Artificial Intelligence (AI) is paving the way for a more advanced, sophisticated and future-proof applications. Most global organizations view AI technology as a long-term strategic priority for innovation to reap the benefits of business growth and success. Meanwhile, the adoption of AI technology to create use cases combines with the internet of things (IoT) across the globe is presently outrunning the speed. While these two broad concepts collide, the multiple data sources have emerged and required immense computing services to process large volumes of streaming data.Driven by the Ministry of Science and Technology, the AI Cloud Platform named Taiwan Computing Cloud (TWCC), was implemented by the NCHC (National Center of High-performance Computing) together with three Taiwan-based high-tech enterprises, such as Taiwan Mobile, ASUS and Quanta Computer to build "Taiwania 2" supercomputer system. TWCC runs on the strength of Taiwania 2 to provide the services to education and academic research institutes in June 2019. And it continues to expand the services to industries in October of the same year aiming to make it a powerful tool to fulfill the needs of science and technology innovation. The first "made in Taiwan" AI supercomputer, Taiwania 2, is a milestone in Taiwan's promotion of AI as a core tenet of its future development.At the opening session in the Tech Summit hosted by NCHC on October 17th 2019, Deputy Minister of Ministry of Science and Technology Hsu Yu-chin stated that government funded TWCC service will lead to massive speedups for tasks to support high performance computing and AI workloads at scale. This powerful AI supercomputer investment will dramatically enhance performance for AI applications and further push the boundaries of industrial digital transformation by providing massive computation and storage services. He hopes to see TWCC spurring advanced technological research and development to increase Taiwan's economic competiveness.The launch of TWCC service is also supported by global tech giants including NVIDIA and IBM engineering teams through several intensive cooperation programs to build hardware and software development platforms for supporting industrial projects. Shepherd Shi, NCHC Director General, takes the opportunity to thank them to join the projects. Since May 2019, the TWCC have been providing services to reach 90% of computation capacity and accumulated 8 million GPU cores per hour for training machine learning framework and testing various algorithms.Compared with other AI public cloud service providers, TWCC delivers world-class service quality and has leading edge in terms of speed and performance, Shepherd Shi adds. Developers can quickly build their working environment with high efficiency and cost advantage over current methods. TWCC service gives users in industries, academia, and research fields more timely and more cost effective computing services.The live demo during the presentation of Shepherd Shi shows a successful use case of Taiwan wind turbines green energy project for adjusting an optimum pitch angle of rotor blades and operate the sites with increased efficiency. This powerful prediction scheme is developed by NCKU to use high-speed parallel computing resource provided by TWCC. In the conference, there are 11 standout products showcasing in booth to display the commercialization of research results from cutting-edge R&D firms or startups.High-tech and academic research projects facing challenges from multiple data sources and big volume issuesProfessor Sean Smith, director of National Computational Infrastructure of Australia (NCI Australia), gives the first keynote speech. He shares recent development of high performance computing and national computation infrastructure in Australia. Funded directly by Australian Government, the data center construction was initiated in August 2011, and was completed in September 2012 because of the high demands of weather forecast study and advanced geographic research projects. In November 2019, the second supercomputer system will be launched and start to provide the service. Both the first and second set of supercomputer systems are all designed and built by Fujitsu.Based on the analysis of the service usage of HPC resource in NCI Australia, the biggest part of research organization is universities taking 29%. And the largest category of research topics is the Earth and Earth System Science occupying 38%. Smith highlights those research projects consume lots of parallel processing and computing resources because dealing with the challenges of multiple data sources and big data volume. Taking the Geographic Information System (GIS) project as an example, the research datasets are growing massively every year. The data comes from different satellite systems of US, EU and Australia. And there are even more data from extra IoT devices or sensors. The current top 3 datasets are Earth-Observation Data, Genomic Data and Climate Model Data. Each of them to perform data processing and big data analytics requires power computation and storage features.Facing the challenges of data complexity and big volume issues, NCI Australia is delivering "data as a service" for tackling the challenges. The National Environmental Research Data Interoperability Platform (NERDIP) is the interface to provide an integrated platform for users to access datasets managed at NCI Australia. The building blocks of NERDIP include Data Storage Infrastructure, Data Discovery Standards and Conventions, and also the Data Access Services which allow