Clientron Corp, a global leading provider of POS, thin client and embedded systems, will proudly showcase its latest POS innovation at GITEX Technology Week 2019, the biggest tech show in the Middle East, North Africa & South Asia, from 6 - 10 October 2019 in Dubai. Clientron booth is located at H1-E22, Hall 1, Dubai International Trade Centre.Demonstrating its leading POS innovation and rich product portfolio, Clientron will introduce its multi-functional POS and Self-service Kiosk solutions including the top-of-the-line 15"/15.6" touch POS terminal with powerful Intel 7th Core i processors, the fully-integrated POS with built-in high speed thermal printer, the 32"/ 22" self-service Kiosk with 500 nits high brightness touch display, as well as various POS peripherals for smart retail and hospitality applications.Clientron booth's highlights include:PT2600: Fanless & ultra-slim POS Terminal with powerful platformFeaturing 15.6" multi-touch display, the PT2600 POS Terminal is equipped with powerful and efficient 7th Gen. Intel Core i processors for optimized operation and energy saving. With stylish and state-of-art design, the PT2600 provides various peripherals options including VFD & 10" customer display, 2D barcode scanner, MSR, iButton, and WiFi for retail businesses where space is at premium.PST750: Multi-functional POS Terminal with Built-in Thermal PrinterRunning on high performance Intel Core i processors, the innovative PST750 all-in-one POS terminal features flexible mechanism design, supporting a number of well-known printer brands, such as: Seiko and Epson. The PST series feature printer foot stand with lightweight design, saving counter space, especially suitable for catering services and more smart retail applications.PSL540: Low-profile POS Terminal with Built-in Compact Thermal PrinterWith full functions and streamline design, the PSL540 POS integrated thermal printer and POS peripherals with a compact and low-profile enclosure for small stores and price checking machines.32" & 22" Self-Service KioskThe interactive Self-service Kiosk, featuring 32" or 22" high-brightness touch displays and ultra-slim enclosure, supports a variety of payment solutions to complete transactions, and peripherals including NFC & credit card reader, barcode scanner and receipt printer for self-ordering Kiosk applications. Design with flexible I/O expansion, it can provide customized services according to demands.Additional Clientron's lineup includes: Clientron will display the most affordable POS terminal- PT2000, featuring streamline design and offered in a fanless system with long life span for both entry and mainstream POS market segments; the top-of-the-line POS terminal Ares755 & PT2500 with powerful Intel 7th Core i processors for high-performance and flexible extension options. In addition, Clientron provides different types of foot stand line-up selections to meet customers' needs and enhance users' experience. Moreover, many of the extended portfolios of integrated POS peripherals will also be exhibited in this event.For more information about Clientron or its products, please visit us at booth H1-E22, hall 1, GITEX 2019, or visit Clientron's website: www.clientron.com.Clientron to introduce its latest POS and Self-service Kiosk at GITEX 2019

Amiccom Electronics Corporation (Amiccom) announced a new generation of ultra-low-receiving current sub-GHz RF transceiver, named A7169. Inherited the low-current RF architecture developed by Amiccom, the A7169 has the same excellent features, programmable RF output power with maximum output up to 20dBm; FSK sensitivity@2kbps is -118dBm with receiving current of 3.2 mA.For A7169, the maximum data rate is raised from 250kbps to 500kbps to fulfill the demand of various high speed applications. The A7169 supports unlicensed ISM band applications below 1GHz (150MHz ~ 950MHz). The MCU can control the A7169's RF state through the SPI interface and access the content of built-in 64 bytes TXFIFO and RXFIFO.In addition to long-distance transmission capability, the built-in RSSI of A7169 can help user to detect clean transmission channels. The Auto Calibration mechanism is used to overcome the variation of semiconductor process. The function of automatic frequency compensation (AFC) can solve RF frequency variation coming from crystal frequency drift. In addition, the A7169's new optimized demodulator circuit can manipulate the received data with data rate error up to -/+ 12% while still maintain good RX sensitivity. It can work stably in various environments and suitable for the application like wireless M-bus and Tire Pressure Detection System (TPMS).Package of A7169 is QFN 3x3 16pin. Compared with the previous IC families, it has smaller size and fewer pins. This saves board space and greatly reduces bill of material (BOM), which effectively lowers system development complexity and costs. The applications for the A7169 include long-distance two-way car alarm, industrial control, intelligent building energy management, home automation and so on. Overall, the A7169 is a high-performance, low-power RF chip with built-in features that can extend battery life and provide customers with fast/convenient/low-cost wireless solutions.

