Etasis Electronics Corporation has announced the latest addition to the Etasis Common Redundant Power Supply (CRPS) series, the EFRP-P80A; a power supply designed for flexibly, optimal energy savings, and customizable depending on each client's need through AC/DC Etasis DualMode or Cold Redundancy.The EFRP-P80A, at 1U height with dimensions of 73.5mm (W) x 39mm (H) x 185mm (D), provides 800W output power and has a peak efficiency rate greater than 94% at 50% of total output. This power module also can operate on either 90VAC-264VAC or 192VDC-288VDC using the same universal input. Etasis has included protections for output short-circuits, overload, over-voltage, over-temperature and input under-voltage as standard features.Digitally monitoring and control can also be achieved through Power Bus Managmenet (PMBus) and can also be set to run in AC/DC Etasis DualMode which allows both AC and DC input into the same system or in Cold Redundancy - a mode which provides even more energy savings compared to conventional redundant systems.Cold RedundancyIn Cold Redundancy, energy efficiency is maximized in this "set-it-and-forget-it" feature. Each power module is able to communicate and start up or go into standby mode independently in order to achieve the highest energy efficiency. At low load, for example, it is more efficient for few power supplies to be active while the others in the system remain in standby. The unactivated power supplies will remain in standby mode or "cold" until it is optimal to do so or there is a failure of the active power supply."Our customers need simple, unique solutions", says Etasis general manager, Jim Chen. "Cold Redundancy has an ease of use that brings actual savings and energy efficiency without having to do much."Cold Redundancy creates the efficiency gain compared to traditional redundancyDuring Computex 2013, Etasis has their private showroom at the Grand Hyatt Hotel, Room 1040. For more information about the EFRP-P80A, contact marketing@etasis.com.tw to book an appointment or visit the company website http://www.etasis.com.tw/ for more details.About EtasisEtasis Electronics Corporation is a professional, switching power supply manufacturer based in New Taipei City, Taiwan since 1996. Etasis specializes in the design and manufacturing of single, redundant, mini-redundant, 1+1 redundant, N+1 redundant, flex ATX, PS2, open frame, enclosed, AC/DC and DC/DC power solutions for server rack-mount and tower form factors and special IPC cases.

Feature Integration Technology (Fintek), a leading supplier of super I/O, has launched a new series of high-performance, low-power solutions such as SIOs, uSIO, USB fast charging controller ICs, level shifter ICs (F75909/910), hardware monitor (HWM) ICs, LED driver ICs, bridge ICs (PCIE to ISA, PCIE to 4/8/12 UART) and a multi-protocol serial transceiver IC (F81438). Furthermore, Fintek also offers a high definition (HD) DTV modulator, the F18800.Unlike the traditional cable connectivity HDMI and USB, or wireless WiFi, the F18800 uses wireless digital TV modulation formats such as DVB-T, ATSC, DTBM and QAM via a vacant frequency band to stream HD video to HD digital TVs and digital signage.The Fintek super I/O implements the legacy and ErP-Lot 6.0 functions. The integrated HWM can monitor several temperatures, voltages & FANs. The uSIO - F76761 - integrates the above features and embedded 8032 uC with 1M byte flash and Intel Digital Thermal Sensor 2.0. The Fintek level shifter ICs - F75909/910 - provide the best voltage design flexibility for PC vendors. The Fintek HWM ICs are approved by the many companies worldwide and continue to be the best choice.Testing the burn in test utility with many UART ports and 3D Mark, overrun would easily occur. The F81866A, F81803 and F81216H with the 128 bytes FIFO could reduce or eliminate the overrun occurrence. For special usage, Fintek offers the bridge IC PCIE to ISA, F85526, and PCIE to 4/8/12 UART, F81504/508/512, which could be used on the board or at the express card as well. Fintek will also launch a brand new USB2.0 to 4 UART IC targeted for ARM-based platform with more UART ports requirement.Fintek also provides 8051 MCU LED lighting solutions - F66100E/F66101S - with up to 40V operating voltage, which is especially suited for the smart color temperature bulbs, special lamps and multi string decoration LEDs.USB fast charging controller ICs F75198/F75204 are all compliant with the USB charging standard such as USB Battery Charging 1.2, China YD/T 1591-2009, all Apple portable devices and Samsung Tab charging standard. Fintek launched the third generation USB charging controller product with better compatibility in fourth-quarter 2012.Embracing a philosophy that emphasizes continuous improvements and commitment to provide the best products/services to the customer, Fintek will develop and provide a variety of creative solutions to meet the market demand for multiple applications.Fintek solutionsPlease contact: marketing@fintek.com.tw or 886-3-5600168; or visit http://www.fintek.com.tw/

