Advanced Semiconductor Engineering (ASE) under ASE Technology Holding is expected to make significant progress on its fan-out panel-level packaging (FOPLP) services in the first half of 2019, according to sources familiar with the matter.
Advanced Semiconductor Engineering (ASE) under ASE Technology Holding is expected to make significant progress on its fan-out panel-level packaging (FOPLP) services in the first half of 2019, according to sources familiar with the matter.