Bits + chips
PTI fan-out panel-level packaging attracts orders from MediaTek
Julian Ho, Taipei; Jessie Shen, DIGITIMES
Friday 18 May 2018

Powertech Technology (PTI) with its fan-out panel-level packaging (FOPLP) technology has obtained orders for power management ICs from MediaTek, according to industry sources.

Specializing in memory-IC backend services, PTI has in recent years put more focus on advanced packaging for logic ICs. The new FOPLP orders from MediaTek are being regarded as a milestone in the company's expansion in the logic IC field.

PTI will kick off production for FOPLP in small volume in June, said the sources, adding that the production line is located at its factory site in Hsinchu, northern Taiwan.

MediaTek is expected to introduce its first SoC adopting FOPLP in the third quarter, the sources indicated. The upcoming solution will be applied to automotive radar applications, the sources said.

PTI's FOPLP technology is also expected to attract orders for RF ICs, and eMMC, eMCP and UFS flash memory device controllers, the sources believe. Unlike FOWLP (fan-out wafer-level packaging) designed for customized and high-end solutions, FOPLP helps lower the overall production costs of devices as a cost competitive packaging method which attracts many fabless IC firms' interests.

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