users from government organizations, academia and industrial communities to access the data services for advanced research projects.Successful leveraging global trend of AI and Big Data analytics relying on human interaction with data resultsThe second keynote speech is presented by Jing Shyr, IBM Fellow Emeritus. She focuses on the relationship between Big Data and AI. From her long experience for doing Big Data Analytics projects for more than 30 years, she shares a first-hand view of data challenges. There are so many new forms of data sources, especially generated by IoT devices or sensors today. AI applications are the trend we need to leverage for handling and analyzing a large volume of data to produce useable results, Jing Shyr highlights.She continues to describe how smart analytics works. It is starting from data preparation. Then the creation of automated data modeling is paving the way for data prediction and analytics. The entire process flow shows why Automated Machine Learning (autoML) is so hot that it becomes a must for most of software vendors. Finally, the data results come to lead a solution to solve the problem by understanding the data insight.It's important that data is less often about telling a specific answer and more like starting a guided conversation and letting the users find the answer that fits their needs. That's the reason why it's important to offer conversation between human and data analytics, since the Big Data Analytics project is mostly relying on iteration between human and data results.As AI applications are getting more popular and massive Auto AI solutions are widely noticed, developing technology for Big Data Analytics is still critical. One of the key elements is that data scientists and data engineers' skills are in high demand. Working closely with a good data scientist will drive better results and unveiling better solutions, Jing Shyr continues. The modern AI applications including self-driving car, facial recognition or characterized advertising are all important use cases to solve human problems and live a better life.Building Taiwan AI ecosystems to accelerate industrial digital transformationThe panel discussion session invites guests to focus on the topics of building AI ecosystem to accelerate digital transformation for Taiwan industries. Speaking in the first, Shepherd Shi points out that TWCC is creating an important platform to share the AI research results to enable Taiwan industry to grasp new business opportunities. Through the TWCC service with dedicated and secured networking, storage and high performance computing environments, it will ensure that the research results find their way into the industrial sector and create a business model.Peter Wu, general manager of ASUS Cloud Corporation, also sees TWCC service as an important national investment for Taiwan to create a good chance to allow Taiwan enterprises to gain a good reputation to build a supercomputer system. The important thing is the software capability has been well recognized by global tech communities and leading players. It will help Taiwan ecosystem partners have important growth opportunities to win the high performance computing system, building a benchmark apart from the role of hardware manufacturers in the old time.Allen Liou, VP of Taiwan Mobile, focuses on the business opportunity of 5G network services. The AI system is the "Brain" to enable a broad range of smart applications for enterprises and end users. The AI innovation will be a key enabler to change the landscape of Telecommunication, media, retail, e-commerce, finance, and medical industries.The AI-enabled drones are becoming a game changer for the company like Coretronic Intelligent Robotics Corporation (CIRC), said General Manager Andy Hsin. It helps CIRC to capture the new business models to offer versatile security applications and services. And this change is showing the great possibility to transform a hardware manufacturer to a service provider.Cheng-Hong Cho, CEO of Institute for Information Industry (III), highlights the importance for building ecosystems to form a value-adding network of partners and collaborative organizations. This will be an important competitive advantage not only leveraging AI becoming leading edge in scientific research, but also helping industries to accelerate digital transformation. And TWCC service will become fertile ground for more AI development teams to nourish and grow into world-class organizations.Guests at TWCC Forum (from left to right): Cheng-Hong Cho, CEO, Institute for Information Industry; Sean Smith, director, NCI Australia; Jacky Hsu, CTO, IBM Taiwan; Mike Yang, SVP, Quanta Computer; Eunice Chiu, global VP and Taiwan GM, NVIDIA; Yu-chin Hsu, deputy minister, Ministry of Science and Technology; Yeong-her Wang, president, NARL; Shepherd Shi, director general, NCHC; Robert Chin, Asus GM, Server Business Unit; Jing Shyr, IBM fellow; Alen Chen, VP of Pre-Sales Department, SAS Taiwan; Andy Hsin, GM, Coretronic Intelligent Robotics Department; and Hsi Ching Lin, deputy director general, NCHC.Shepherd Shi, director general of NCHCSean Smith, director of NCI AustraliaJing Shyr, IBM fellowGuests at panel discussion (from left to right): Andy Hsin, GM, Coretronic Intelligent Robotics Department; Jacky Hsu, CTO of IBM Taiwan; Peter Wu, GM of Asus Cloud Corporation; Shepherd Shi, director general of NCHC; Allen Liou, VP of Taiwan Mobile; Alen Chen, VP of Pre-Sales Department at SAS Taiwan; Cheng-Hong Cho, CEO of Institute for Information Industry; and Nicole Hsiao, the moderator.

