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xMEMS sees 2027 debut for cooling chips as AI glasses, SSDs face heat limits

, DIGITIMES Asia, Taipei
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Mike Housholder, vice president at xMEMS, showcases the company’s µCooling technology at Computex 2026. Credit: Sherri Wang

xMEMS Labs is preparing to move its MEMS-based µCooling technology toward commercial production in 2027, with AI glasses and data-center SSDs expected to be among the first applications as sustained AI workloads push thermal constraints beyond GPUs.

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