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IC substrate makers gearing up for expansion

Patty Wang, Taipei; Jessie Shen, DIGITIMES Tuesday 6 January 2015 0

Taiwan-based IC substrate makers Unimicron Technology, Kinsus Interconnect Technology and Nanya PCB will continue to ramp up their production capacities for flip-chip chip scale package (FC CSP) substrates in 2015, according to industry observers.

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