According to "Cisco Global Cloud Index: Forecast and Methodology, 2011-2016," the amount of traffic crossing the Internet traffic and IP WAN networks is projected to reach 1.3 zettabytes per year in 2016; the amount of data center traffic is already 1.8 zettabytes per year, and by 2016 will nearly quadruple to reach 6.6 zettabytes per year. The impact of cloud computing on data center traffic is clear. To successfully support a range of application types is a central requirement of data center architectures. Following are some of the key requirements: - Performance - Scalability - Accessibility - Agility - Availability and Continuity At Computex 2013, Aewin is showcasing two high-end network platforms for carrier data centers - the SCB-9651 and SCB-9650. The newest Aewin network solutions for cloud data centers adopt a quad-core Intel Sandy/Ivy Bridge Xeon E5-4600 series processer, the C604 PCH for SCB-9651 and a dual-core Intel Sandy/Ivy Bridge Xeon E5-2600 processer for SCB-9650. All components of SCB-9651 and SCB-9650 are easily removable for replacements and maintenance services. The SCB-9651 is a 4U rack mount design and maximum throughput is 320Gbps. The SCB-9650 is a 2U rack mount design and maximum throughput is 160Gbps. Both SCB-9651 and SCB-9650 support Intel DPDK (data plane development kit) function, IPMI (intelligent power management interface), redundancy power supply and hot swappable smart fan. Aewin's SCB-9651 Aewin's Comuptex 2013 booth is at No. L1305a, 4th floor, Nan Gang Exhibition Center. Company website: http://www.aewin.com.tw/Address: 9F, No.133, Section 2, Datong Rd., Xizhi Dist., New Taipei City, TaiwanTel: +886-2-8692-6677Fax: +886-2-8692-6655Email: info@aewin.com.tw

Marching into its 33rd year, COMPUTEX TAIPEI 2013 is kicking off on June 4. The world-renowned ICT manufacturer MSI hold a press conference on June 3 at TICC Conference Room 102. MSI will invite Intel Corp. Vice President of Sales Marketing Group Steven J. Dallman, General Manager of GeForce of NVIDIA Scott Herkelman, professional and overclocking enthusiasts and gaming contestants to talk about how MSI GAMING series products surprised and satisfied them.New Products, New Positioning and New Image are the main concepts to take on for MSI's comprehensive product lines. MSI pinpoints the key product from a range of motherboards, graphics cards, notebooks and All-in-One PCs and identifies its precise niche sharable with other products. These products are categorized by characteristics into OC, GAMING and Classic. Bright colors and a clear identification system have been applied to the products, packing/promotional materials and media marketing. At this perfect timing for Intel's new platform launch, MSI is turning over a new leaf with brand-new product planning, demonstrating its concerns and efforts for mid-range and high-end markets.The BC Golden Award winner Z87-GD65 GAMING motherboard features the latest Killer E2205 Game Networking to ensure smooth game traffic and raise odds of winning for online gaming as well as the Z8 7XPOWER and Z87 MPOWER series motherboards, born for extreme overclocking. The flagship GTX 770 GAMING graphics card accommodates the high-end GeForce GTX 770 GPU, the proprietary Gaming App tuning utility and the advanced Twin Frozr IV cooling system, making it a must-have weapon on the gaming battlefield. The high-end, ultra-light GS70 GAMING notebook totally gets rid of the bulky image of high-end notebooks. The 27-inch gaming All-in-One PC gives gamers all the indulgence in multi-touch gaming.At COMPUTEX TAIPEI 2013, MSI will be showcasing its GAMING series products at Booth L0609, 4th Floor, Nangang Exhibition Hall. Also on display are Best Choice Award winning FUNTORO HD MOD, industry-leading overclocking motherboards and graphics cards, ultra-slim notebooks, tablet, commercial All-in-One PC, gaming peripherals and server. Live narrators on site will present products in full details.Z87-GD65 GAMING, the No. 1 and only Best Choice Golden Awarded motherboardThe Z87-GD65 GAMING is the No. 1 and only Best Choice Golden Awarded motherboard. Consolidating the Killer E2205 Game Networking, the Z87-GD65 GAMING automatically prioritizes game traffic to ensure smooth gameplay even in heavily loaded networks. As for sound, the innovative Audio Boost circuitry has been designed to get the best performance out of studio-level materials, ensuring optimal audio reproduction of games. To provide the edge in speed, the OC Genie 4 one-second overclocking technology offers proprietary two-phase overclocking, giving gamers full control over the overclocking level. Featuring the