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Highlights of the day: Intel, TSMC head to head in 3D packaging

DIGITIMES staff 0

Intel and TSMC are head to head in 3D packaging technology. While Intel has unveiled its Lakefield processors 3D-packaged with its Foveros technology, TSMC is looking to commercialize its SoIC technology for 3D heterogeneous integration next year. Meanwhile, Nan Ya PCB is looking to boost its profits by focusing more on high-value products, such as ABF and SiP substrates. And for driver IC designers, OLED DDI chips for smartphones promise to be a major driver of their next wave of growth.

Intel, TSMC gearing up for heterogeneous 3D IC integration: Intel has launched its first heterogeneous chip architecture made using its Foveros 3D chip stacking technology, while TSMC is looking to commercialize its SoIC (system on integrated chips) technology for 3D heterogeneous integration in 2021.

Nan Ya looks to ABF, SiP substrates for profit growth in 2020: Nan Ya PCB will be striving to boost its profits in 2020 by focusing more on shipments of high-value products such as ABF and SiP substrates, according to company chairman CC Wu.

China, Taiwan IC designers keen on developing OLED DDI chips: Fabless chipmakers in Taiwan and China specializing in display driver ICs and fingerprint sensor chips are keenly developing OLED DDI chip solutions for smartphones seeking to build a preemptive presence in OLED screens that promise to become a mainstream in the hadnset market, according to industry sources.

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