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New Samsung 8GB DDR3 module utilizes 3D TSV technology

Press release; Jessie Shen, DIGITIMES Asia Tuesday 7 December 2010 0

Samsung Electronics has announced a lineup of 8GB DDR3 modules developed using 3D chip stacking technology, which is also referred to as through silicon via (TSV). The company claimed its TSV technology is a key to solving the paradox of driving lower...

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