Sony has announced the upcoming release of the ECX339A OLED microdisplay featuring UXGA (1600 x 1200 resolution), the highest in class for a 0.5-type. This product achieves the world's smallest pixel pitch of 6.3-micron by leveraging Sony's OLED display technology and miniaturization technology, enabling a resolution 1.6x higher than the previous model.By employing a new drive circuit design that operates on half the voltage of the previous model, the new product achieves the same level of low-power operation as its predecessor but with much higher resolution. When paired with Sony's original driving system, a frame rate up to 240fps is supported - double that of previous product, the vendor said.Enhancing the resolution on microdisplays has traditionally presented problems such as deteriorating image quality due to decreased pixel pitch and inferior viewing angle properties. The new product features optimized transistors layout and process to address uneven characteristics and loss of withstand voltage, the issues associated with transistor miniaturization. The Sony original variation compensation circuit also enhances picture quality. Additionally, the color filter is deposited directly on the silicon substrate, reducing its distance from the light emitting layer, and the filter's color array has been modified. This helps to secure the viewing angle properties while achieving high resolution.OLED Microdisplays are widely used in digital camera electronic viewfinders (EVF) for their superior high contrast, high color gamut, and high-speed responsiveness. Sony, having achieved this high resolution and high frame rate, now offers even more realistic image display and accurate capture of subjects for use in high-end cameras that demand extremely high image quality.Going forward, Sony expects this high-definition OLED microdisplay to be employed in a diverse range of fields and applications such as AR (augmented reality) and VR (virtual reality) head-mounted displays.Sony 0.5-type OLED microdisplay ECX339APhoto: CompanySony 0.5-type OLED microdisplay ECX339A: Key specificationsItemDescriptionNameECX339ADisplay Size0.5 type (12.6mm diagonal length)ResolutionUXGA�]1600×RGB×1200�^Pixel pitch6.3-micronMax frame rate120 fps (progressive) / 240 fps (dual-line progressive)Power consumption (200cd/m2)310 mW @ 60 fps (progressive) / 120 fps (dual-line progressive)Video interfaceLVDS/Sub-LVDSMax. luminance1,000cd/m2Contrast100,000:1 or higherColor gamut (u'v')sRGB ratio: 110%Source: Company

APD Group (APD) will participate in Computex 2018 on June 5th (booth no.I0230). It has long been dedicated to the R&D, and manufacturing of power supplies. During the exhibition, APD will demonstrate diverse power supplies product lines such as networking power, consumer electronic power, medical power, customized power solution as well as related technical achievement. It will also set up a "Power-up charging free trial zone" in its booth, so visitors can experience the diversity and superiority of APD products.Highly customized service is APD's biggest competitive advantage in the market"APD has customers from various fields like networking, consumer electronic and medical, and we have tremendous experience in cooperating with world-famous global brands. On the other hand, our highly customized service is based on client system application, which can satisfy the diversified and high-quality demand of customers from various fields, thus we've earned unanimous accolade from our clients. This distinguishes us from other manufacturers of power supplies, and it is the biggest advantage that we're proud of," said Tsai Chia-Ming, general manager of APD Group.Small size, high power, high accreditation standardIn recent years, the global telecommunication industry is highly developed, and APD's power supplies product lines has already gained a large market share in global network communication devices. It can have this excellent performance thanks to three features of APD's power supplies: small size, high power density, highly customized.All APD product lines have superior power density. When comparing by design, the new generation of power supplies is 10~30% smaller in its volume than the previous one. APD assists its customers in achieving more diversified and competitive product design.On the product reliability, the surge capability can be upgraded to 6KV in all APD products, and ESD capability meets the high-level standard of 15KV/8KV in the market.On the safety requirement, all APD