STAr Technologies Inc, a leading supplier of semiconductor test probe cards, today announced the introduction of its new MEMS type micro-Cantilever probe card - STAr Aries Sigma-M, designed and developed specifically for CMOS Image Sensor (CIS) testing. The Aries Sigma-M probe card is suitable for testing of highly parallel large-array multi-DUT CIS devices to increase productivity with greatly reduce cost-of-test.Attributed to the demand of mobile devices such as smart phones and new applications such as autonomous driving vehicle, the CIS market is growing exponentially with continuous improvement in resolution, frame rate and communication speed. These market trends have led to smaller chip size CIS that requires high-speed (up to 6 Gbps) tests under long test time.STAr Technologies always exceeded customers demand to increase test performance with reduce test cost that results in increasing productivity and efficiencies. To meet future test requirements for CIS devices, the Aries Sigma-M probe cards use micro-Cantilever MEMS probes with minimum pitch of 60um and up to 15000 pins that support testing of up to 64 devices in parallel. The Aries Sigma-M revolutionary structure further reduces test setup time, enable different devices to be tested under same probe card over wide varying temperature up to 150degC and testing speed of 3.5Gbps with future upgrade to 6Gbps."We are happy to introduce the new CIS probe cards based on MEMS processes with micro-cantilever probes. We believed that the new Aries Sigma-M probe cards will exceed both market and technology trends by improving test efficiencies and reducing cost-of-tests," said Dr CL Lou, CEO of STAr Technologies.STAr Aries Sigma-M probe card is specifically designed for CMOS image sensor

With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU suppliers are developing new-generation MCUs with higher performance and lower power consumption to meet the market demand. In addition, from the overall system design perspective, the RAM that works with the MCU also requires new options to provide better advantages than those of the existing SDRAM and pSRAM.HyperRAM, which supports the HyperBus interface, is a new technical solution to address this demand. HyperBus technology was first unveiled by Cypress in 2014, and the company launched its first HyperRAM product in 2015. As the technology has been developed for many years and has a clear market position, Winbond Electronics has decided to join the HyperRAM camp and launches 32Mb/64Mb/128Mb density products. This move will help Winbond further expand its product portfolio to respond to the diverse application needs, as well as make the ecosystem more complete through active participation.Benefits of using HyperRAMHans Liao, Technology Manager of DRAM Market at Winbond, said, "Low pin count, low power consumption, and easy control are the three key features of HyperRAM that make it can significantly improve the performance of end devices."He explained that the computing power, data processing and image display functions of traditional MCUs are limited. However, the new IoT devices for automotive, industrial, smart home, and wearable often adopt touch panel as image control interface, or require stronger edge computing functions for image processing and speech recognition. Therefore, the new-generation higher performance, lower power MCU market is emerging.For IoT applications, various design considerations such as low cost, low power consumption, and computing efficiency must be met in order to gain widespread adoption in the market. Especially, for battery-powered devices such as smart speakers and smart meters, battery life has become the key to the success of the product, in addition to the rich IoT function and easy-to-use human interface. This makes low power consumption increasingly important. To achieve long battery life, in addition to using power consumption MCU, the other low-power peripheral components should also be considered, and HyperRAM is designed for this.Take Winbond's 64Mb HyperRAM as an example, the power consumption of Standby is 90uW@1.8V, while that of the same capacity SDRAM is about 2000uW@3.3V. More importantly, power consumption of HyperRAM has only 45uW@1.8V in Hybrid Sleep Mode, which is a significant different from the Standby mode of SDRAM. On the other hand, if Low Power SDRAM is adopted, the form factor is still bigger than HyperRAM. That makes it not an ideal solution as Low Power SDRAM requires larger PCB area.In addition, HyperRAM has only 13 signal pins, which can greatly simplify the PCB layout design. It also means that when designing end products, allowing MCU to have more pin out for other purposes or using MCU with fewer pins for better cost-effectiveness is made possible.Simplifying control interface is another feature of HyperRAM. Based on pSRAM architecture, HyperRAM is a self-refresh RAM. Moreover, it can automatically return to standby mode. Therefore, system memory is easier to use, and the development of firmware and drivers is also simplified.New force of HyerRAM ecosystemSierra Lai, Director of DRAM Marketing Division at Winbond, added that the process