SK Hynix announced today that it has developed the industry's first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process.The success marks the beginning of the extreme scaling to the level closer to 10nm in the memory process technology.The degree of difficulty in advancing the shrinking process of the 10nm-range DRAM technology has grown over generations, but SK Hynix has become the first in the industry to overcome the technological limitations by raising the level of completion in design, thanks to its industry-leading technology of the 1b, the fifth generation of the 10nm process.SK Hynix said it will be ready for mass production of the 1c DDR5 within the year to start volume shipment next year.In order to reduce potential errors stemming from the procedure of advancing the process and transfer the advantage of the 1b, which is widely applauded for its best-performing DRAM, in the most efficient way, the company extended the platform of the 1b DRAM for development of 1c.The new product comes with an improvement in cost competitiveness compared with the previous generation by adopting a new material in certain extreme ultraviolet (EUV) processes while optimizing the EUV application process of total. SK Hynix also enhanced productivity by more than 30% through technological innovation in design.The operating speed of the 1c DDR5, expected to be adopted for high-performance data centers, reached 8Gbps, an 11% improvement from the previous generation. With power efficiency also improved by more than 9%, SK Hynix expects the adoption of 1c DRAM to help data centers reduce electricity costs by as much as 30% at a time when the advancement of the AI era is leading to an increase in power consumption."We are committed to providing differentiated values to customers by applying the 1c technology equipped with the best performance and cost competitiveness to our major next-generation products including HBM, LPDDR6, and GDDR7," said Head of DRAM Development Kim Jonghwan. "We will continue to work towards maintaining the leadership in the DRAM space and position as the most trusted AI memory solution provider."*HBM(High Bandwidth Memory): a high-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to conventional DRAM products. Since the introduction of the first HBM, the generation has shifted to HBM2, HBM2E, HBM3, HBM3E, HBM4 and HBM4E. *LPDDR: low power DRAM for mobile devices, including smartphones and tablets, which aims to minimize power consumption and features low voltage operation. The latest specifications are for the 7th generation, succeeding the series that ends with 1, 2, 3, 4, 4X, 5, and 5X. *GDDR(Graphics DDR): a standard specification of graphics DRAM defined by the Joint Electron Device Engineering Council (JEDEC) and specialized for processing graphics more quickly. Its generation has shifted from GDDR3, GDDR5, GDDR5X, GDDR6 to GDDR7. With the newer generation promising faster speed and higher power efficiency, GDDR has now become one of the most popular memory chips for AI. About SK Hynix Inc.SK hynix Inc., headquartered in Korea, is the world's top-tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM"), flash memory chips ("NAND flash"), and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company's shares are traded on the Korean Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK Hynix is available at www.skhynix.com, news.skhynix.com.Media ContactSK Hynix Inc.Global Public RelationsTechnical LeaderKanga KongE-Mail: global_newsroom@skhynix.comTechnical LeaderSooyeon LeeE-Mail: global_newsroom@skhynix.com

Under the theme of "3S Open Lab Platform," 3S will present its achievements and advancements at SEMICON Taiwan 2024, showcasing the unique capabilities of the 3S Open Lab Platform.From September 4th to 6th, 3S Silicon Tech will be at Booth S7640 at Hall 2, Nangang Exhibition Center, introducing the cutting-edge developments of its Open Lab Platform tailored for power devices and power module assembly. The platform is designed to bridge the gap between innovative ideas and market-ready products, having already proven successful with global FABS, Fabless companies, OSATS, EMS, and leading IDM enterprises.3S Open Lab Platform: Turning smart ideas into tangible productsThe 3S Open Lab Platform is a pioneering initiative that offers a collaborative environment where opportunities and knowledge converge. Visitors will have the chance to explore how the platform supports the entire journey from concept to production, ensuring time-to-volume, time-to-market, and time-to-investment return for power chip and power module designers. Through a series of rigorous Design of Experiments (DOE), 3S Silicon Tech has mastered the transition from uncertainty to clarity, providing clients with the tools to overcome challenges and succeed in the competitive semiconductor landscape.Meet-the-Expert Session: Showcasing success stories in process optimizationAs part of SEMICON Taiwan's Smart Manufacturing Expo, 3S Silicon Tech will participate in the "Meet-the-Expert" event at the "Smart Manufacturing Arena." During this session, the team will share inspiring success stories from the Open Lab's continuous process optimization efforts and provide insights into the company's commitment to driving innovation through AI tools and data science to empower smart manufacturing.Join us at SEMICON Taiwan 20243S Silicon Tech cordially invites industry professionals to visit Booth S7640 to engage in insightful discussions on the latest technological advancements and explore collaborative opportunities. This event marks a significant milestone for 3S Silicon Tech as it continues to lead in providing cutting-edge solutions that drive the semiconductor industry forward.We look forward to welcoming you to our booth and sharing our journey of innovation and success.3S Silicon Tech Official Website: https://www.sss-tech.com.tw/

In today's fast-growing industry, the accuracy and stability of gas equipment are indispensable to semiconductor manufacturing. As an integrator in the gas field, Reliya Tech. has been vigorously promoting its own brand and has also introduced three leading brands, ASDevices, Simpure, and Tiger Optics, to the local market.In SEMICON 2024, Reliya will display a full range of products together with its technological innovation and top customer service. We sincerely expect a grand expo in the company of other established leaders in the semiconductor industry in Taiwan.During this year's Semiconductor Expo, which will be held from September 4th to 6th, we are glad to display the gas chromatograph Ka8000 and the intelligent gas calibration system (iGCS) of AS Devices, Purifier 7NG, 9NP003, and 9NP050 series of Cipro, as well as the micro oxygen analyzer of Tiger Optics. In addition, our gas particle counter, independently developed by Reliya's lab, will also be presented at the exhibition.Our gas particle counter has been well received by the industry since its launch, with sales in over 80 countries, including Taiwan, China, and Singapore. Besides, Reliya Technology has just acquired the certification of ISO 9001:2015 and ISO 45001:2018 this year, ensuring our accordance with high quality and industrial standard in manufacturing, installation, gas piping design, and construction of the instrument. Our gas particle counter will soon see its overseas sales in cooperation with companies in Europe and the United States.Innovation and Excellence in fechnologyEquipped with advanced sensors and a control system, ASDevices Ka8000 as a top GC solution is capable of regulating the gas flow with a high degree of accuracy to ensure control of each step in the manufacturing process. Also, the iGCS dilution device can operate in different environments with great stability, which endeavors to provide a stabilized gas supply and ensure its continuity and consistency.In a low-temperature setting, Simpure's purifiers allow the removal of impurities of H2 and He down to the ppt level with the feature of purging not only conventional impurities such as H2O, O2, CO, CO2, NMHC but also other impurities such as Ar, N2, CH4, etc. The purifiers are available in different flow rates and pressure ranges, which are trusted by leading gas companies and 12-inch semiconductor wafer factories. Among them, the 9N 120Nm3/h H2 purifier has performed well in a 12-inch semiconductor wafer fab, passing a comprehensive impurity test with all the criteria met. We can therefore proudly say that we definitely meet our client's requirements.Quality Customer SupportRelyea Technology not only provides top-end products but also values our instant and complete support for our customers. We aspire to take the lead in both technology and services to satisfy our customers' needs and assist them in their business goals.Tailor-made Solutions: Our team provides gas supply solutions tailored to each customer's needs. Prioritizing our clients' interests, we provide the best advice and solutions to different requests such as building a whole new plant and upgrading an existing system.Prompt Technical Support: Our team provides timely customer services at any time and in any place. Our technical professionals are dedicated to troubleshooting in the shortest time to ensure that our client's production is not interrupted.Comprehensive Training Program: Covering basic operation to advanced maintenance, we offer a comprehensive training program to assist our clients in maximizing the benefits of our products, which includes all the core knowledge and skills needed to attain the highest productivity.We cordially invite you to visit our booth and learn more about our products and commitment.Exhibition DetailsLocation: Taipei Nangang Exhibition Center, Hall 2, First floor, Booth Q5252Visiting hours: 10:00-17:00 4-6 September (Wed. - Fri)Contact: sales@reliya.com.twUp to date with the most advanced technology and the latest trends, we aim to deepen our exploration and contributions in gas purification equipment and gas analyzers. We are looking forward to your visit on-site.

Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications. Loctite Eccobond UF 9000AE protects large die within flip-chip BGA (FCBGA), high-density fan-out (HD-FO), and 2.5-D advanced packaging devices.HD-FO and 2.5-D wafer-level packaging techniques have seen significant progress in the last ten years, having achieved dramatic increases in I/O, efficiency, and performance, making them a key enabler of AI growth in the data center and at the edge. With high-density thin, large die (>40 mm x 40 mm) and substantial package body sizes (>100 mm x 100 mm), emerging AI and HPC devices for certain applications can contain more than 2,000 fine-pitch (~100 µm), low gap height (~50 µm) interconnects per die. Bump protection and warpage control are critical for device functionality and optimized package performance. However, achieving thorough bump encapsulation at flow rates that deliver coverage efficiency can be challenging, given the cutting-edge architectural complexity.Henkel has developed a brand-new capillary underfill formulation that meets the dimensional demands of highly integrated package designs. Loctite Eccobond UF 9000AE completely envelops fine-pitch, low gap height die interconnects for rigid protection against stress to deliver good electrical, moisture, and thermal reliability performance for high production yields. The material's low shrinkage and toughness provide die and underfill crack resistance, while its low coefficient of thermal expansion (CTE) protects against warpage. Loctite Eccobond UF 9000AE also has low resin bleed out (RBO) and forms narrow fillets, allowing the dense die integration inherent in advanced packaging techniques.Henkel Global Market Segment Head for Semiconductor Packaging Materials, Ramachandran (Ram) Trichur, acknowledges that while thorough, rugged bump protection against thermal cycling strain and mechanical damage is the highest underfill priority, processability is critical to achieving throughput and yield objectives."Loctite Eccobond UF 9000AE delivers no-voiding bump encapsulation of flip-chip BGA, Cu pillar, and other high-density interconnects, which is fundamental to preserving the value and function of these high-performance devices," Trichur says. "Notably, however, this material does so faster than our prior generation underfills, allowing for greater flow efficiency, which is an important feature for complete interconnect coverage and encapsulation across large surface areas."In internal testing versus previous generation capillary underfills, Loctite Eccobond UF 9000AE demonstrated 20% faster flow* on a 40 mm x 40 mm die, indicating that this material is compatible with even larger die sizes. Its edge-to-edge capillary flow efficiency ensures interconnect encapsulation before any material gelation, eliminating the risk of exposed bumps. So far, Loctite Eccobond UF 9000AE's performance has been validated on die as large as 50 mm x 50 mm and within packages up to 110 mm x 110 mm."The rise of AI underscores semiconductor packaging ingenuity and its ability to drive remarkable levels of computing power and cost-effective scaling alternatives to Moore's Law," Trichur says, citing the well-publicized growth of 2.5-D chip-on-wafer and 3-D advanced packages. "Henkel has been at the forefront of enabling these devices with novel semiconductor materials, and our new underfill further demonstrates our contributions to this dynamic market space."Learn more about Henkel's advanced semiconductor packaging materials at www.henkel-adheisves.com.LOCTITE® is a registered trademark of Henkel and/or its affiliates in the USA, Germany, and elsewhere.*Die size dependent. About HenkelWith its brands, innovations, and technologies, Henkel holds leading market positions worldwide in the industrial and consumer businesses. The business unit Adhesive Technologies is the global leader in the market for adhesives, sealants, and functional coatings. With Consumer Brands, the company holds leading positions especially in laundry & home care, and hair in many markets and categories around the world. The company's three strongest brands are Loctite, Persil, and Schwarzkopf. In fiscal 2023, Henkel reported sales of more than 21.5 billion euros and adjusted operating profit of around 2.6 billion euros. Henkel's preferred shares are listed in the German stock index DAX. Sustainability has a long tradition at Henkel, and the company has a clear sustainability strategy with specific targets. Henkel was founded in 1876 and today employs a diverse team of about 48,000 people worldwide – united by a strong corporate culture, shared values, and a common purpose: "Pioneers at heart for the good of generations." More information at www.henkel.comPhoto material is available at www.henkel.com/pressContact Sebastian HinzPhone +49 211 797-85 94Email sebastian.hinz@henkel.comHenkel AG & Co. KGaA

