Samsung and SK Hynix set to introduce new HBM wafer debonding technology

Daniel Chiang, Taipei; Jack Wu, DIGITIMES Asia 0

Credit: Samsung

Samsung Electronics and SK Hynix are investing in R&D of new process technologies to prevent warpage in next-generation high-bandwidth memory (HBM). This move is anticipated to bring about changes in the materials and equipment supply chains.

The article requires paid subscription. Subscribe Now