nodes of MCU are moving from 55nm, 40nm to 28nm, or even 16nm. Although its size can meet the IoT miniaturization trend, it still needs to use new generation external memory as a data buffer to address the higher computing capabilities required by IoT applications.However, the development of traditional SDRAM and pSRAM have matured and cannot be optimized for emerging IoT applications. Also, the DRAM process migration is based on the new generation JEDEC DDRx/LPDDRx products. Winbond's HyperRAM, which adopts 38nm process node, will continue to move toward 25nm. Considering the long-term supply requirements for automotive and industrial applications, the advanced process nodes of Winbond's HyperRAM can meet customers' longevity product lifecycle.Therefore, from the perspective of overall system design and product life, HyperRAM has become an ideal choice for emerging IoT devices. "We saw the market demand, so we decided to develop HyperRAM products to provide customers with another choice," Sierra Lai stressed. "The maturity of its ecosystems is of course an important factor for us to move into."At present, in addition to Cypress, leading MCU companies such as NXP, Renesas, ST, and TI have already provided MCUs that support HyperBus interface, and their new products will continue to support in the future. Meanwhile, its development platform of control interface is ready. Cadence, Synopsys and Mobiveil have also begun to provide HyperBus memory control IP, which can accelerate IC vendors' design cycle. As a result, compared to other Octal RAMs, HyperRAM has the most mature application environment. HyperRAM will also be incorporated into JEDEC standard in the future, becoming a JEDEC compatible technology.After Winbond joined the HyperRAM camp, it will become the third supplier in the market in addition to Cypress and ISSI, which can provide customers with more choices.Sierra Lai believed that the low pin count and low power characteristics of HyperRAM will bring significant advantages to IoT devices. As the market gradually heats up, more customers will begin to adopt this new generation memory.The current status of Winbond's HyperRAM product line is: 32Mb has entered mass production; 64Mb and 128Mb are expected to enter mass production in 4Q19 and 1Q20 respectively. Products of 24BGA (automotive grade), 49BGA and KGD are available. Among them, size of 24BGA is 6x8 mm2, while that of 49BGA is only 4x4 mm2, which targets the consumer wearable market.HyperRAM, which supports the HyperBus interface, is a new technical solution to address this demand

Digi-Key Electronics, a global electronic components distributor, has announced it will sponsor seven upcoming Microchip Masters events in November and December as the Gold Sponsor for all three China events, the Silver Sponsor for the India event, the Platinum Sponsor for the Korea event, and the Silver Sponsor for the two Taiwan events."We are thrilled to support the work of the Microchip Masters premiere technical training events," said David Stein, vice president, global supplier management for Digi-Key. "The Masters events continue to arm system design engineers of every level with the information and hands-on training they need to scale the learning curve and get their products to market faster. The mission of the Microchip Masters could not align more with the values and mission of Digi-Key, and we're proud to be a part of these events."The Microchip Masters conferences are held annually for embedded control engineers around the globe. The training sessions and classes cover a broad range of topics and are taught by Microchip's own application and design engineers."Attendees have consistently conveyed Microchip Masters is the premier technical training event in the industry," said Ken Pye, Microchip's vice president of worldwide applications. "We appreciate the sponsorships of Digi-Key and thank them for helping our mutual customers learn how to differentiate their end products across the many different markets we serve."Digi-Key Electronics will sponsor the following events:- Seoul, Korea: November 5-8, 2019 (Platinum Sponsor)- Wuhan, China: November 6-8, 2019 (Gold Sponsor)- Shenzhen, China: November 13-15, 2019 (Gold Sponsor)- Taipei, Taiwan: November 14-15, 2019 (Silver Sponsor)- Shanghai, China: November 20-22, 2019 (Gold Sponsor)- Taichung, Taiwan: November 28-29, 2019 (Silver Sponsor)- Bangalore, India: December 3-6, 2019 (Silver Sponsor)