products conform to the latest EU COC Tier 2 in power efficiency and ISO 13485 medical devices quality management systems standards as well as IEC 60601medical safety requirement certification. The accreditation proves that APD adheres to the strict demand of high quality, highly stable and high safety requirement standards, which helps it become the long-time strategic partner of many global pharmaceutical companies.Laboratories with the highest safety requirement in the fieldAPD has laboratories with the highest UL safety requirement and Electromagnetic Compatibility (EMC) laboratories. With its excellent R&D team and technological know-how acquired over several years, it has managed to meet the latest industry standards of IEC/EN/UL 62368, IEC/EN/UL60950-1 and IEC/EN/UL 60065, and therefore it can help customers to distribute their products to the global market.Ongoing innovation in technology and the leader in power electronicsIn the last 20 years, APD has always invested enormous amount of resources in R&D activities, and the number of R&D personnel accounts for 17% of all our employees, which is rarely seen in this industry. APD hopes that we'll continue to develop products with competitive advantage with our customers through the increasing technological know-how.For more information, please visit the official company website: http://www.apd.com.tw/en/APD's customized power supplies product lines

United Microelectronics Corporation (UMC), a leading global semiconductor foundry, recently held its 2018 China Technology Forum at Jumeirah Himalayas Hotel Shanghai in Shanghai, China. UMC detailed its foundry solutions that drive the company's "IC 2.0," or Intelligently Connected theme, including its specialized technologies, IP, and strong China manufacturing presence to serve China customers designing chips for AI, 5G, IoT and automotive applications.UMC's co-president SC Chien delivered the keynote address to over 200 customers and supply chain partners from China's semiconductor industry.Chien said, "The Intelligently Connected era, which we call IC 2.0, will open up a new realm of possibilities with regard to new chips in 5G, AI, IoT, and automotive being introduced into our everyday lives. UMC will help Chinese design houses take early advantage of these high growth opportunities, as we have leveraged our decades of world-class semiconductor manufacturing experience with custom engineered foundry solutions specifically directed at Intelligent Connectivity to become the best foundry choice for chip designers."UMC's China manufacturing base consists of HeJian, a high capacity 8-inch fab in Suzhou, and Fax 12X, an advanced 12-inch fab located in Xiamen that is in high yield volume production for technologies including 40nm and 28nm High-K/Metal-Gate. The company also operates United Design Service in Shandong, which offers turnkey design service to China customers.UMC can be found on the web at http://www.umc.com.

G.SKILL International will be hosting two major extreme overclocking events - the 7th Annual OC World Record Stage 2018 and the 5th Annual OC World Cup 2018 - and the first ever G.SKILL Extreme Mod Stage 2018, where six modded systems built with the latest G.SKILL hardware will be showcased, at the G.SKILL booth during Computex 2018. These three events will be held throughout Computex week at the G.SKILL booth in the Nangang Exhibition Hall, 1F, Booth J0806.7th Annual OC World Record Stage 2018The OC World Record Stage is one of the biggest annual overclocking events in the extreme overclocking community, gathering 14 professional overclockers from around the globe to break as many benchmark records as possible. Featuring the latest Intel platforms, Samsung memory components, G.SKILL memory modules, and performance motherboards from major vendors such as MSI, ASUS, EVGA and ASRock, the extreme limits of hardware performance will be put to the test under a generous dose of liquid nitrogen cooling.5th Annual OC World Cup 2018 - US$20,000 Prize PoolThis year, G.SKILL is increasing the OC World Cup 2018 competition prize pool to US$20,000, where US$10,000 would be awarded to the overclocking champion of the competition. The OC World Cup 2018 competition will feature the latest high-end hardware from Intel, Samsung, and G.SKILL. After an intense online qualifier round that ended in April, six overclockers from around the world will be competing live on the G.SKILL stage to demonstrate their overclocking skills during Computex week. The contenders are rsannino from Italy, Lau Kin Lam from Hong Kong, Dancop from Germany, Alex@ro from Romania, Lucky_n00b from Indonesia, and rtsurfer from the US.G.SKILL Extreme Mod Stage 2018A new addition to the G.SKILL booth is the Extreme Mod Stage, where six custom PC system mods will be on display, showcasing the creativity and works of art from professional modders. System mods breaks away from the traditional bland computer-in-a-metal-case and shows off the carefully chosen hardware in a unique themed build, so a high performance system can also look amazing while it's crunching away at a workload or running a game.OC World Record Stage 2018

