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3D IC packaging to be mature within 3 years, says ASE chief officer

Ingrid Lee, Taipei; Meiling Chen, DIGITIMES 0

Advanced 3D packaging has been adopted in image sensor ICs used in camera lens modules which recently entered volume production, and will be applied into CPUs, baseband ICs, and handset chips by 2012-2015, according to Tong Ho-Ming, R&D chief officer...

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