TPCA Show 2019 will take place October 23 to October 25, 2019 at the Taipei Nangang Exhibition Center Hall 1 (TaiNEX 1). Themed on "5G Next," this year's exhibition will focus on the tight relationship between the PCB industry and 5G development. More than 400 PCB supply chain makers from home and abroad will display their products at over 1,400 booths on the show floor.The exhibits at TPCA Show 2019 are categorized into 13 PCB technical field, including AP, SAP, mSAP, SMT, INFO, Heavy Copper, Fine Line, Microvia, Smart Automation System/Standard, High-frequency and High-speed PCB Materials, HLC, Aspect Ratio and other PCB process solutions. TPCA Show 2019 not only serves as a platform for upstream and downstream PCB manufacturers to share experiences and exchange views but also aims to help PCB manufacturers enhance their abilities to integrate technologies and unshackle from traditions.IMPACT-IAAC 2019 Conference, organized by IEEE EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, will be held in conjunction with TPCA Show 2019. The symposium aims to become the world's most professional and iconic event for the electronics packaging and PCB sectors. Multiple sessions of enlightening forums are arranged at the symposium, in addition to product launches scheduled on each day of the three-day event to offer a glimpse at 5G product materials and technology trends. Chang-Ming Li, chairman of TPCA, will kick off the three-day event with a welcome session at the 2019 PCB Industry Summit. The PCB Smart Manufacturing Forum will approach Industry 3.5 implementations for the PCB industry from the perspectives of Flexible Printed Circuit (FPC) manufacturers and equipment providers. As part of TPCA's efforts toward promoting industry safety standards in recent years, the PCB Safety Standard Verification Startup Session and Safety Seminar will shed light on verification mechanisms according to the standards. Experts in the industry are invited to join the efforts to build safe work environments. On October 25, National Chung Hsing University will host a forum engaging industry, academia and research specialists to propose solutions aimed at the latest metallization process technologies and trends. The event presents a rare opportunity for attendees to take part in a myriad of eye-opening forums. Otherwise, what is also new service at TPCA Show 2019 is that the show floor plans are available online, in addition to print versions, for visitors to conveniently search for the products or technologies they are looking for.Advanced registrations are available now at www.tpcashow.com.

United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today announced that Dow Jones Sustainability Index (DJSI) has selected UMC as a global component for the 12th consecutive year. UMC earned DJSI's highest scores for the foundry industry in the "Environmental" category, with several items receiving full marks.UMC's overall scores have continued to increase in recent years, illustrating the company's continued excellence in sustainable operations. DJSI-World 2019 evaluated approximately 2,500 global enterprises, with only 6 semiconductor companies selected worldwide.SC Chien, co-president and chairman of the CSR Committee at UMC, said, "Being selected as a DJSI Global Component for the 12th consecutive year is a great honor. As a global leader in the semiconductor industry, UMC regards sustainable development as a key value in its business operations. We adhere to the vision of "people-oriented, environmental symbiosis and social co-prosperity," and we are committed to the three aspects of "environment, society and governance." Through the concept of perseverance, the company has set sustainable development goals for both 2020 and 2025 in order to make the greatest contribution to UMC, society and the world. We will continue to strengthen the company's advantages, respond to the UN's sustainable development goals, refine our operational strategies, and exert a positive influence to make the world a better place."UMC is a pioneer in promoting corporate sustainability and practicing social responsibility, with numerous recognitions both domestically and worldwide. In 2019, UMC earned "Top 5% in Corporate Governance Evaluation," "FTSE4Good Emerging Index" honors and became a "FTSE4Good TIP Taiwan ESG Index" component for the second consecutive year. UMC also promotes partnerships with its Eco Echo Award, now in its fourth year, which is a jointly sponsored program that supports supply chain partners.Dow Jones Sustainability Indices was launched jointly by Dow Jones Index, STOXX and Sustainable Asset Management (SAM) in 1999. DJSI is the first index that traces social responsibility performance of leading-edge enterprises, and is also one of the most creditable evaluation tools for reviewing sustainability worldwide. The Dow Jones Sustainability World Index and respective subsets track the performance of the top 10% of the 2500 largest companies in the S&P Global Broad Market Index that lead the field in terms of sustainability.

Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor devices already enjoy enormous demand and this market segment is experiencing another wave of growth driven by fast rising popularity of automotive electronics in recent years. One year into its efforts toward backend wafer process of power semiconductor devices that started in 2018, iST has come up with the most comprehensive portfolio of backend wafer process solutions in the Taiwan semiconductor sector.Fueled by expanding demands from handheld devices and automotive electronics, the power semiconductor application market is enjoying surging growth. In particular, automobiles, including gasoline, hybrid and electric cars, all have ever-increasing demand for automotive ICs.According to William Cheng, head of iST's surface process engineering business unit, the growth of the automotive electronics market is mainly driven by two factors - automakers' needs to enhance their competitiveness by leveraging advances in electronics technologies to improve performance and increasingly rigorous vehicle emission standards instituted by governments worldwide. To meet the stringent standards, automakers have to incorporate different electronics technologies. As a result, the use of all kinds of discrete electronic devices in automobiles is rapidly on the rise.According to a report released by semiconductor manufacturer Infineon, the costs of discrete power semiconductor devices used in a gasoline car amount to US$71 and in electric cars, the costs run up to US$455. In contrast to declining global automobile shipments in the past year, automotive IC shipments continue to show positive growth, indicating an irreversible trend for the automotive electronics sector going forward.With its critical role in the global semiconductor scene, Taiwan leads the world with a complete ecosystem in terms of both production and supply chain. It is second to none particularly with the professional links along the semiconductor supply chain working in perfect symphony. The same is true for power semiconductor devices. Taiwan has largely focused on front-end wafer fabrication of power MOSFET and other types of power semiconductor devices while China-based firms take over mid-stage and backend processes. However, with the recent growth in the automotive electronics market, power semiconductor devices are constantly in short supply. To meet market demand, iST began to engage in backend MOSFET process in 2018 in an effort to complement the Taiwan supply chain and ease the supply shortage.iST has developed the industry's most comprehensive backend wafer process solutions after a year's efforts in technology research and production line build-up. It offers a complete range of solutions including common processes such as wafer thinning and backside grinding/backside metallization (BGBM) and advanced processes such as wafer thinning up to 15um, front-side metallization (FSM) through chemical plating or sputtering deposition and even chip probing (CP) tests and Taiko ring removal, which most other wafer thinning firms do not provide.As Cheng pointed out, professional talent and automation systems are the two enablers of iST's services. Its team of engineers comprises specialists in frond-end fabrication, mid-stage FSM and BGBM processes and backend assembly with a full grasp of the entire process line technologies to enable all-around services to iST customers. Furthermore, iST also implements the Manufacturing Execution System (MES), which is designed to optimize the production process for the manufacturing industry. As opposed to most other wafer thinning firms that still keep paper-based equipment status logs, iST has fully digitized its production equipment data. It uses real-time monitoring (RTM) devices to keep track of machine conditions at all times. In the case that any data anomaly is detected, the manager in charge is notified and production is halted to prevent damage to subsequent wafers and therefore ensure yield. Also as part of iST' measures to improve factory floor management, operators are required to crosscheck the personnel, equipment and material by scanning barcodes to confirm everything is correct before starting the machine and inputting the material.RTM significantly lowers the chance of machine failure while the crosschecking of personnel, equipment and material prevents human error. With these mechanisms in place, iST is able to boost the yield of all its BGBM process lines. According to Cheng, the yield has maintained at 99.7% for months and iST's target is to further raise it to 99.8% within the year. With respect to capacity, iST plans to produce 35,000 wafers per month at present, meeting customers' current needs. The capacity can be expanded to keep up with customer demand in the future. This indicates that iST has full control on its production lines and therefore is capable of making on-schedule delivery and providing on-target quality.iST is also gearing up efforts toward expansion into different application markets. In May 2019, iST's Fab II located in Hsinchu Science Park obtained third-party certification for compliance with the International Standard for Automotive Quality Management Systems IATF 16949. With the Letter of Compliance (LOC) to IATF 16949, iST has crossed the entrance barrier to the automotive market and will be able to produce compliant products for automotive applications. Aside from IATF 16949, it is necessary to also get certified for German automotive standard VDA 6.3 if manufacturers want to make their way into the supply chain for leading