Karamba Security, a world-leading provider of embedded cybersecurity for connected machines, today announced a collaboration with Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions and a pioneer in certified secure memories, to enhance embedded software security in automotive and other connected industries. OEMs and tier ones use Karamba's embedded cybersecurity solutions for connected systems to protect their software and reduce vulnerability exposures. Under the new partnership, Karamba will offer enhanced hardware security with the use of Winbond's secure memories.The Karamba and Winbond collaboration will provide cybersecurity offerings that leverage Winbond's TrustME secure flash memories with Karamba's embedded security policy. Winbond's family of secure memories combines its world class NOR flash manufacturing process and state-of-the-art hardware security technology. The company's offerings range from the world's first and most secured EAL5+ Common Criteria certified flash memory device to cost effective EAL2 and Arm PSA certified memory devices.Winbond's secure memory with tamper resistance allows Karamba's Runtime Integrity security to focus on performance excellence, automatically hardening the full image of the connected system and preventing modification of the factory settings."Teaming with a pioneer in certified secure memories enables us to improve security while maintaining the high-performance characteristics required in automotive and industrial systems," said Ami Dotan, Karamba Security's co-founder and CEO. "More than ever, autonomous vehicles, industry 4.0 controllers, and enterprise IoT edge devices need security technology that is embedded in them and which does not impact performance. Partnering with Winbond, with its certified secure memories, strengthens our commitment to offer state-of-the-art cybersecurity solutions and increases customer trust in our solutions."Karamba's Control Flow Integrity (CFI) is becoming an industry requirement in automotive embedded systems and is expanding to other industries, making this collaboration a natural one," said Hung-Wei Chen, Director of Winbond Secure Flash Memory Marketing."Security is everyone's business, and every layer must take part in securing the overall system, so memory with built-in security is becoming indispensable. Winbond's Common Criteria certified production site guarantees secured production, software programing, and key provisioning for connected systems. Partnering with Karamba complements our security offerings and allows us to provide comprehensive solutions to our customers."Learn more by visiting Karamba Security at AutoISAC Summit on October 23-24th in Plano, Texas.About Karamba SecurityKaramba Security provides industry-leading embedded cybersecurity solutions for connected systems. Product manufacturers in automotive, Industry 4.0, IoT, and enterprise edge rely on Karamba's automated runtime integrity software to self-protect their products against Remote Code Execution (RCE) cyberattacks with negligible performance impact. After 32 successful engagements with 17 automotive OEMs and tier 1s, product providers trust Karamba's award-winning solutions for compliance and increasing their brand competitiveness when protecting their customers against cyberthreats.More information is available at www.karambasecurity.com and follow us on Twitter @KarambaSecurity.About WinbondWinbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM and Code Storage Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.Winbond's headquarters is in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong. Based in Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.Winbond's TrustME secure flash memories with Karamba's embedded security policy

PrimeVOLT has introduced numerous flagship new PV Inverters, fully demonstrating the R&D and production capabilities of Taiwan at the 2019 Energy Taiwan trade show.Having been active in the solar energy industry for many years, PrimeVOLT took advantage of this opportunity to introduce four new single-phase PV inverters - 3kW, 3.6kW, 5kW, and HV-5kW. Aside from a significant improvement in efficiency, the new models are lighter in weight and more compact, bestowing more than 20% weight and volume reduction compared to previous models.To satisfy the customer requirements of large-scale, land-based solar power plant in Taiwan, PrimeVOLT launched its 60kW and 75kW high power three-phase flagship PV Inverters, which have become the spotlight of the exhibition and impressed visitors so much. Following the launch of 40kW PV inverter in 2018, the new 60kW and 75kW PV inverters come with four MPPTs and are capable of maximizing power generation in each PV array, so that the entire power generation could be tracked and enhanced effectively.Additionally, PrimeVOLT has implemented measures to ensure that no power loss occurs during reactive power compensation (PF0.9), preventing a decrease in PV inverter output while static VAR compensators are in operation. This feature guarantees steady income of PV power for each PrimeVOLT's user.Exclusive aluminum die casting technique that withstood on-site testingDifferentiating from traditional PV inverter produced through welding of stainless steel and is therefore prone to erosion and water damage, PrimeVOLT PV inverter is manufactured using its signature aluminum die casting technology. Having acquired both IP65 (dust and water resistance) and IEC salt-spraying certification, the uni-body design ensures optimal efficiency even though the solar power plant is located in high salt spray and high humidity environment.Offering the fastest and most comprehensive services, PrimeVOLT gains business opportunitiesApart from offering product that is 100% designed and manufactured in Taiwan, the PrimeVOLT team offers professional advice on the optimal capacity and complementary hardware requirements for the initial stages of power plant planning and works with customers in finding the optimal solution. PrimeVOLT's expertise has earned widespread praise from customers over the years. In addition, PrimeVOLT elaborated local service network satisfies the needs of customers by providing on-site service within 48 hours from notice.For more information on PrimeVOLT's products, please visit: www.primeVOLT.comPrimeVOLT's at Energy Taiwan 2019