red/black dragon totem, the heat sink has the best heat transfer performance ever. To wrap up, packing extreme performance, immersive audio and superb stability, the Z87-GD65 GAMING has got everything that gamers wish for and is truly gamers' top choice.GTX 770 GAMING, optimizing the cooling performanceThe GTX 770 GAMING integrates the latest NVIDIA GeForce GTX 770 GPU, 2GB GDDR5 VRAM and PCI Express Gen3 interface. MSI's proprietary Gaming APP tuning utility allows gamers to balance performance with energy-efficiency by quickly switching among gaming, eco and default modes. Airflow Control Technology and dual 10-cm fans together with patented Propeller Blade Technology provide the advanced Twin Frozr IV cooling system with the best heat dissipation ever. In full load, the GTX 770 GAMING's core temperature is as low as 68 degrees C, with a noise level as low as 35dB.GS70, high performance and portability in one packShaking off the bulky image of high-end notebooks, MSI unveils the new-generation Ultra-Gaming notebook GS70. With a stunning depth of 2.18 cm and less than 2.6 Kg weight, the GS70 features portability and high performance in one pack. It also features the proprietary Super RAID technology, Intel's fourth-gen Core i7 processor, NVIDIA GeForce GTX765M discrete graphics card as well as the professional SteelSeries gaming backlighting keyboard.AG2712A, the world's first gaming All-in-One PCThe AG2712A GAMING All-in-One PC features a 27-inch large display, capable of playing 1920 x 1080p Full HD games and videos. With integrated AMD Radeon HD 8970M discrete graphics card, the powerful Intel Core i7 3630QM quad-core processor, the anti-glare display and top-notch THX TruStudio Pro audio, the AG2712A will absolutely impress gamers with visual awe and a striking performance.COMPUTEX InfoDate: Tue. June 4th ~ Sat. June 8th, 2013Venue: 4th Floor, Nangang Exhibition Hall Booth No.: L0609GS70, high performance and portability in one packGTX 770 GAMING, optimizing the cooling performanceZ87-GD65 GAMING, the No. 1 and only Best Choice Golden Awarded motherboard

With the increasingly important role that third-party semiconductor IP (SIP) plays in advanced SoC designs, strengthening strategic partnership programs and building comprehensive ecosystems have become key competitive advantages for IP vendors to succeed in the market, so that they can provide licensees with complete solutions and help customers develop innovative products in the shortest time-to-market."Our IP fully supports a wide range of software drivers, development tools, and developer ecosystems", said Imagination Technologies, the top three SIP provider in the world. "It's an integral part of how we've built our IP solutions and also vital to Imagination's rapid growth in recent years."According to a recent report from industry analyst firm Gartner, Imagination outpaced other competitors in 2012 with a YoY revenue growth rate of 36.4%, much higher than the 17.8% of average growth rate of top ten SIP vendors.In order to respond to the escalating design challenges caused by advances of process technology and to drive continuous growth for the company, Imagination has been continuously expanding its already broad ecosystem of partners. This includes developing key partnerships with semiconductor foundries such as TSMC and GLOBALFOUNDRIES, as well as leading EDA tool vendors like Synopsys, Cadence and Mentor.Furthermore, Imagination has broadened its third party support across all of its IP core families, encompassing operating systems, EDA and tool vendors, foundries, middleware and much more.Imagination focuses on power, performance and area optimizations for its entire range of IP, including its industry-leading PowerVR GPUs, popular MIPS CPUs, and a range of other IP cores. As GPUs increasingly dominate next generation SoCs, and the options available to designers using advanced silicon processes become more complex, design flows and libraries need to be optimally tuned to enable design teams to achieve the best possible performance, power consumption and silicon area in ever more demanding timescales.To address these challenges, Imagination is working closely with TSMC to develop highly optimized reference design flows and silicon implementations using Imagination's industry-leading PowerVR Series6 GPUs combined with TSMC's advanced process technologies, including 16-nanometer (nm) FinFET process technology.This collaboration with TSMC has allowed Imagination to optimise its IP for the latest process technologies and resulted in significant PPA (power, performance, area) improvements using a range of techniques such as standard-cell library and memory macro optimisations.Imagination Technologies is a leader in mobile GPU IP market. The company has been growing its PowerVR Insider developer program since 2006. PowerVR