automakers. Compliance with this standard indicates that the manufacturer's production lines can maintain stable production even under multiple interferences. VDA6.3 is different from IATF 16949 in that third-party certification is not available but instead automakers conduct their own audits. iST has been VDA6.3-certified by one customer and the number will increase to three or four in the second half of 2019.Apart from MOSFET, the insulated-gate bipolar transistor (IGBT) is another critical component of automotive electronics and therefore also a highlight of iST's efforts toward backend wafer process solutions for power semiconductor devices. However, as it may take longer for investment in IGBT to generate return, iST will build its IGBT process platform by engaging industry alliance for the purpose of maximizing resource utilization. Cheng noted that iST is currently focusing on field-stop layer processing for IGBT. Besides wafer thinning, the critical part to field-stop layer processing is how to ensure that the backside processing produces semiconductor devices with characteristics conforming to the design spec. iST's team of professionals with extensive experiences in front-end and backend processes, coupled with its ample lab resources to help with material analysis, will enable iST to stand out from the competition.Fueled by flourishing automotive and smart home markets, the demand for power semiconductor devices and their backend wafer thinning process is on a steep rise. All iST's fabrication facilities have been upgraded to Industry 3.5, said Cheng.With a full control of production line data, both capacity and yield are ramping up, enabling iST to deliver the most comprehensive backend wafer process services for power semiconductor devices to customers worldwide.iST is among the few firms in Taiwan and even Asia that are capable of providing complete FSM and BGBM backend wafer process services for power semiconductor devices, according to William Cheng from iST.

The continuous process scaling and moving toward heterogeneous integration have enabled the vigorous innovation in the semiconductor industry in the post-Moore's Law era, which in turn drives the rapid development of 5G/AI/IoT applications. Behind this, semiconductor equipment makers play an important role in helping semiconductor manufactures create larger capacity, faster in speed, lower power consumption, and higher reliability chips with more sophisticated process equipment.However, through the dawn of emerging technology in intelligence networks, semiconductor equipment makers are facing both new business opportunities and challenges. Roger Chang, executive vice president of Tokyo Electron Taiwan Limited, recently shared his view on TEL's future development direction in an interview, explaining how TEL will stay ahead in the new era by leveraging its existing advantages. In addition, for the important Taiwan market, TEL will focus on talent, technology and supply chain optimization to enhance local services, as well as establish closer relationships with supply chain partners.Serving the market with comprehensive, powerful portfoliosTEL is the third largest semiconductor equipment maker in the world and has performed with bright color in recent years. According to VLSI research, TEL's YoY growth rate in 2018 grew 25.8%, outperforming the overall market. Regarding this, Chang said that "TEL's product portfolio extend from the front-end coater/developers, etch systems, deposition systems, cleaning systems and to the back-end wafer prober, market share among these product lines are well recognized in the leadership market of either Top 1 or Top 2. With the overwhelming comprehensive capability and diverse products, TEL is able to enjoy better growth momentum when demand turns up."The rapid advances in AI and big data applications have led the industry to invest heavily in building memory and advanced logic device capacities. Being a leader in semiconductor production equipment market, TEL aims to drive the advanced wafer fabrication technologies. He stressed that, as the industry moves to 7/5 nm and even 3 nm node, semiconductor manufacturing has involved in the stacking of atomic layer deposition, requiring more subtle precision and control capabilities, therefore, equipment suppliers need to enhance their R&D capabilities to meet the challenges.Funding large sum for R&D investment to maintain competitive edgeIn order to meet the industry's demand for more advanced manufacturing technology, TEL has announced that it expects to spend 400 billion yen in R&D investment in the next three years. "R&D is very important for semiconductors with fast technological innovation," Chang said. "We believe that companies that cannot do enough research and development won't be able to survive in the market. Therefore, our R&D investment is high in order to drive continuous innovation in the industry."TEL's R&D direction will also echo three major trends in semiconductor manufacturing: process scaling, heterogeneous integration, and application-specific design.Chang explained that the continuous miniaturization of logic and memory devices and moving toward 3D structure will lead to the introduction of diverse new materials and structures. In addition, research and development of new devices such as PCRAM, MRAM, and FeRAM are also in progress. The industry requires atomic level controllability and high-aspect ratio 3D dimension etching and deposition technologies, as well as the within-wafer, wafer-to-wafer, lot-to-lot, and tool-to-tool process variation control