Wednesday 1 November 2023
UMC launches 3D IC project in collaboration with partners
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
Thursday 26 October 2023
SK Hynix DRAM biz returns to profitability in 3Q23
The memory market is still slow. Operating losses at SK Hynix continued in the third quarter of 2023, but the quarterly loss was reduced by 37.8%. Despite this, its DRAM division...
Thursday 31 August 2023
To enhance its HBM competitiveness, SK Hynix expands packaging talents internally
The AI boom has fueled the high-performance semiconductor market. SK Hynix, in light of investment reduction, has elected to expand its HBM technology capabilities through recent...
Friday 11 August 2023
Hanmi Semiconductor established new production site to prepare for TSV process orders in HBM
The AI trend has fueled the high-bandwidth memory (HBM) business opportunities, which in turn has brought attention to related equipment supplier Hanmi Semiconductor. Recently, to...
Thursday 27 April 2023
Customers remain hesitant about more advanced processes; academia needs to solve cost and yield rate issues
Although TSMC's 3nm process has already achieved mass production, its capacity utilization rate is not yet filled. Chen Liang-chia, a distinguished professor of the mechanical engineering...
Wednesday 14 July 2021
Taiwan CIS backend firms to embrace strong 2H21
Backend houses including Xintec, ShunSin Technology and Tong Hsing Electronic Industries are expected to post brisker sales results for the second half of 2021 after posting impressive...
Thursday 17 June 2021
Tong Hsing to expand packaging capacity for automotive CIS
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...
Tuesday 25 May 2021
ASE promotes embedded die packaging for automotive electronics
Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...
Wednesday 28 April 2021
PTI to further expand DRAM backend capacity
Powertech Technology (PTI) plans to further expand production capacity for standard-type DRAM memory at its Xian plant in China to better serve major clients, according to the Taiwan-based...
Friday 26 March 2021
Samsung develops HKMG-based DDR5 memory
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module based on high-K metal gate (HKMG) process technology, according to the company.
Thursday 20 August 2020
PSMC launches 3D WoW production for AI memory chips
Powerchip Semiconductor Manufacturing (PSMC), the foundry subsidiary of Powerchip Technology, has announced volume production for AI memory chips using 3D wafer-on-wafer (WoW) tech...
Tuesday 18 August 2020
Samsung announces silicon-proven 3D IC technology
Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.
Friday 3 January 2020
SJSemi strengthens presence in wafer-level 3D packaging segment
SJ Semiconductor (SJSemi), a joint venture between China-based foundry SMIC and backend house JCET, has started implementing its second-phase development looking to strengthen its...
Thursday 24 October 2019
China IC backend firms poised for strong 2020
China's top-3 IC backend houses Jiangsu Changjiang Electronics Technology (JCET), Tianshui Huatian Technology and Tongfu Microelectronics (TFME) have seen sales pick up in the second...
Monday 12 August 2019
SK Hynix develops HBM2E DRAM
SK Hynix has developed HBM2E DRAM product with what it calls the industry's highest bandwidth. The new HBM2E boasts approximately 50% higher bandwidth and 100% additional capacity...
Research Report Database
Summary of Tech Supply Chain News!
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