Bits + chips
Elpida begins sample shipments of 3D-TSV stacked DDR3 DRAM
Press release; Jessie Shen, DIGITIMES

Elpida Memory on June 27 announced that it has begun sample shipments of its DDR3 SDRAM (x32-bit I/O configuration) made using TSV stacking technology. The sample is a low-power 8Gb (1GB) DDR3 SDRAM assembled in a single package that consists of four...

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