China's semiconductor firms in the IC packaging & testing, equipment, foundry, and IC design industries performed much better than their IDM, materials, optoelectronics, and memory...
A Reuters report quoted three people familiar with the fact that more and more Chinese IC design houses are having their chips packaged in Malaysia, worrying that the US...
In the three major segments of the semiconductor value chain: design, manufacturing, and packaging/testing, China's weakest link is manufacturing. In the packaging and testing field,...
Former TSMC COO, Chiang Shang-yi, currently the chief strategy officer at Foxconn semiconductors, faced challenges when he returned to China's SMIC in December 2020. He encountered...
China-based OSATs, including Chipmore Technology and Tongfu Microelectronics (TFME), have seen orders from the local display driver IC (DDI) sector ramp up recently, according to...
TSMC, ASE Technology and Tongfu Microelectronics (TFME), as well as test interface specialists WinWay Technology and Chunghwa Precision Test Tech (CHPT) are all gearing up for shipments...
While front-end manufacturing and back-end assembling and testing of NVIDIA's next-generation AI chips are handled by TSMC and Taiwan-based packaging and testing companies, China-based...
Malaysia should strive to attract investors to set up at least one medium-size wafer foundry fab to build a complete semiconductor manufacturing supply chain in the country, not just...
Leading Chinese IC assembly and testing player Tonfgu Microelectronics has revealed its first-quarter 2023 results, seeing a revenue of CNY4.64 billion (US$670 million), up 3.11%...
Tongfu Microelectronics, a major IC assembly and testing company in China, has posted sales that grew by 35.52% but saw profit drop by 47.53% amid the macroeconomic challenges and...
As Nvidia founder Jensen Huang observed the "iPhone moment for AI", AMD has also strengthened its role in artificial intelligence (AI). The GPU/CPU provider has reportedly set up...
The Dutch government has succumbed to Washington's pressures, despite earlier comments from Dutch Foreign Trade Minister Liesje Schreinemacher that the Netherlands would not "copy...
China-based OSATs including JCET, Tianshui Huatian Technology and Tongfu Microelectronics have seen their capacity utilization rates plummet since the fourth quarter of 2022, due...
Intel has disclosed plans to hike its CPU prices by 10-20% starting October, but AMD is not expected to follow suit amid the waning terminal market demand, according to industry so...
China-based OSAT Tongfu Microelectronics, who now commands 80% of AMD's outsourced backend orders, has said its business results will see only limited impact from order cuts amid...