ASUS VivoWatch is a series of smart wearable devices that serve as a comprehensive personal health management platform for users through precise physiological monitoring.In response to the needs of users, a new model in the series, the VivoWatch 6, was released in 2024, offering enhanced features. According to ASUS, the new VivoWatch continues the company's tradition of smart health watches equipped with two sets of medical-grade electrical and optical PPG sensors. The watch allows users to measure their blood pressure and ECG anytime and anywhere with just their fingertips.The device can integrate and analyze various physiological and lifestyle data and provide personalized suggestions to improve health based on AI algorithms. In addition, the watch's hardware and software functions have also been improved to meet users' long-term health management needs.Harnessing the power of technology to manage physical health has become a major trend for people and medical institutions around the world. A recent in-depth market study conducted by ASUS with nearly 1,300 users revealed that the group of people who are actively interested in their health is gradually expanding from the middle and upper age groups in the past to the lower age groups.Today, users expect wearable devices to consistently and accurately record physiological data and provide insights about their health that integrate information from their entire lives. The survey also showed that wearable devices are gaining popularity among all types of users. Even if they already own traditional devices such as blood pressure monitors, more than 80% of people are willing to opt for wearable devices that can collect physiological data at any time to get a comprehensive overview of their body condition.To meet the needs of users, the VivoWatch 6 has introduced a range of innovative functions. Firstly, body composition analysis has been added, which uses bioimpedance technology to accurately measure indicators such as body fat, water, and muscle percentage, providing more comprehensive data support for body health management.In terms of sports monitoring, the VivoWatch 6 is equipped with a high-precision dual-frequency GPS that allows outdoor sports enthusiasts to determine their position faster and more accurately, making sports records more complete and reliable. The dual-frequency GPS can also be used to track the elderly and ensure their safety.Family members can use the watch's GPS data to find out where the wearer is. In addition, the built-in fall detection function automatically sends alerts and location information to the predefined emergency contact as soon as it detects a fall so that medical assistance can be provided in the critical moments after the accident.In terms of hardware, the VivoWatch 6 has a high-resolution AMOLED display that offers an excellent viewing experience. A new physical shortcut button on the side of the watch allows users to set and access frequently used functions with a single press.At the same time, the VivoWatch 6 offers a battery life of up to 7 days with a variety of health monitoring functions turned on, which can be extended to up to 14 days in power-saving mode to ensure that users can keep an eye on the condition of their body. It is also worth mentioning that the blood pressure and ECG application software developed by ASUS has passed the TFDA medical software certification, earning users' confidence in their professional functionality.Powered by proprietary hardware and software, the VivoWatch 6 demonstrates strong potential for cloud integration. Not only can the watch support industry players in the fields of healthcare management, clinical drug research, and occupational health and safety, but the data it collects can also be seamlessly uploaded to cloud platforms, offering a wide range of applications for healthcare providers and academic research institutions.For example, medical teams can integrate the data from the VivoWatch 6 into their hospital's system to gain real-time insights into the health of their patients. In clinical pharmaceutical studies, the watch can be used to track long-term physical changes in test subjects before and after the administration of medication.In the field of occupational health and safety, the VivoWatch 6 can help management objectively assess employee fatigue and prevent occupational safety accidents. These applications fully demonstrate the potential of the VivoWatch series on the commercial market.Through intensive cooperation with various industries, the VivoWatch 6 is expected to become an important vehicle for innovative business models. For example, insurance companies can develop premium discount plans based on the personal health data provided by the watch, while health management service providers can use the device to deliver remote and customized health services, improving management efficiency and service quality.In addition, ASUS has announced that its AI Coaching Platform, which will be officially launched in October this year, will be able to integrate users' physiological data and daily life information collected by the VivoWatch 6 to build a comprehensive and in-depth database of health data. The platform will use AI algorithms to analyze users' health patterns and potential health risks and make recommendations to improve their health, taking care of users' health in every way.According to ASUS, the VivoWatch series has already shown promising results in overseas markets. In Southeast Asia, ASUS has joined hands with Thailand's renowned high-end health examination centers and elderly care providers to build an innovative model for digital healthcare services.The health examination centers use the VivoWatch to collect long-term health data of the elderly to develop personalized health management plans and use the data to promote remote care. In Spain, ASUS has partnered with local healthcare organizations to integrate the VivoWatch into a medical metaverse blueprint. Physicians can use VivoWatch's remote health monitoring capabilities to fully track changes in patients' daily physical condition and enable more accurate diagnosis and treatment.The VivoWatch 6 demonstrates ASUS' technological capabilities and innovative thinking in using technology for health management. In the future, ASUS will continue to work with partners in various fields to accelerate the implementation of the VivoWatch series into the smart healthcare ecosystem and bring more benefits to the health of the public.In terms of hardware, the VivoWatch 6 has a high-resolution AMOLED display that offers an excellent viewing experience. Credit: Asus