and stability."Lithography, etching, deposition, and cleaning are very important steps for miniaturization and 3D structure creation, and there are no other semiconductor equipment makers that have these four. With the unique advantage, we are able to keep serving our customers with higher value under the mega trend."In addition to process scaling, the development of heterogeneous integration has gradually matured. Through multi-functional-die stacking, it has become another important option for the industry to enable higher level of integration. Similarly, TEL will also leverage its excellent technologies to meet the needs of the industry.Finally, the application-specific design co-optimization is in response to the rise of AI, which will bring new design and manufacturing requirements for chip and memory. As a result, new ecosystems and business models are needed to drive the more efficient AI applications. "This is a new trend and a closer collaborative R&D integration from manufacturing to design. The industry is currently exploring new ways of cooperation. TEL is getting actively involved, and its follow-up development will be anticipated in full.Enhance Taiwan deployment by strengthening supply chain optimizationTEL has been deeply involved in Taiwan market for more than 20 years. Chang said that as the market demand for new applications continues to expand in the future, TEL will strengthen its resources in Taiwan in terms of talent, technology and supply chain optimization, in a bid to meet the needs of customers and grow together. In addition to invest in the development of advanced process technology, TEL also values greatly on assisting customers to improve the productivity of their legacy 200mm or 300mm equipment."For many industries, well established process know-how may just be enough, such as in automotive and IoT applications. Therefore, for the larger amount of installed equipment at customers' sites in Taiwan, it's our responsibility, as well as potential business opportunities, to bring the advanced technology of 300mm tools and implementing into 200mm tools through functional upgrade and refurbishment to help customers improving their productivity and yield.""TEL recently has announced the cooperation with BRIDG in the United States to jointly develop in this area. This is an important part of the optimization of our supply chain ecosystem, aiming to help customers maximize the value of their legacy equipment and create higher added value. Therefore, understanding the needs of customers and providing in-time localized services will be crucial to our future business."Moreover, as the process equipment is getting more complicated and sophisticated, talents with cross-domain expertise will be highly demanded. As a result, TEL will strengthen its talent cultivation programs. "TEL has cooperated with numerous internationally renowned R&D institutions and a Technology Center had been established in Taiwan. We have conducted a two-year trainee engineer program for many years. It's hoped to provide more training for our employees," Chang said. "With stronger capability, we will be able to embrace future growth opportunities. We aim to work with customers and suppliers through bilateral innovation and advanced field solutions, creating higher value for the semiconductor industry in order to contribute to the development of a dream-inspiring society."Roger Chang, executive vice president of Tokyo Electron Taiwan Limited

Digi-Key Electronics, a global electronic components distributor, announces that it has expanded its product portfolio by signing an exclusive global distribution partnership with Directed Energy, Inc. This new partnership adds to the more than 8.7 million products available from more than 800 manufacturers through Digi-Key.Directed Energy provides ready-to-use modules for driving laser diodes as well as applications requiring a high voltage pulse. Directed Energy's modules allow users to focus on their end use or product with ready-made solutions to provide high current and high voltage pulses to scientific, industrial and commercial applications."As long-time customers of Digi-Key, our own engineers are familiar with the value of working with a supplier that offers a broad and deep product line, making it simple to find solutions to engineering problems," said Stephen Krausse, president and owner of Directed Energy, Inc. "Now, as a Digi-Key partner, we are excited to know that our pulsed laser diode driver and high voltage pulse modules will offer that same problem-solving value to designers and engineers around the world and in a wide array of industries."Creating a high-quality electrical pulse is challenging, whether that's a high current pulse designed to drive a laser diode, or a high voltage pulse designed for the operation of deflection grids or for beam steering. Directed Energy has been designing and selling precision pulsers for over 30 years. This industry experience has allowed them to create a suite of standard products that designers look to when they need a high-quality, fast pulse of current and/or voltage."We are excited to partner with Directed Energy and offer their ready-to-use modules to our global customer base," said David Stein, vice president of global supplier management for Digi-Key. "Directed Energy has an impressive lineup of off-the-shelf modules that provide high-quality pulses of high current and/or high voltage for a variety of applications, from LiDAR to ADAS, laser diode characterization, precision measurement, and physics and scientific experimentation."