The automotive industry is steering toward a future of self-driving cars, where vehicles can be controlled via smartphones, drive autonomously from the parking lot to pick up their owners, communicate with their surroundings over vehicle-to-everything (V2X) networks, and avoid roads with traffic congestions or accidents. In line with the megatrend of digitization, the automotive industry is incorporating a massive quantity of electronic control units (ECUs) and software systems in today's automobiles.In particular, an advanced driver assistance system (ADAS), in-vehicle infotainment system and digital dashboard all use a myriad of control units comprising microcontroller units (MCUs) and high-performance processing chips. Existing embedded flash memory can hardly keep up with the need of these automotive electronics systems. This gives rise to the growing use of external flash memory with increasing capacities.As automotive electronics systems grow in the level of integration and complexity, semiconductor chips with robust security implementations to suit artificial intelligence (AI), Internet of Things (IoT) and V2X applications are grabbing industry attention. The implementations of information security - including identity authentication, crypto keys, secure boot and a range of protection technologies for data storage - have traditionally been carried out by processors. However, a new trend is emerging: making use of native security functionalities on memory chips to guarantee data confidentiality and integrity while reducing potential risks. The combined use of Macronix's new ArmorFlash solution with NVIDIA DRIVE AGX Xavier and Pegasus platforms in high-performance Level 2+ to Level 5 autonomous driving systems set a good example of success scenarios.Dr. Donald Huang, deputy director of product marketing at Macronix International, commented during a recent interview that the industry is attaching great importance to security implementations on memory chips. The use of native functionalities including data encryption and decryption, identity authentication and anti-tamper protection on top of the "physical unclonable function" (PUF) code generated with the chips' unique and unpredictable characteristics can ensure data confidentiality and integrity. Such high-end secure memory solutions can then be incorporated in wide-ranging applications requiring robust information protection. Macronix's new ArmorFlash Series is Iconic as a secure memory solution.ArmorFlash enables higher-level information security and protectionAs global semiconductor manufacturers and tier-1 automakers exert efforts to meet market demand for higher-level information security and protection in network communication and data access solutions, Macronix leads the industry in launching its ArmorFlash total solution, pushing the frontier of flash memory data security. Macronix ArmorFlash comes with data encryption and decryption, identity authentication, anti-tamper protection, AES 256-bit encryption, TrueRandom Number Generation (TRNG) and monotonic Counter. On top of these features, ArmorFlash features the PUF code to guarantee data confidentiality and integrity. It ideally supports the use in automotive systems, industrial control applications and IoT devices throughout the product lifecycle from deployment, installation to long-term operation by enabling strong protection against data corruption and malware implant.ArmorFlash supports SPI standardsThe Serial Peripheral Interface (SPI) is a synchronous serial communication interface commonly adopted in IoT devices and automotive electronics. Memory products supporting SPI can facilitate electronics system integration, accelerate development cycle and shorten time to market. Manufactured with advanced process technologies and supporting floating gate flash memory technology, Macronix's market-recognized SPI flash memory features an amazingly high 250MHz clock frequency, making the series the fastest SPI NOR flash on the market. Macronix takes it one step further by introducing the ArmorFlash total solution with SPI support to address information security requirements by automotive electronics and IoT devices, pioneering the advances in data protection for the global flash memory industry.AEC-Q100-Compliant ArmorFlash is available with 1.8V and 3V operating voltagesThe first ArmorFlash MX75U25690F is being produced and marketed in volume. The product has passed rigorous AEC-Q100 qualification tests. With the ability to operate in extreme temperatures ranging from -40 degree C and +105 degree C, the MX75U25690F ideally supports data storage and processing in the limited footprint inside automobiles. It also works well with