WebX2024 is a global Web3 conference organized and managed by CoinPost, Japan's largest cryptocurrency and Web3 media outlet.Two days opening the door to Web3 industry utilizationGiven the development of regulation, the Japanese government and major corporations attempting Web3 expansion will participate in large numbers. Centered on the theme of Web3's industrial expansion, drawing participants from around the world to gather.With approximately 180 exhibiting companies, about 250 speakers (50/50 ratio of Japanese to international sessions), and around 130 media partners, becoming the largest conference in Asia.Many major companies from globally renowned Japanese industries such as anime and gaming will be among the exhibitors, providing opportunities for interaction with global attendees.Well known DJ Steve Aoki will participate in the opening party to Kick-off WebX 2024.Well known DJ Steve Aoki will participate in the opening party to Kick-off WebX 2024Seeing the future of Web3 mass adoption in Japan- Date: August 28-29, 2024- Location: Tokyo, Japan - THE PRINCE PARK TOWER TOKYO- Organized by: CoinPost - Japan's largest Web3 and cryptocurrency mediaWith the focus on "Accelerating the Adoption and Social Implementation of Web3 Technologies," will offer opportunities for acquiring business ideas and forging connections, thereby contributing to the advancement of Web3 technologies.Why attend in person- Exclusive on-site speaker sessions: Prominent speakers from around the world, with recorded sessions available for ticket holders- Access to exhibition areas of over 180 companies outside the Web3 industry- Participation in IP and Gaming areas: Companies like Kodansha, Capcom, Toho, Square Enix, etc. will participate- Access to networking areas and events (available for Business ticket holders and above)- Participation in over 100 associated side events: complimentary taxi service to side event venues during WebXASIA TOUR and TOKYO blockchain weekASIA TOUR and TOKYO Blockchain Week1. DAO TOKYO2024 (TOKYO / JAPAN)August 21 (Wed.) - 22 (Thu.), 20242. Coinfest Asia 2024 (BALI / INDONESIA)August 22 (Thu.) - 23 (Fri.), 20243. ETHTokyo'24 (TOKYO / JAPAN)August 23 (Fri.) - 26 (Mon.), 20244. WebX2024 (TOKYO / JAPAN)August 28 (Wed.) - 29 (Thu.), 20245. Korea Blockchain Week 2024 (SEOUL / KOREA)September 1 (Sun.) - 7 (Sat.), 2024WebX featured speakers- Fumio Kishida (Japan / Prime Minister)- Masaaki TAIRA (Member of House of Representatives / Head, web3 Project Team, LDP)- Yuriko Koike (Tokyo Metropolitan Government / Governor of Tokyo)- Richard Teng (Binance / CEO)- Audrey Tang (Plurality / Taiwan's First Digital Minister, Co-founder)- Naohiko UENO (TOYOTA Blockchain Lab)- Ken Kanetomo (Konami Digital)- Kosuke Hamasaki (Sanrio - famously known for Hello Kitty)Status of the eventExclusive Discount CodeWe are offering a 20% discount code exclusively for those who have seen this release.20% Discount Link: https://events.bizzabo.com/570958/page/3518018/registration?promo=WebX_hfyrksu7[View WebX Homepage]

As the wave of smart technology sweeps across industries, leveraging digital platforms to enhance operational efficiency and innovate business models has become a key strategy for field operators to strengthen their competitiveness. DataVan, which has built a strong market reputation in the food, beverage, and retail sector through its comprehensive product line and service quality, has been actively transforming in recent years. In addition to continuing to deepen its presence in existing industries, the company is extending its product reach into the building sector. Chih-Cheng Yu, General Manager of DataVan, pointed out that DataVan is one of the few companies in Taiwan that boasts of dual expertise in technology and architecture. Moving forward, they will leverage this advantage to provide tailored smart solutions for areas such as building management planning and healthcare.Chih-Cheng Yu stated that while DataVan has long been established in the food, beverage, and retail sector with a solid foundation, the competition for products like POS and Kiosk is becoming increasingly fierce. Transforming is a key strategy for maintaining competitiveness and exploring new markets. DataVan sees great potential in the application of smart building systems and enterprise visitor systems for community management and commercial office spaces. They aim to drive hardware sales through software, thereby enhancing product value. He emphasized that in addition to technological expertise, the group also has a background in real estate development and marketing. Leveraging these two professional advantages, DataVan can closely integrate smart systems with real estate development, bringing new niches to real estate developers and achieving a synergistic effect greater than the sum of its parts. Using the example of urban renewal for aging buildings, he explained that smart building systems can help developers obtain additional floor area incentives and address issues such as high management fees and inadequate security in small communities. This demonstrates that DataVan's transformation strategy not only responds to market demands but also opens up new growth opportunities for the company.Regarding its dual expertise in technology and real estate development, as well as the integration of AI into real estate products, Chih-Cheng Yu mentioned that DataVan recognizes