With AI electric vehicles and advanced driver assistance systems (ADAS) becoming new favorites of the technology world, obtaining AEC-Q100 (for IC) and ISO 16750 (for module) certifications is the entry ticket for consumer electronics suppliers trying to step into the automotive industry. However, which standard should be employed for automotive tests by manufacturers of complex multichips like MCM and SIP? Problems that baffled IC design houses and tier-1 automotive module manufacturers for a long time could be solved with an official answer - the AEC-Q104 recently released by the Automotive Electronics Council (AEC).Compared with AEC-Q100, AEC-Q104 is not only the first automotive industry specification to define Board Level Reliability Test (BLR), but also explicitly states the basic concepts, testing methods and items, ESD specifications and the quantity of test samples, said Allan Tseng, director of reliability engineering division of iST.For the basic concepts of AEC-Q104, if the components within MCM products have not passed the AEC-Q100, 101 or 200 tests, the verification items must be chosen from 49 items out of the eight categories based on product application. This, in turn, suggests more verification items would be required.For BLR test items, although AEC-Q104 covers only Temperature Cycle Test (TCT), Drop Test, Low Temperature Storage Life (LTSL) and Start up & Temperature Steps (STEP), etc., AEC-Q104 is treated as a big step in BLR standard, Tseng added.Soon after the AEC-Q104 specification was released, iST has received relevant inquiries from many international customers. However, to establish a foothold in the automotive supply chain, one must comply with the custom specifications of individual car makers.Allan Tseng, director of reliability engineering division of iST

A total of 388 startups from 21 countries will participate in InnoVEX during Computex 2018, according to the organizers.In addition to the existing elements of "Display," "Demo," "Pitch" and "Forum," two more sessions - "Workshop" and "Startup Tour" - will be added to InnoVEX to bring more momentum from local and global startups, the organizers said."According to Global Startup Ecosystem Report 2018, global venture capital investment in startups hit a decade high in 2017 with over US$140 billion invested in startups. To achieve and build the vision of a smart ecosystem for startups, Computex incorporates 'Innovations & Startups' into its themes this year. We integrate highly resilient elements and forms into the exhibition, creating a dynamic arena for their innovations," said Walter Yeh, president and CEO of TAITRA - one of the organizers of the annual tradeshow.DisplayThe number of country pavilions will be four times higher than last year, with a total of 13 countries - including Belgium, Canada, EU, France, Japan, Korea, Malaysia, Mexico, the Netherlands, the Philippines, Poland, Singapore and Spain. One-third of the startup exhibitors from abroad are AI related, including CTA (Poland), H3O (Hong Kong), Incubit (Japan), Talentum (Spain), Silexica (Germany) and westwell lab (China).Other exhibitors include Taiwan's Garage+, CDIB Capital Innovation Accelerator, the Hong Kong-based Zeroth.AI, and MaGIC from Malaysia. World-renowned accelerators and startups, such as Alibaba's Bitmark and Health25ync, Amazon, CCIA, Deloitte, Fenox Venture Capital, Intel, JAFCO, Telefónica, WI Harper Group and Zhongguancun, will also show up to look for investment targets as the event seeks to facilitate circulation of resources for globalization.DemoFrench and Polish startups will present demonstrations on June 6. On the same day (from 11:00 am - 12:00 noon), world-renowned accelerators and startups like Audi, Amazon Launchpad and Samsung NEXT will share their global initiatives and cross-industry matching strategies at the Taipei World Trade Center Hall 3. With the goal