mainstream controller and processor chips manufactured by leading automotive chipmakers. Macronix plans to add products supporting 1.8V and 3V operating voltages to its ArmorFlash product portfolio. Going forward, Macronix's non-volatile memory product families that include SLC NAND, NOR and eMMC will also incorporate ArmorFlash to enable complete data protection for automotive electronics.Comprehensive capacity selections to meet automotive applicationsAs automotive systems evolve with ever-increasing innovative features, they need increasingly larger memory capacity. Available in 8Mb to 8Gb capacities, Macronix's ArmorFlash products are designed to meet the two main market requirements: large capacity and robust security. The MX75 ArmorFlash Flash Memory solutions in BGA, SOP or KGD packages are being shipped to customers for authentication and crypto key protection purposes in wide-ranging IoT devices, automotive electronics, smart home products and industrial applications.Macronix attended 2019 Semicon Taiwan: Smart Transportation Forum, taking place September 18, 2019, and invited attendees to experience the enormous development potential of ArmorFlash in the automotive sector. Visit http://www.semicontaiwan.org/zh/node/14571 for more information.Macronix ArmorFlash memory optimal for secure authenticity & confidentiality

The global development in green energy has come under the international spotlight. Setting the goal of a capacity of 20GW for solar energy by the year 2025 shows the emphasis the Taiwanese government puts on green energy development in its non-nuclear power policy. Due to Taiwan's high population density and limited land space finding a suitable site for a 20GW capacity solar installation becomes a top priority.To this end, an increase in the number of land-diverse applications in reservoirs, ponds, salt flats, fish farms, and detention ponds as a solar power station is noticeable. The potentially harsh conditions such as high salt spray and high humidity and their effects on the feasibility of such solar power stations have also drawn attention and aroused discussions.PrimeVOLT, which has been actively working in the solar energy industry for many years and has established a prestigious reputation with the exceptional performance of their self-developed PV Inverters. The products' outstanding ability to withstand harsh operating conditions such as high salt spray and high humidity, has earned PrimeVOLT trust of investors and EPC in the solar energy industry. In addition to the largest market share in Penghu and the applications of their products for over five years, major projects with collaborating parties on reservoirs, ponds, and canals in Taiwan prove PrimeVOLT's leading position in the industry as a manufacturer of reliable solar inverter withstanding harsh environments. Accordig to Chuang Ching-Ming, general manager of PrimeVOLT, the future of green energy development in Taiwan is positive with market opportunity and potential. He also shares deeper insights about the product in the followings.Aluminum die-casting and uni-body design help to prolong lifetime and improve aestheticsChuang points out that PrimeVOLT's PV String Inverter is designed for medium to small output kW capacity and meets the requirements of withstanding high humidity and high salt spray for the applications near water. PrimeVOLT inverters have thus gained a solid reputation as products of choice for power plant construction in such environments.Utilizing aluminum die casting to create uni-body products is one of PrimeVOLT's core concepts. The absence of welding provides a tightly sealed design and waterproof function, allowing PrimeVOLT products to remain operational over long periods of time in adverse environmental conditions. Successful market strategies have helped PrimeVOLT break sales records year after year. The total combined wattage of installations for 2019 is expected to exceed 200MW. Growth rate over the past few years had always stayed above 50%, with certain years even achieving growth rates over 75%. In terms of domestic PV Inverter market share, PrimeVOLT has now climbed to the second place and is on its way to taking the crown.With the launch of 75kW flagship models, high capacity product production lines are rapidly expandingEven though String type inverters have advantages in better MPPT tracking performance, easiness of maintenance, and the ability to disperse risks of power losses when an inverter malfunctions. Photovoltaic power plants in Taiwan are inclined towards the use of Central PV Inverters for the quick installations and management convenience. In this respect, Chuang revealed PrimeVOLT's plans of developing high capacity and central PV inverters in alignment with market demands. For the time being, aside from continuously enhancing the competitive edge of PrimeVOLT's existing 3kW to 40kW string type models, PrimeVOLT plans to develop higher powered models this year.At the Energy Taiwan 2019, PrimeVOLT will showcase its new string-type models. In addition to models with restyled exterior appearances, more compact dimensions, lighter weight, higher efficiency, and better