ASE gearing up for FOPLP

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ASE gearing up for FOPLP

Julian Ho, Taipei; Jessie Shen, DIGITIMES

Wednesday 3 October 2018

Advanced Semiconductor Engineering (ASE) under ASE Technology Holding is expected to make significant progress on its fan-out panel-level packaging (FOPLP) services in the first half of 2019, according to sources familiar with the matter.

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