Insider has now become the most comprehensive mobile graphics ecosystem, with over 30,000 members to date, covering anything from game developers, middleware, advanced UI design, 3D navigation and video.Foreseeing the trend that more multimedia and connectivity IP cores will be integrated into SoCs, Imagination will keep strengthening collaboration programs with its partners and further expand its SIP portfolios to be widely adopted by more consumer and networking applications. By doing so, Imagination will be able to help semiconductor licensees and OEM/ODMs to get the best benefits of using SIP and develop more differentiated products.At the upcoming 2013 Imagination Summit, which will be held on June 26 and June 28 in Hsinchu and Taipei respectively, Imagination will introduce its complete SIP solutions in detail. Imagination's key partners TSMC and MediaTek will also deliver keynote speeches. To understand the latest SoC design and technology trends, as well as have interactions with Imagination's ecosystem partners, please don't miss this great opportunity! For more information please visit: http://www.digitimes.com.tw/seminar/imagination_20130626/Imagination strengthens industry collaborations to build comprehensive ecosystem

Taipei, Taiwan, June 3, 2013 – GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards, today launched its latest 8 series range of motherboards supporting Intel 4th generation Core processors.Equipped with a range of new features and technologies including industry-leading digital power delivery, advanced network and device charging, gold plated hardware, new designed UEFI DualBIOS, GIGABYTE App Center and killer good looks, GIGABYTE 8 series motherboards are the most compelling choice for your next rig."With these new 8 series motherboards we're adding more high-end features and technologies than ever before, blurring the traditional definitions of mainstream and high-end segments to offer our customers the ultimate platform," commented Henry Kao, Vice President of GIGABYTE Motherboard Business Unit. "With great aesthetics, solid performance and more advanced features than ever before, GIGABYTE 8 series motherboards are setting the standard for excellence."GIGABYTE Ultra Durable 5 PlusGIGABYTE Ultra Durable 5 Plus debuts on GIGABYTE 8 series motherboards, with a range of features and component choices that provide record-breaking performance, cool and efficient operation and extended motherboard lifespan.Ultra CoolGIGABYTE 8 series motherboards feature new heatsink designs that offer uncompromisingly efficient cooling on key areas of the motherboard including the PWM area and chipset (PCH). With a range of heatsink designs that include both passive, active and water cooling support of the crucial PWM area, even the most aggressive and extreme configurations will be kept cool and stable.Ultra PerformanceGIGABYTE Ultra Durable 5 Plus motherboards use industry-leading PWM controllers and PowIRstage ICs from International Recifier. These components are 100% digital, offering incredible precision in delivering power to your 4th Generation Intel processor. Designed from the ground up to complement each other, these industry-leading PWM controllers and PowIRstage ICs from IR are optimized for cool and efficient operation, allowing users to get the absolute maximum performance from their next PC build.Ultra SafeGIGABYTE Ultra Durable 5 Plus motherboards feature GIGABYTE DualBIOS, an exclusive technology from GIGABYTE that protects arguably one of your PC's most crucial components, the BIOS. GIGABYTE DualBIOS means that your motherboard has both a 'Main BIOS' and a 'Backup BIOS', protecting users from BIOS failure due to virus attack, hardware malfunction, improper OC settings or power failure during the update process.Ultra USB 3.0GIGABYTE Ultra Durable 5 Plus motherboards offer more high speed connectivity than ever before, packing an incredible 10 ports per board. Each of these 10 USB 3.0 ports are also provided with a dedicated fuse, ensuring that an unexpected malfunction on one port, will affect only that port, isolating potential damage, and protecting other connected devices.Exclusive GIGABYTE 8 Series TechnologiesNew GIGABYTE UEFI DualBIOS with Dashboard ModeTake control of how your BIOS looks and feels with the new GIGABYTE UEFI DualBIOS, a fully customizable user interface that allows you to adjust overclocking and performance settings in real-time. With smooth mouse control and shortcuts for fast navigation, the new and exclusive Dashboard Mode gives users complete access to all data related to your motherboard, including CPU, graphics and memory clocks, temperatures and voltages.New GIGABYTE App CenterGIGABYTE App Center gives you easy access to a wealth of GIGABYTE apps that help you get the most from your GIGABYTE motherboard. Using a simple, unified