cost-effectiveness, 60kW and 75kW flagship models are also going to be debuted. In the future, products with even larger capacities will be brought onto the market to meet the needs of clients after taking market trends into consideration.Regarding long-term product planning, the R&D team, which has accumulated extensive technical know-how in the development of electronic energy products (uninterruptible power supplies/battery storage capacity applications), will dedicate their efforts to the development of renewable energy products (small scale wind/hydro power) in addition to PV Inverters that are even more competitive. The goal is to help clients realize improve efficiency and monetary gains with the use of innovative solutions that are designed and made in Taiwan. Aside from creating business opportunities through partnerships in the industry, we also hope to do our part in contributing to environmental cleanliness and Taiwan's future green energy developments.For more information about PrimeVOLT or its products, please visit us at booth J0909a, Energy Taiwan 2019, or visit PrimeVOLT's website: www.primevolt.com.twPrimeVOLT general manager Chuang Ching-MingPrimeVOLT new 75kW flagship model

Clientron Corp., a leading global provider of thin client, POS and embedded systems, introduces the brand new all-in-one thin client TC238 that features a 23.8" display with fanless and ultra-slim enclosure, and system designed with the concept of Intel Smart Display Module (Intel SDM) for optimized display computing. The TC238 AiO thin client runs on client-server architecture and can be implemented with major existing VDI protocols to deliver the best user computing experience for virtual desktop solutions.Easy deployment and maintenance to optimize user experienceThe TC238 AiO thin client designed with Intel Smart Display Module (SDM-Large) featuring open pluggable, flexible integration, easy deployment and maintenance design to reduce total cost of ownership.Energy-efficient and high performance for End user computingPowered by high performance and power efficient Intel Braswell x5-E8000 quad core processors, the TC238 AiO thin client supports DDR3L-1600 memory, storage options including mSATA SSD and on-board eMMC storages as manufacturing optional. The I/O connectors include two USB3.2 Gen 1 ports, two USB 2.0 ports, one DisplayPort, one DVI, audio ports as well as networking ability with a M.2 interface for WiFi and Bluetooth functionality.High-density viewing and space-saving benefitsFeaturing ultra-slim enclosure, the TC238 AiO thin client supports 23.8" full HD display and anti-glare panel for comfortable reading. Powered by one wire, it offers streamline and space-saving benefits for operations. In additions, it supports 4K display output to give users a rich, high-density viewing on external monitor.Enhanced system security & virtual desktop solutionsThe TC238 thin client supports Trusted Platform Module (TPM) by manufacturing optional for secure data protection. Moreover, it supports all mainstream virtual desktop protocols including Microsoft RDP/ RemoteFX/WVD, Citrix HDX, and VMware Horizon View to ensure high availability and seamless communication with other applications.The Clientron AiO thin client TC238 is available now. For more product details, please contact Clientron sales or visit our website www.clientron.com.Clientron AiO thin client TC238

Digi-Key Electronics, the global electronic components distributor, received the Electronics Components Distributor of the Year 2019 Award by Electronics Maker (EM) as part of their Best of Industry Awards."We are pleased to present the Digi-Key team with this top honor for their outstanding distribution work in the electronics components industry," said Arvind Kumar Vaid, chief editor for Electronics Maker. "High service distribution is key to moving this industry forward, and Digi-Key excels at this year after year."The award was presented to Digi-Key at the fifth annual EM Best of Industry Awards at The Stellar Gymkhana Club in Greater Noida, India.The EM Best of Industry Awards celebrates excellence in the market and honors leading performers that are driving the industry forward. The honorees are selected by an independent judging panel comprised of industry leaders and associations."It's an honor to be recognized by Electronics Maker in this space," said Jim Ricciardelli, executive vice president of digital business for Digi-Key Electronics. "Our customers in India and beyond are driving tremendous innovation with our products and we look forward to seeing their global innovation outputs over the next few years."Digi-Key offers a variety of EDA and Design Tools, including Scheme-it, an online schematic and block diagraming tool, and the DK IoT Studio, a fast way to create, deploy and manage complete embedded-to-cloud IoT solutions. They also offer many online conversion calculators and other free tools and resources to support engineers and makers.For more information about Digi-Key's broad product offering can be found by visiting www.digikey.com.Digi-Key awarded Electronics Components Distributor of the Year 2019 Award by Electronics Maker