TSMC, Broadcom enhance CoWoS platform with 2X reticle size interposer

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TSMC, Broadcom enhance CoWoS platform with 2X reticle size interposer

Jessie Shen, DIGITIMES, Taipei

Tuesday 3 March 2020

TSMC announced on March 3 the foundry has collaborated with Broadcom on enhancing the chip-on-wafer-on-substrate (CoWoS) platform to support the industry's first and largest 2X reticle size interposer.

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