user interface, GIGABYTE App Center allows you to launch all GIGABYTE apps installed on your system. The GIGABYTE App Center is also customizable with three attractive color schemes.The GIGABYTE App Center Includes:•EasyTune•@BIOS•EZ Setup•Live Updates•USB Blocker•On/Off Charge 2•Smart Recovery•Smart Time LockNew GIGABYTE EasyTuneA revised and updated GIGABYTE EasyTune offers a simple and easy-to-use interface that allows users to fine-tune their system settings, adjust system and memory clocks and voltages in a Windows environment with comprehensive system-related information displayed without the need to install additional software.Durable Black Solid CapacitorsGIGABYTE 8 Series motherboards integrate the absolute best quality solid state capacitors that are rated to perform at maximum efficiency for extended periods, even in extreme performance configurations. This provides peace of mind for end users who want to push their system hard, yet demand absolute reliability and stability. With ultra-low ESR no matter how high the CPU loading, these exclusive capacitors also come in customized jet black, exclusively on GIGABYTE 8 series motherboards.GIGABYTE Advanced Fan ControlGIGABYTE 8 series motherboards provide up to 9 strategically placed onboard system fan connectors, including a CPU OPT fan that can be connected to a water pump and configured for continuous full speed operation. The new GIGABYTE EasyTune app also offers comprehensive system fan controls with individual airflow settings provided by a dedicated digital controller.GIGABYTE On/Off Charge 2GIGABYTE On/Off Charge technology is revised and upgraded on GIGABYTE 8 series motherboards, with comprehensive and enhanced charging support for a broad range of devices that include those that run both iOS and Android. Users can enjoy fast AC charging over USB on mobile devices, even when the PC is turned off.High ESD Protection for USB and LANGIGABYTE 8 series motherboards raise the bar in terms of protecting your system, providing advanced electrostatic discharge (ESD) protection for both your Ethernet LAN and USB ports, both common sources of ESD-related failures. Each LAN and USB port is paired with a dedicated protection filter that can withstand high electrostatic discharges, protecting your system from common electrical surges and even direct lighting strikes.Intel Gigabit LANThe latest GIGABYTE 8 series motherboards come equipped with Intel�H Gigabit LAN networking, a popular choice with gamers that features several performance-enhancing features such advanced interrupt handling to help reduce CPU overhead and Jumbo Frame support for extra large data packets.Gaming Headphone AmplifierGIGABYTE 8 Series motherboards feature a high capacity headphone amplifier which is able to drive 600Ω loads, allowing gamers to enjoy a fuller range of dynamic sound with crisper details and less distortion when using high quality professional headphones. Featuring a wide bandwidth, low noise, high slew rate and low distortion, GIGABYE 8 series motherboards are ideal for professional audio usage and gaming enthusiasts.15µ Gold Plated CPU SocketGIGABYTE 8 Series motherboards come equipped with a 15µ gold plated CPU socket, which means that enthusiasts can enjoy absolute reliability and longevity for the CPU socket overtime, without having any concerns about corroded pins and bad contacts.Dual Thunderbolt - Fast, Flexible and Simple ConnectivityGIGABYTE 8 Series motherboards feature dual Thunderbolt connectivity, with dual Thunderbolt ports directly on the motherboard back panel I/O. Each Thunderbolt port supports maximum data transfer speeds with simultaneous bi-directional data transfer at speeds of up to 10Gbps - this means you can transfer a full HD 1080p movie in under 30 seconds.To learn more about GIGABYTE 8 Series Performance motherboards, please go to: http://www.gigabyte.com/MicroSite/334/8-series.htmlZ87X-UD5H motherboardGigabye 8 Series Ultra Durable motherboards

Global leader of graphics card and motherboard MSI announces the flagship product with NVIDIA GeForce GTX 770 graphics core, the MSI GeForce GTX 770 Lightning (P/N: N770 Lightning). MSI GeForce GTX 770 Lightning features the exclusive Unlocked Digital Power framework to fully unleash the graphics performance without the need for hardware modifications.The patented GPU Reactor is the industry's first powered backplate design that filters power supply noise and improves overclocking stability. Twin Frozr IV is an enhanced cooling design featured on the MSI GeForce GTX 770 Lightning with all new "Airflow Control technology," Dust Removal, dual PWM fan, and superpipes to reduce temperatures by 14 degrees and noise by 5.2dB compared to the reference design.MSI GeForce GTX 770 Lightning features the Gen3 military grade components certified by a third-party laboratory to