fourth quarter, stabilizing panel prices. The most notable growth was observed in the ultra-large TV segment, but concerns about the potential overdrawing of future demand remain

Chinese government subsidies successfully drove electronics sales during Single's Day shopping events, according to sources at IC design houses. However, concerns have emerged that this may have only accelerated consumer spending, potentially weakening demand in the first half of 2025

SK Hynix's strategic focus on high-end NAND memory, coupled with rising AI-driven demand, is expected to push its annual market share above 20% in 2024, bringing it closer to industry leader Samsung Electronics

Reports from Kyodo and Nikkei indicate that the Japanese government intends to invest around JPY200 billion (approx. US$1.3 billion) in Rapidus during the fiscal year 2025, spanning from April 2025 to March 2026. This investment aims to bolster the development of advanced semiconductor mass production capabilities in Japan. Additionally, by providing government support, the initiative seeks to encourage private-sector financing and investments in Rapidus

The Chinese PC market is expected to experience particularly weak sales during the first quarter of 2025, following a surge in replacement demand driven by government trade-in subsidies, according to industry sources

China's semiconductor industry is intensifying its drive toward self-sufficiency through expanded state funding and domestic innovation, particularly as Donald Trump's return to the White House approaches. At the 2024 China International Semiconductor Expo (IC China), industry leaders and government officials highlighted the nation's progress in strengthening its semiconductor capabilities

Samsung Electronics is bolstering its HBM competitiveness through significant investments in advanced packaging. Upgrades are underway at its Cheonan facility in South Korea, and its Samsung Electronics Suzhou Semiconductor (SESS) plant in China is receiving new semiconductor production tools. According to Seoul Economic Daily and Businesskorea, Samsung secured contracts worth KRW20 billion (approx. US$14.32 million) in the third quarter of 2024 to drive this expansion