Amiccom Electronics Corporation (Amiccom) announced a new 5.8GHz wireless RF transceiver chip named A5133. The A5133 supports data rate 500kbps ~ 4Mbps with FSK modulation. The A5133 operates in the same way as A5130, users can easily transfer their proprietary protocol from 2.4GHz to 5.8GHz band which has wider channel bandwidths and less interference signal. Both 5.8GHz and 2.4GHz bands are globally applicable ISM bands.The built-in LDO of A5133 supports operating voltage from 2.0 to 3.6 V. The maximum TX output Power is +15dBm (91mA). If the output stage supply of power amplifier is set to 3.3V, the output power can be further increased to +17dBm (110mA). The receiving sensitivity is -90dBm (@4 Mbps FSK @ 33.6mA), the maximum Link budget is 107dB, and hence the transmission distance is greatly increased as compared with the previous generation of product. The external MCU can use the SPI interface to control the A5133. By proper register setting, the operation frequency can be changed so that user can easily implement the frequency hopping anti-interference protocol.For data processing, A5133 provides FEC and CRC, auto acknowledged and auto retransmission, these mechanism can reduce the burden of software development, greatly lower the MCU data processing loading. The power management block supports Sleep, Idle and WOR mode (Wake On RX). The WOR function provides A5133 automatic wake-up and receives RF packets to extend battery life. Sleep mode can be used when RF transmit and receive are not required, and its current consumption is only 3.5uA. Overall, the built-in features of the A5133 can effectively reduce development complexity and development costs.

Both 5G and Wi-Fi 6 networks provide advancements in performance to enhance mobility, capacity and data rates. Leveraging artificial intelligence (AI) and Internet of Things (IoT) technologies, computing is becoming more powerful, enhanced by wider bandwidth, high speed, low latency and massive connectivity. Servers are almost everywhere, but things not just happen in the data center, but also remotely.The booming business opportunities of high performance computing and edge computing improve user experience in every specific use cases. With strong growth and increased competition in the data center sectors of North America and Europe, the trend is expanding to Asia region to deliver quick and massive growth.The latest strong growth of Lenovo's data center group is a good example. In an interview, Han Chon, general manager of Lenovo Data Center Group Central Asia Pacific region, talked about the strategy for achieving growth in the data center market. He is responsible for leading sales and marketing across 12 nations and regions including Taiwan and Hong Kong in this area. Having achieved significant growth and industry leadership in 2018, he expressed gratitude to his entire team for making great efforts.Embracing AI technologies reducing human resource constraintsThe customers of the Central Asia Pacific region are showing strong intention to welcome and embrace new technologies, Chon said. The high performance computing and AI technology have a lot to benefit from each other. As the more data generated by various mobile devices, AI is helping us make sense of the data. The Big Data Analytics is becoming the driving force to create new or enhanced business models more closely attuned to the needs of end customers. AI makes enterprises to increase efficiency and spend less on administrative tasks.Lenovo Data Center Group (DCG) looks at this trend and very openly to cooperative with different AI technology partners to maximize the opportunities presented by the digital economy. Meanwhile, DCG keeps investing more resource to work closely with educational organizations, research institutes, global enterprises and big electronics and semiconductor companies. The collaboration helps to introduce new solutions to tackle major issues that enterprises face.More fast-growing companies that leverage AI technology for their core business create an immense business benefit through data center applications. However, for performance reasons, the remote data-generating devices must be close to computing and storage resources. A slimmer data center, or called a mini version of a data center server, could work as edge computing node takes hold in various industries. The edge computing trend is gaining ground with good reasons.Crafted edge server series accelerating business opportunitiesOver the past few years, Chon watched there has been a steady increase in the number of mobile devices provided high resolution and quality video streams easily. AI technologies make edge computing to deliver reliably, speedily while taking more care of data security. The AI-enabled edge servers can better manage their resources and clearly understand the merits. This is why Lenovo DCG introduced the first edge computing server series for developing the business in the beginning of 2019. The Lenovo ThinkSystem SE350 Edge server equips with small footprint and power efficiency allowing for reliable server-class performance at many remote locations.The SE350 can handle temperatures from 0 degree to 55 degree C, as well as tolerate locations with high-dust and vibration, such