Upholding its commitment to enable customers' 2020 requirements and beyond, Henkel has developed a new, thicker version of its Bergquist Bond-Ply LMS-HD thermally conductive laminate material...
Fresh from SEMICON Taiwan 2018, SESTO Robotics, a leading Singapore company in the field of autonomous technology aims to make waves in the Taiwan manufacturing and semiconductor industry by bringing SESTO Automated Guided Vehicles (AGVs) and Intelligent Mobile Robots (IMRs) to the playing field.
Getac, an innovator of rugged mobile computing solutions for a range of industries, today announces updates to its leading Getac F110-Ex fully rugged tablet, designed to deliver exceptional productivity and drive the speed of digital transformation in hazardous environments.
Designers seeking to enable continuous monitoring of various health parameters can now quickly create unique, highly accurate wearable solutions using Health Sensor Platform 2.0 (HSP 2.0) from Maxim Integrated Products...
AMobile Intelligent, a joint venture by MediaTek, Arbor, and Konka Group, has achieved its design pinnacle by receiving the International Design Excellence Award (IDEA) 2018 organized by The Industrial Designers Society of America (IDSA)...
Getac has today announced the launch of the new K120 fully rugged tablet, designed to meet the challenges faced by public safety personnel around the world. The K120 builds on Getac's legacy of creating powerful, rugged devices that have helped paramedics, police officers and firefighters successfully carry out their public safety duties for many years.
United Microelectronics Corporation (NYSE:UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that Dow Jones Sustainability Index (DJSI) has selected UMC as a global component for the 11th consecutive year.
OpenStack Day Taiwan 2018 - a major annual event for the Taiwan open source community - took on a whole new look with OpenStack renamed OpenInfra. Carrying on with the same OpenStack spirit and architecture, OpenInfra will engage more partners specializing in open source technologies and continue to flourish in the world of cloud computing.
The emergence and convergence of AI, IoT, cloud, and autonomous driving technologies have brought tremendous opportunities to the semiconductor industry. However, as the process technology moves towards 7nm/5nm nodes, heterogeneous integration, and 3D structures, there are many challenges in the industry to be resolved.