the significant impact AI has had on various industries. Therefore, AI is viewed as a key driver of their transformation, with a focus on enhancing product intelligence through AI to create more efficient and customized solutions. For example, in smart hotel management, AI can enable self-service operations and streamlined staffing, significantly improving management efficiency, reducing personnel costs, and enhancing guest experiences. In the smart building sector, AI will be pervasive, effectively improving operational efficiency and comfort through systems such as smart security, energy management, and automated controls.Chih-Cheng Yu further pointed out that urban smartification has become an established industry trend. DataVan will seize this opportunity, leveraging its technological advantages and market experience to actively expand its smart building business. Currently, a series of innovative applications are planned, encompassing environmental control and health protection, landscape and building management, as well as personalized services. In environmental control, DataVan will help operators implement smart temperature and humidity regulation, air purification, and smart lighting systems, while also improving accessibility features and fall prevention designs to ensure resident safety. This also includes landscape maintenance systems for building exteriors and public spaces, exterior wall lighting control, and climate monitoring and warning systems, all aimed at optimizing building management efficiency. For personalized resident needs, DataVan plans to offer services such as appointment-based cleaning and maintenance, as well as smart concierge systems, significantly enhancing daily convenience. He believes that these innovative applications will not only strengthen DataVan's competitive advantage in the market but also create more business opportunities and growth potential for the smart building industry.To achieve this vision, DataVan is significantly adjusting its product strategy, shifting from a traditional hardware supplier to a comprehensive smart solutions provider. Chih-Cheng Yu revealed that the company's focus this year will be on enhancing the intelligence of existing products and introducing self-service solutions that require minimal management. Regarding smart functionalities, DataVan has bolstered its investment in AI and IoT technologies to optimize product performance and user convenience. For instance, they have introduced a new generation of POS systems with advanced data processing capabilities that seamlessly integrate with various smart devices. This series also includes applications such as the smart hotel management solutions showcased by DataVan at Computex this year. These solutions encompass self-check-in systems, room service management, and energy management systems, which help hotel operators reduce operating costs and improve service quality.Additionally, DataVan is actively pursuing cross-domain collaborations with construction project supervision, managed hotel-style apartments, long-term care, and senior living residences. Recently, the company acquired a highly-rated Japanese hot spring hotel, renaming it "Hodakaso Sangetsu," as a strategic entry into the Japanese market. Chih-Cheng Yu mentioned that this historic hot spring hotel, renowned for its valuable interior decor and cultural significance, will be integrated with smart systems to serve as a unique demonstration site for smart hotels. This will provide a reference model for Japanese operators interested in adopting such systems and allow DataVan to gain deeper insights into the Japanese market through practical operations, ultimately optimizing its products and services and laying the foundation for global expansion.Chih-Cheng Yu concluded that integrating technology with architectural expertise and creating new business models is only the beginning of DataVan's transformation. In response to the trend towards smart solutions, DataVan will continue to deepen its presence in the food, beverage, and retail markets and, with its high level of innovation and market insight, actively pursue cross-domain collaborations and expand product applications to meet the diverse smart needs of different sectors, creating a win-win scenario for both clients and DataVan.Chih-Cheng Yu, General Manager of DataVan, noted that the company is one of the few in Taiwan with dual expertise in technology and architecture. Moving forward, they will leverage this advantage to provide smart solutions tailored to the real estate sector.Photo: DIGITIMES

In the semiconductor industry, maintaining the highest quality control standards is paramount. With the industry evolving and the demand for semiconductors surging, product integrity and reliability have become increasingly critical. The open market — known for its speed, variety, and flexibility — is vital in meeting these demands by providing access to a diverse range of suppliers and components. However, this also highlights the necessity for stringent quality control measures.Fusion Worldwide stands at the forefront of this challenge, offering unparalleled quality control processes that set the benchmark for the industry.Read on to learn more about the importance (and the future) of quality control — but you'll need to download our Buyer's Guide to Quality Control to get a better understanding of how Fusion maintains the highest quality standards in electronic component testing and how that can benefit your company.Download the Buyer's Guide to Quality ControlUnderstanding quality control in semiconductor distributionWhy quality control