conform to the MIL-STD-810G standard by passing rigorous tests for excellent overclocking stability! Furthermore, the "3x3 OC Kits" is the best tool for monitoring graphics card hardware and is highly recommended by overclocking enthusiasts. MSI GeForce GTX 770 Lightning is the industry leading product in performance, cooling, component selection, and software support. It is the only choice for professional gamers!MSI exclusive Unlocked Digital Power Framework is the golden ticket into the overclocking record booksThe HD 7970 Lightning and the GTX 680 Lightning have both broken various overclocking records with the Unlocked Digital Power framework. Continuing with tradition, the MSI GeForce GTX 770 Lightning also adopted the same framework with unlocked BIOS, digital PWM controller, and enhanced power design. All protection limits can be disabled through the unlocked BIOS by a single click of a button. Gamers can easily unleash the full performance without hardware modifications. The digital PWM controller provides a more stable and precise voltage signal with shorter response time for voltage adjustments compared to traditional analog designs. The enhanced power design doubles the power drive and further improves the overclockability of the reference design. In addition, the patented GPU Reactor is the industry's first powered backplate design that can provide higher power load to the graphics core, filter power supply noise, and improve overclocking stability. The MSI GeForce GTX 770 Lightning features the Unlocked Digital Power framework to lead gamers into the world of overclocking champions!Twin Frozr IV with enhanced cooling to balance between cooling and noiseMSI shows no compromise when designing for better cooling and performance in the products. The MSI GeForce GTX 770 Lightning features the advanced Twin Frozr IV cooling module with Dust Removal technology to run the cooling fans in reverse for 30 seconds at system boot up. Dust accumulated on the cooling module is blown out to ensure the optimum cooling capability. In addition, the advanced version features Propeller Blade technology with higher air volume, dual 10cm PWM fans, superpipe technology and nickel-plated copper base, and the exclusive Airflow Control technology for faster and better cooling performance. Compared to the reference design, the core temperature is 14 degrees lower while noise is further reduced by 5.2dB!Gen3 military grade components are the foundation of high quality and high stabilityMSI's Gen3 military grade components are certified by a third-party laboratory to conform to the MIL-STD-810G standard by passing rigorous tests for better reliability and quality. MSI GeForce GTX 770 Lightning features the CopperMOS with high performance cooling, Hi-C CAP with tantalum cores for better reliability, Golden SSC (gold-plated) for enhanced cooling, and Dark Solid CAP (nickel-plated) for reliability. The overclocked graphics card is backed by MSI's Gen3 military grade components to provide stability even under overclocked loads!Exclusive 3x3 OC Kits to monitor full hardwareThe "3x3 OC Kits" is designed for and recommended by overclocking enthusiasts in the industry. The exclusive MSI Afterburner utility can be used to control the GPU/Memory/PLL voltage levels as well as monitoring the GPU/Memory/MOSFET temperatures in real-time. Furthermore, users will be able to directly measure the GPU/Memory/PLL voltages with a multimeter on the V-Check Points. In the world of extreme overclocking, the ability to instantly tweak the graphics card guarantees an advantage over the competitors.MSI GeForce GTX 770 Lightning

Shuttle Inc., the industry-leading designer and manufacturer of high-performance small form factor (SFF) PC and ODM Notebook solutions, has dedicated much effort into developing and providing educational tablet turnkey solution since 2011, announced it won together with SVOA a government bid to supply 5000 classrooms of EDUPAL software platform and tablet to elementary and Junior high school in Thailand.Shuttle said it had worked for three years to develop and optimize its EDUPAL education solution, not only in tablet hardware, also the software platform design and development. "Generally, the governments' education software tenders mostly dominated by international companies. Shuttle won this tender that proved we strong capabilities in software design and integration." Jerry Yang, the Vice President of Shuttle Education Product Dept. said. "Thanks to our local partner SVOA put a lot of efforts on this project and greatly support to Shuttle." Currently, Shuttle proactively takes participation in development of education in China and Emerging Market; not only planning several field trial project in Xinjiang, Liaoning, and other places, also actively expand the education opportunities for Latin American.