as construction site trailers and manufacturing floors. It can be deployed equally well in a traditional office or branch location due to its office-friendly acoustics. The essential cyber-security offerings include key-encrypted storage and physical security features, such as a locking bezel, as well as intrusion and tamper-detection mechanisms. And the networking connectivity options equip wired 10/100Mb/1GbE, 1GbE SFP, and 10GbE SFP+, as well as secure wireless Wi-Fi, cellular LTE and 5G connections in the future.For decades, computing was done solely on big servers in the central controlled room of companies. Over the last two decades, however, businesses gradually began shifting their workloads to the cloud and helped companies reduce capital expenditure and increase return on investment. But the edge servers are terms that are well understood by companies today, even we could see the edge computing approach making data center everywhere, Chon describes to support the ideas.Building a Thriving Ecosystems in Taiwan for further developing marketOwing to the growing presence of hyper-scale cloud service providers, extensive penetration of Internet connectivity as well as keen focus on data security, the demand for data storage and cloud services is expected to grow exponentially across the ASEAN and Taiwan region. Lenovo DCG works closely with customers to deliver value to Taiwan industries and continue to expand the products portfolios to make customers to grow faster.Chon highlights Taiwanese electronics manufacturers are on the frontline of cutting-edge technology to deliver premium products to global brands. Taiwan manufacturers are also investing AI-enabled data center solutions to help boost growth and innovation. Upcoming data center markets are poised to experience exponential growth due to abundant availability of resources as well as government policies supporting. That shows a natural growth of Taiwan data center business.For fast responding the market demands, Lenovo DCG is creating the collaborative business ecosystems to accelerate innovation. "Because no one can do it all and do it alone, the partnership of ecosystem partners or channel partners will be the key strategy to grow regional business," Chon says. Now that more industries are becoming digitally savvy, the Lenovo DCG partners will play an important role to navigate digital disruption and become more agile and responsive to customer's needs. "Without their help we could not go to the level we today's position", Chon says.Although Lenovo DCG is a very young organization for only 2.5 years, the business scope and team members are both growing fast. "All Customers are chasing the solutions to break the limits of computation and push the boundary every day," Chon adds. They want to do better and more. Things like to have better management of their fleets, or simply such as growing new business and improving efficiency.For Taiwan ecosystem partners, "Lenovo DCG teams are here to stay and to play," Chon continues very positively, "Today we extend the high-performance architecture from data center to the edge with the complete product families, becoming valuable partners and bring tomorrow today for Taiwan customers." With these high-performance products and ecosystem partners, Lenovo DCG is ushering in a new age for data center solutions.Han Chon, regional general manager, Lenovo DCG Central Asia Pacific

Midas Touch's smart fingerprint locker lock is designed for quick unlocking access with high security. It is easy to set up and operate. Besides, it can store and recognize one managing fingerprint and more user fingerprints.People usually have secret documents or precious items that should be kept carefully. It is difficult for traditional locks to achieve a certain of security. The smart fingerprint locks is here to solve the problem. Whether it is for businessmen who sign contracts frequently, professors who review student papers, or general households who need to keep private information, traditional locks can no longer meet the standards of modern society. With practical key features, smart locker lock is definitely a better choice!Key Features- Security: Higher security than traditional lock! No need to worry about things being stolen. Make sure of the safety of secret documents.- Convenience: Unlock with your fingerprint. The capacitive fingerprint sensor allows unlocking in under 0.7 seconds- Sturdy mechanism: Latch and mortise are made by metal, they are sturdy enough for the cabinets.- DIY Installing: No Drilling, installed by screws easily.- Low power consumption: Static life of 1 year or at least 2000 times after charging.- Rechargeable: Micro USB seat supply emergency charging using- Spare key: Provide a spare key to users to avoid situations could not use fingerprint.For more information, please visit our website on https://www.midastouchinc.com/product/smart-drawer-lock-ultra-light-fingerprint/We are looking for the business partners in USA. Welcome to visit us on TechCrunch Taiwan Pavilion, Moscone Center of San Francisco on Oct. 2-4, 2019 or Mobile World Congress (MWC) on Taiwan Pavilion Booth No. 2324, South Hall of Los Angeles Convention Center on Oct. 22-24, 2019.Midas Touch's smart fingerprint locker lock