matters:Quality control in semiconductor distribution is essential throughout the supply chain process — especially in the open market, where the risk of counterfeit components is higher. Here's why.Reliability: Quality control ensures components function correctly and consistently.Safety: Quality control prevents potential malfunctions that could lead to safety hazards.Performance: Quality control guarantees components meet the required standards.Reputation: Quality control helps maintain a company's reputation in the market.The semiconductor industry changes quickly — while also enforcing strict policies — and quality drops can harm the product. This means that any deviation from quality standards can significantly affect the immediate product and potentially cause downstream failures in larger systems.Learn more about our vendor qualification and management practices that support these high standards.Our quality control processEvery single part we source undergoes our extensive 100-point inspection process. We use the same system in all our quality control centers to guarantee everything is clear, traceable, and accountable throughout the supply chain.Download the Quality Control Guide for a more detailed view of the six-step process. Step 1: photography & reviewThe first step in our quality control process is to document the condition of each component when we receive it.Step 2: barcode scanning & reviewBarcode scanning provides transparency and traceability, tracking components throughout the supply chain.Step 3: visual inspection Visual inspection is essential to find any immediate physical defects or inconsistencies in critical components.Step 4: lab inspectionLab inspection involves detailed examination and testing of semiconductor components in a controlled lab environment.Step 5: electrical testingElectrical testing involves assessing the electrical characteristics of semiconductor components to meet the required electrical specifications and perform reliably.Step 6: packaging and shipping Proper packaging and shipping are crucial to prevent damage during transit. Fusion Worldwide uses industry-standard methods to package semiconductors securely, ensuring they arrive in perfect condition.What sets Fusion Worldwide's quality assurance standards apartAt Fusion Worldwide, quality is not just a requirement but a commitment. Our rigorous quality control processes guarantee that every component we distribute meets the highest standards of reliability and performance. We are committed to continuously investing in advanced testing facilities and the latest technology. These processes also lead to streamlined operations, contributing to overall cost savings and improved operational efficiency.Comprehensive testing and inspectionOur quality control centers have the latest technology and a skilled inspection team. We follow a 100-point inspection process to verify every component is tested thoroughly. We also carefully document each step so that every item and action is traceable.Global quality control centersWe have several quality control centers around the world, and each one is strategically placed to serve our global customers effectively. Each center follows the same procedures and maintains the highest security and environmental standards, ensuring our quality control is always consistent and reliable.Advanced technology and expertiseOur quality control centers are armed with the latest technology and staffed by experts in their field. This combination detects and addresses even the most minor defects or inconsistencies in semiconductor components. What's next in quality control — industry trends and future outlookAs technology advances, so do the methods and processes for ensuring the highest quality in semiconductor distribution. New technologies and artificial intelligence advancements — specifically, machine learning — are key to enhancing the accuracy and efficiency of quality control processes.The role of AI in quality controlAI is revolutionizing quality control in the semiconductor industry. Companies can use machine learning algorithms to detect defects more accurately and reduce inspection times. AI systems also have the ability to quickly analyze vast amounts of data, finding patterns and anomalies that human inspectors might miss. This leads to more reliable and consistent quality checks.Future outlook: The use of AI-driven quality control is expected to grow, leading to more efficient and accurate inspections. This will enhance quality standards and reduce the likelihood of defects slipping through the cracks.Advancements in testing technologiesNew testing technologies are also making inspections of semiconductor components more detailed and accurate. XRF analysis and advanced microscopy give deeper insights into material composition and defects.Future outlook: Continuous improvement in testing technologies is expected, further raising quality standards in the semiconductor industry. As they become more sophisticated, these technologies will provide even greater precision and reliability in quality control.Bottom line: quality starts with Fusion WorldwideFusion Worldwide's thorough, industry-leading quality control processes are second to none. Our commitment to quality guarantees that our clients receive the best products and experiences, reducing risks and improving performance every step of the way.By choosing Fusion Worldwide, you get a supplier and a partner dedicated to delivering the highest quality standards in semiconductor distribution. Our rigorous quality control processes and state-of-the-art facilities ensure you receive reliable and high-performing components every time.Discover why Fusion Worldwide's quality standards are superior. Learn more about our quality control in semiconductor distribution in our Buyer's Guide.Download the Buyer's Guide to Quality Control

