Bits + chips
Arm and TSMC demo 7nm Arm-based CoWoS chiplets for HPC
Jessie Shen, DIGITIMES, Taipei

Arm and TSMC have announced jointly an industry-first 7nm silicon-proven chiplet system based on multiple Arm cores and leveraging TSMC's chip-on-wafer-on-substrate (CoWoS) advanced packaging solution. This single proof-of-concept chiplet system successfully...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.