Smartphone sales have grown tremendously in the past few years. According to Digitimes Research, global smartphone shipment reached a total of nearly 700 million in 2012, and is estimated to grow roughly 43% to reach 1 billion in 2013 and 1.6 billion in 2017. Chilisin's early entry into the smartphone market in 2011 contributed to its outstanding performance in recent years, with total sales almost doubling in the past four years.As smartphone demand continues to grow, its functions and capabilities continue to evolve. In light of the lightness and thinness trend in focus, demand for small yet high-performing components continues to grow. As one of the largest inductor manufacturers in the Greater China region, Chilisin has four types of manufacturing technology that enable it to quickly respond to the smartphone development trend.Contrary to the miniaturization trend at the end of the feature phone era, recent trends have seen the rise of thinner and lighter smartphones with bigger screens. Within the past year, smartphone makers have been releasing new models that feature up to 4.7-, 5-, and 5.5- inch screens that are increasingly lighter-weight. Larger panel size requires larger battery, which shrinks the PCB (printed-circuit board) surface area. As such, even though smartphone device as a whole is increasing in size, the available space for smartphone components is shrinking. Through its production technologies, Chilisin has been able to develop miniaturized yet high-performing power inductors ideal for the changing smartphone demand. Notably, Chilisin's molded metal-alloy miniature high-current power inductor (AME and MHCD Series), developed using advanced wiring and powder material, is able to support ultra-high current in low profile. Perhaps even better in characteristics, the epoxy resin glue wire-wound power inductor (LVM Series) is also becoming the dominant choice for high-efficiency smartphones and hand-held devices.As panel dimensions increase, so does the need for HD (high definition) features. In recent years, MIPI (Mobile Industry Processor Interface) interface has become widely adopted for use in panels and camera modules as demand for smartphone continues to rise. Through both the multi-layer and thin-film technology, Chilisin will be introducing a new type of common mode filter to support standard MIPI interfaces. The newly developed common mode filter (CMF0806 Series) is able to achieve much smaller dimensions compared to traditional wire-wound products.Another defining feature of the new smartphone generation is the rise of 4G and LTE networks. Aside from high quality imaging, high network speed has become one of the most important features for smartphone users. Ultra-high-speed networks require highly accurate RF signal processing capabilities. In 2012, Chilisin successfully developed the high-precision thin-film chip inductor (TFL0603 Series) for use in high-performing smartphones. Produced through photolithography, a process used in the micro-fabrication of semiconductors, thin-film inductors are superior to multilayer inductors in size and accuracy. At one-fifth in circuit diameter of multilayer inductors, thin-film inductors can achieve characteristics with tighter tolerance levels to support next-generation high-speed networks.On a global scale, the smartphone market is a spotlight topic for both consumers and producers. In light of the rising thinness, lightness, big-screen and high-efficiency trend, Chilisin has been quick to develop a set of miniaturized and high-performing products ideal for smartphones and hand-held devices. In an ever-changing landscape of electronic devices, the ability to realize and quickly adapt to rising trends becomes both a competitive advantage and a key to survival.

