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Tongfu Microelectronics taps AMD synergy to command the AI packaging frontier

Amanda Liang, Taipei; Levi Li, DIGITIMES Asia 0

AMD CEO Lisa Su. Credit: DIGITIMES

Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing company, made a significant leap in advanced packaging after acquiring 85% of AMD's Suzhou and Penang facilities in 2015. The deal gave it access to key CPU, GPU, APU, and...

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