to connect solutions and services for the very early stage of startup operation to commercialization, these demos can strengthen the startup community's potential and create a win-win situation.ForumThis year's InnoVEX forum and keynote speeches will be closely linked to industry trends. With themes focusing on AI, IoT, blockchain, women entrepreneurship, global startup ecosystems, and cross-industry application such as digital streaming connecting with audio and video entertainment showcasing the diversity and human development in the startup community.PitchThe semi-final and final of InnoVEX Pitch Contest 2018 will take place on June 7 and 8, respectively. With cash prizes totaling US$350,000, the contest aims to integrate efforts of Computex and the private sector in building an international battlefield for unicorn companies and incubating new stars for the industry.WorkshopThis newly added session will take place on the evening of June 7, where startup ecosystems in Catalonia, France, Korea, Malaysia, Murcia, and Poland will be introduced with an aim to facilitate collaboration among international teams, helping local startups better confront challenges in the industry as well as connecting to global resources like markets, talents, technologies, systems and laws. It also aims to introduce global niches and policymaking process to local startups and to enable multinational collaboration more innovately at the same time.Meanwhile, SparkAmplify, one of the startup exhibitors from the US, will work with organizers and apply its AI-enabled big data core technology to find a new way for startups to solve higher marketing cost in the early stage of operation. A workshop on precision marketing will also be held before the exhibition, so startups can exchange experience and learn how they can complement each other in the community.Startup TourInternational exhibitors of InnoVEX are welcome to sign up for a June 9 tour to well-known local accelerators such as CDIB, Garage+ and Taiwan Tech Arena, said the organizers. In partnership with the Taiwan Rapid Innovation Prototyping League for Entrepreneurs (TRIPLE), organizers will bring participants to key manufacturers at the Hsinchu Science Park and National Tsing Hua University's Center of Innovative Incubator where global startups can share their experience and feel the energy of local startups.In addition to a series of InnoVEX activities at the Taipei World Trade Center Hall 3 from June 6 to 8, Garage+ and Audi will also host events and demos at the Taipei Nangang Exhibition Center and the Taipei International Conference Center, respectively.Computex 2018 to focus on global innovations as InnoVEX features six highlightsPhoto: Organizers

High-performance computing (HPC) has been the new trend in our recent times. The applications for HPC ranging from big data, IOT, AI, deep learning and blockchains, require advanced computer hardware to perform their intended functions. From time to time, the performance of HPC has been limited by data storage hardware due to its slow transfer speed, which caps the I/O intensive requirements for these applications. Evolution of data storage from mechanical hard drives to NVMe (non-volatile memory express) SSDs has eventually unleashed the next level of High-performance computing and its applications.It's clear that installing NVMe U.2 drives requires not only a whole system upgrade but also a system that allows for easy maintenance. To enable hot-swap functions on NVMe U.2 SSDs and find the proper equipment in a computer or rackmount system becomes a new challenge for many companies, as the current computer chassis are not optimized for NVMe U.2 SSDs. With more than 20 years of expertise, ICY DOCK, who specializes in enterprise data storage enclosure, has already implemented this drastic change in data storage technology and created the world first NVMe removable drive enclosure, the ToughArmor NVMe series. The ToughArmor drive enclosure's removable drive caddy allows for easy NVMe drive installation and system maintenance for any companies who wish to utilize the benefits of using the next-generation NVMe U.2 SSDs.With the presence of ICY DOCK's ToughArmor NVMe series, it has shed light on the current NVMe SSD market. ICY DOCK has introduced the one of a kind NVMe U.2 SSD mobile rack that fits in either external 3.5" floppy bay or 5.25 DVD bay. The ToughArmor MB601VK-B NVMe U.2 SSD mobile rack is compatible with any standard external 3.5" bay and supports 1x 2.5" NVMe U.2 / SAS / SATA SSD up to 15mm height. This ultra-low profile design is perfect for small-form-factor (SFF) systems such as in-vehicle DVR, Rugged Compact PC, Box PC or Portable Workstation. If one drive is not enough, the ICY DOCK ToughArmor MB699VP-B can accommodate up to 4x 15mm 2.5" NVMe U.2 SSD in a single 5.25" bay, provides both performance and space-saving functions. The ToughArmor NVMe series can perform up to 32Gbps of transfer speed with no speed reduction comparing to a directly connected NVMe U.2 drive. It offers hot-swap capabilities for the utmost convenience while performing various applications such as allowing high I/O speeds for the real-time server, providing large and fast data storage solution for 4K/8K video post-production, utilizing its fast accessing speed for the newer generation of artificial intelligence and more.Asides from the ToughArmor NVMe series, ICY DOCK's ToughArmor series also include rugged SATA/SAS SSD mobile racks with 1x 2.5" drive (MB991SK-B), 2x 2.5" drive (MB992SK-B), 3x 2.5" drive (MB993SK-B), 4x 2.5" drive (MB994SP series), 6x 2.5" drive (MB996SP-6SB), 8x 2.5" drive (MB998SP-B), 16x 2.5" drive (MB516SP-B) and more. ICY DOCK's data storage device kits allow customers to leverage their business, to fits various data storage configurations per different applications with minimum cost. All of the ToughArmor series products are made with a full metal structure from inside out and suitable for industrial, medical, and military applications. Designed with the highest quality and provided with a 3-year warranty, ICY DOCK enclosures are built to ensure that your drives are free from any environmental dangers and guarantees that your data is safe and sound.From the era of IDE mechanical hard drives to NVMe SSD drives, ICY DOCK kept its innovation at peak level, making sure ICY DOCK products can be utilized by individuals and companies to facilitate their workflow and increase productivity. With long product life-cycles, worldwide branch locations and professionally trained customer support teams, ultimately ICY DOCK is the number one go-to brand for many first tier companies such as HP, GE, Samsung, and Google who wishes to have a highly customized, stable, and quality assured product!For more information about ICY DOCK, please visit http://www.icydock.com.tw/eng/index.phpIcy Dock ToughArmor series

Seco will take part in Computex Taipei 2018, the most significant B2B tech show in the whole of Asia as well as the leading global ICT and IoT-centric event with a complete supply chain and ecosystem.The event is organized by the Taiwan External Trade Development Council (TAITRA) together with the Taipei Computer Association (TCA). Each year, the event gathers tens of thousands of visitors from all over the world as well as a flourishing community of startups in the field of embedded computing, semiconductors and the Internet of Things.Seco will showcase a comprehensive range of products at Nangang Exhibition Hall 1, booth No K0102, focused around Seco's cross-platform philosophy and its modular solutions with embedded system form factor standards (Qseven, COM Express, SMARC).Among the many Qseven-based solutions to be presented, the Q7-C26 stands out as a Qseven Rel. 2.1 compliant module with the NXP i.MX 8 application processors. Characterized for its rich M2M interface for managing onboard subsystem as well as the wide connectivity it provides, this solution builds upon the ample scalability granted by the Qseven form factor and the i.MX 8 family. Finally, it distinguishes itself for its high-end multimedia capabilities and, for the cherry on top, it comes up with an integrated GPU which supports up to 2 independent displays. The RAM consists in a soldered down LPDDR4-3200 memory.Still in the realm of Qseven-based solutions, another interesting module based on the same CPU that Seco will present is the Q7-C25. Unlike the Q7-C26, it also enables multicore processing - namely, a dual or quad ARM Cortex-A53 cores general purpose Cortex-M4 processor for real-time applications, combined with a 4Kp60 HEVC decoding with HDR. Built with scalability in mind, it is suitable for contexts such as home automation and vending machines, that is, scenarios requiring advanced security, connectivity and multimedia. Like the Q7-C26 it is designed for industrial-range temperatures (-40 degree C, +85 degree C) and, same as the Q7-C26, it mounts an integrated GPU supporting up to 2 independent displays. As far as the RAM is concerned, it features up to 4GB