Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

, Taipei

Jul 14, 2025, 16:20 0

Credit: AFP

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation for next-generation HBM4 and NAND flash memory exceeding 400 layers, SK Hynix is reportedly preparing to overhaul its...

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