Taipei, Taiwan - May 27th, 2013 - In pursuit of a sustained business direction: "To be a supplier of a full range of Green power supply solutions", FSP Group -- the Global leader in the provision of power supplies -- has launched scores of power supply products this year that are based on "energy saving and environmental protection". The very wide range includes power supplies for PCs and IPCs and for medical instruments; LED power supplies; power supplies for cloud applications; UPS; power banks and energy storage systems. The power supply products and innovative energy storage system unveiled by FSP this year will turn your stereotyped ideas of conventional power supplies upside down. See below for outlines of some of these products and visit us at Booth I0417a, Floor 1, Taipei World Trade Center Nangang Exhibition Hall.PC power supplies:FSP Group is to reveal its latest innovative "Digital Power Supply" during the coming trade show. This innovative power supply allows users to monitor the instant load status of the 3.3V/5V/12V through a software interface to ensure optimized operation conditions by controlling the temperature within the computer casing or even the fan speed. By applying FSP Group's patent MIA ICTM chip set in Intel's 4th generation Core i series "Haswell" platform, you will learn that its zero current startup (ZCS) function oriented chip design not only complies with the "Haswell" processor demand for 0.05 amp, but also an incredible zero amp current! Choosing an FSP Group power supply will help you maintain your leading position in host computer applications and also ensure your peace of mind during platform migration!Adapter products:FSP Group has also unveiled a full range of Adapters featuring DOE level VI and ErP Lot 6 energy saving specifications compliance and high efficiency as well as the ability to operate at an elevation of 5,000M for military and special use. Besides, the Twinkle 65, FSP Group's brand adapter, is now the most compact and light-weight 65W notebook charger in the world. With various exchangeable socket connectors and 8 types of notebook plugs, you can use it in 157 different countries and districts in the world for almost every leading brand of notebook. Compared with other brands of notebook chargers on the market, the Twinkle 65 is 50% smaller and lighter (weighs as little as 100g). The Twinkle 65 completely outperforms competing products of the same wattage with its small size, light weight, and up to 91% power conversion efficiency.Cloud application solutions:FSP Group has launched a range of industrial power supplies to meet the demands of the cloud market. The 80+ Platinum IPC power supply with PMBus v 1.2 digital power communication protocol that you can see at our booth at the Computex trade show features up to 1400W output power and 30.8 Watt/in3 power density. An advanced power supply rarely found in the market today.LED power supplies:In addition to last year's 1-to-2 wireless control power supply, FSP Group has launched the 1-to-5 this year. Using an app downloaded through your smart device or a conventional remote control, you can control lighting with Zigbee, Bluetooth, or Infrared for much improved convenience. The FSP LED power supply comes with embedded sensors featuring several patented technologies and is poised to bring a whole new lifestyle to the modern consumer.Energy storage system:FSP Group is moving towards integrated power supply and energy storage equipment and is expected to unveil its first backup power system at this year's Taipei Computex. With dimensions similar to a conventional piece of luggage this large capacity mobile power supply provides up to 3.4kWh of power for your home appliances during a grid power outage. With an external solar panel it can convert sunlight into electricity at an efficiency rate of above 90% using an embedded PV charger. This is a really green and most advanced environmentally friendly power solution indeed!FSP Group will be showing its latest power supply products at 2013 Computex Taipei from June 4 to 8. Please visit our booth and take part in the daily computer game race. In addition to a gift for joining the game each day's champion winner will receive an FSP AURUM 92+ Platinum power supply. In addition, you can get the beautiful one gimmick during the trade show by joining our Facebook program. Just take a portrait shot at our booth, with the FSP logo, upload to our fans' page at https://www.facebook.com/FSP.Taiwan, add message ""FSP 20th & Twinkle 65" and click "Like". Available gimmicks are limited so you better hurry once the tradeshow starts. Visit our website at www.FSPLifestyle.com for details.For more product information:FSP Corporate Website: http://www.fsp-group.com/FSP Retail Product Website: http://www.fsplifestyle.com/The FSP energy storage system is stylish and mobileTwinkle 65 The top compact and light- weight 65W notebook charger worldwide