soldered down LPDDR4-3200 memory.Speaking of SMARC modules, the SM-B71 is a SMARC Rel. 2.0 compliant module with the Xilinx Zynq Ultrascale MPSoC. Unique for its blending of the ARM and FPGA domains, it delivers a flexible ARM FPGA heterogeneous processing in a standard form factor, merging the cost-effective Dual-Core to high-performance Quad-Core ARM Cortex-A53 MPSoCs with GPU/VCU, granting therefore extreme flexibility and vast scalability as well. Finally, it presents a set of dedicated Real-Time ARM Cortex-R5 processors, together with LVDS and DP video interfaces that go up to 4K resolution, and high-speed interfaces. The module is available in the indicative temperature range of -40 degree C up to +85 degree C. In terms of graphics, it mounts an integrated ARM Mali-400 MP2 GPU. As far as the RAM is concerned, it provides up to 8GB DDR4 soldered down.As regards the COM Express solutions, the COMe-C08-BT6 is a COM Express 3.0 Basic Type 6 Module with the Intel 8th generation Core i7 / i5 / Xeon processors (formerly Coffee Lake H). Most notably, it features up to six cores with Intel Hyper-Threading Technology, with the possibility of adding 12 virtual cores, hitting in this manner a maximum of 12 threads. Thanks to the Intel Gen9 LP graphics core architecture, the module can drive up to 3 independent displays simultaneously, with a resolution of 4096x2304 @60Hz, 24bpp tops. Worth mentioning, it also embeds an H.265 / HEVC hardware transcoder which, in combination with the astonishing performance and the multiple video interfaces supported, turns the module into the epitomic platform for gaming, digital signage, HMI, and infotainment. Speaking of the graphics, it mounts an Intel Gen9 LP graphics core architecture - up to 48 execution units.Furthermore, the RAM is a DDR4 with ECC technology, up to 2666 MHz. Interestingly, Seco will also showcase a COM Express solution based on AMD technology, namely the COMe-B75-CT6, i.e. a COM Express Compact 3.0 Type 6 Module with the AMD Ryzen Embedded V1000 processors. Depending on the model that has been chosen, it embeds a maximum of 4 Zen x86 CPU cores, a next-generation technology integrated with the latest Radeon graphics and I/O controller on a single chip. It also features up to a couple of DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory, not to mention a vast array of expansion ports, PCI-Express, Serial Ports, networking and video interfaces. All things considered, it is the ideal solution for medical devices, digital signage and gaming.Last but not least, Seco will also showcase at its booth, together with its educational arm, Seco Lab, its newest creation in the domain of DIY electronics and open-source hardware: the upcoming new UDOO, a maker-oriented single-board computer combined with an Arduino-compatible platform for sensing and programming the physical world. The solution is the latest addition to the UDOO family, a set of SBCs that made a name for itself on Kickstarter and is now used by tens of thousands of users all over the world, including universities and marquee research groups such as CERN. Worth noting, the newest UDOO provides an outstanding computational power, which comes in handy for applications like Computer Vision, Virtual Reality, Augmented Reality, client-side 3D rendering and real-time analysis of big data.Seco to demonstrate new cross-platform solutions and UDOO boards at Computex 2018

Computex 2018 will include 5G for the first time as one of its six exhibition themes, in light of the disruptive possibilities of the new wireless technology, according to the organizers.In late 2017, the world's first specifications for 5G networks were released, ushering in a phase of rapid growth for the next generation of mobile communications. In addition to bigger bandwidth and faster speed, 5G also promises lower latency and a more real-time experience for message transmission.The Computex organizers quoted Gartner as indicating that Internet of Things (IoT) will be the biggest driver for 5G applications, with 20.4 billion connected things in use worldwide by 2020. As one 5G base station can connect one million end devices per square kilometer, the technology is expected to fundamentally change the industry as well as people's lives.This year, leading players will meet at Computex in early June to share insights on the latest trends of technology development as the industry witness the next generation of communications, the organizers said."Modern lifestyles are intertwined with the evolution of the communications industry. Mobile technologies are bringing people closer and constantly expanding our imagination about future technologies. When 1G was introduced in the 1980s, the technology was analog but already a game-changer. 2G went further and adopted digital signals, changing how people communicated by adding text messaging functions. When 3G opened up an era of high-speed data transfer, mobility was no longer a far-fetched idea and smartphones became popular. Both speed and volume of data transfer have improved further with the arrival of 4G networks, as users can even play online games or stream videos on their smartphones," said Walter Yeh, president and CEO of TAITRA, one of the organizers of Computex."Today, everybody is looking forward to the prospect of 5G. Unlike previous telecommunication generations, 5G is so much more than the next generation of mobile technology. It will enable far greater improvements in bandwidth, transfer rate and latency to accelerate AR/VR application adoption and support streaming of higher-resolution 4K videos. It can also be implemented in smart cities, smart homes, IoT, Internet of Vehicles (IoV), and many other applications that are beyond our imagination," said Yeh.Computex 2018 will bring together leading players in the 5G industry like Ericsson, Intel, Sigfox and Qualcomm to demonstrate compelling technologies and open a new page for the global telecom industry, according to the organizers.Ericsson's wireless access technology allows 4G and 5G services to share the same wireless transmitter and same spectrum, so as to dynamically tweak the use of radio frequency spectrum for 4G and 5G. Qualcomm will introduce new devices and technologies for applications in mobile communications, IoT and IoV, including Snapdragon X50 5G modem and 2Gbps LTE modem Snapdragon X24 LTE. Sigfox Taiwan and UnaBiz, a Singapore-based IoT-dedicated network operation, will participate in the exhibition again to promote their open platforms and create a market environment that is energetic and competitive.The 5th Taipei 5G Summit will also be held alongside Computex 2018, showing the world an era of smarter, faster IoT as participants explore issues like 5G service framework and AI applications in 5G.Computex 2018 to showcase IoT potential in 5G eraPhoto: Computex organizers

Yield Microelectronics Corporation (YMC), a Taiwan-based specialty IP provider, and MagnaChip Semiconductor Corporation, a Korea-based foundry, today announced that they have expanded their IP partnership, to include 0.13um BCD & MS multiple time programmable (MTP) non-volatile memory (NVM) intellectual property (IP). The 0.13um MS technology will make the size of memory IP become unprecedentedly small.MagnaChip and YMC had developed powerful process on 0.35um and 0.18um nodes for the past few years. Now, they are dedicated to 0.13um process suited for embedded applications such as autofocus driver, power management IC, etc. YMC will provide enhanced IP vendor services to its global customers through competitive IC designs and NVM performance targeted at next generation mobile and industrial applications.There are several primary advantages of this 0.13um mixed signal (MS) MTP solution, including outstanding read/write operating range down to 1.65V, high reliability due to great construction of dual cell and ECC design, and also the size of 1K bits IP can be 0.061 mm2. In addition, on 0.13um bipolar-CMOS-DMOS (BCD) process, YMC has 16K 32 MTP + 1K EEPROM IP with ECC design, access time can be 40ns in high speed mode. In the near future, YMC and MagnaChip will collaborate to achieve automotive class memory."The continued collaboration between MagnaChip and YMC has produced greater innovation and variety in the types of MTP solutions being offered to customers," said Daniel Huang, the YMC's president. "YMC sees its continued strategic partnership with MagnaChip as a long-term benefit to both YMC's and MagnaChip's customers.""We are delighted to continue this valuable partnership with Taiwanese IP solution leader YMC," said YJ Kim, chief executive officer of MagnaChip. "We believe our collaboration will lead to even more cost-efficient, high-functioning NVM solutions to satisfy the increasingly sophisticated needs of global foundry customers for a growing number of diverse applications."For more information about MagnaChip Semiconductor, please visit www.magnachip.com. For more information about Yield Microelectronics Corporation, please visit www.ymc.com.tw.