With the rise and widespread application of Artificial Intelligence (AI) technology, apart from the popular autonomous driving systems in the automotive market, a significant number of software-defined automotive systems are also experiencing rapid growth. These software-managed systems create new passenger and driving experiences. Behind these cutting-edge smart solutions, primary concerns about AI revolve around "information security and cybersecurity" protection, thereby catalyzing the rapid adoption of the secure flash memory.Macronix faced an urgent need to meet memory security requirements for automotive and industrial control electronic data, to ensure confidentiality, integrity, and availability. To address this, they developed the ArmorFlash series of secure flash memory solutions. These solutions include key establishment, encryption, decryption, authentication, and anti-tamper functions. Additionally, a true random number generator is integrated into the memory chips for secure ID or key configurations. ArmorFlash supports various security functions such as identity authentication, crypto key, and secure-boot mechanisms. The ArmorFlash series has received recognition from international autonomous-driving and microcontroller unit (MCU) chip giants, and has earned accolades such as the Taiwan Excellence Award.The ArmorFlash MX78 series fully complies with ISO/SAE 21434 Information Security Standard CertificationThe ISO/SAE 21434 Standard was officially released at the end of August 2021, covering the entire vehicle lifecycle and emphasizing the requirements for cybersecurity risk management. Macronix promptly formed a project team to intensively prepare for the ArmorFlash MX78 series' standard certification, first passing TARA verification activities to assess various scenarios in which threats occur and determine solutions when encountering information security attacks. They also obtained the ISO/SAE 21434 threat analysis and risk assessments (TARA) verification report on June 2022, subsequently achieving full ISO/SAE 21434 Information Security Standard Product Certification in 2024, which marked a significant milestone in cybersecurity design.The enhanced data access performance of ArmorFlash enhances brand customer user experienceDr. Donald Huang, director of product marketing at Macronix, emphasized in an interview that advancements in AI applications, such as AI, edge computing, 5G and autonomous driving, are leading to exponential growth in data volume, thus driving the demand for memory. With AI applications increasingly capable of operating independently on multiple terminal devices and personal electronics, secure flash memory plays a crucial role in enhancing system security.To enhance user experience, the third-generation ArmorFlash MX78 series has been redesigned with a renewed focus on the speed of accessing data. It currently operates more than one hundred times faster than the previous generation of ArmorFlash. This enhancement significantly aids electronic devices in smoothly executing critical security functions during startup, thereby improving overall user operational experience. In an era where speed is paramount across various applications, the access speed of secure memory undoubtedly plays a crucial role in maintaining optimal brand reputation and product quality.Additionally, ArmorFlash's integrated design consolidates all security functions into a single memory chip, meeting critical security certification standards. This contrasts with typical practices whereby chip manufacturers require additional security chips for specific certifications. Furthermore, ArmorFlash uses a standard Serial Peripheral Interface (SPI) that is pin-to-pin compatible with standard NOR Flash SPI or OctaBus interfaces, unlike products using proprietary interfaces. By integrating the standard SPI interface into a single-chip design, ArmorFlash significantly reduces design complexity for engineering teams. This approach not only enhances product performance but also accelerates volume production and time-to-market, providing a competitive edge in seizing valuable market opportunities.ArmorFlash earns favor from leading global automotive OEMs, automotive electronics manufacturers, and industrial control giantsSince 2019, Macronix's first-generation ArmorFlash has been integrated within NVIDIA's Level 2+ to Level 5 autonomous driving systems, including the DRIVE AGX Xavier and AGX Pegasus autonomous vehicle computing platforms. By leveraging robust secure memory capabilities, ArmorFlash has strengthened data security in autonomous systems and enhanced driver safety.The second and third generations of the ArmorFlash MX78 series have now achieved ISO/SAE 21434 standards, putting focus on "cybersecurity" design. This accomplishment has facilitated Macronix's memory products to secure significant partnerships with major international autonomous driving solution providers and automotive MCU chip manufacturers, as well as adoption by leading automotive and automotive electronics manufacturers.Beyond the automotive sector, ArmorFlash chips are also employed in industrial control and embedded application systems, such as Japan's Renesas Electronics RA series of MCUs. By utilizing ArmorFlash chips featuring integrated hardware encryption accelerators, cybersecurity is bolstered, and more secure and dependable network connections across various embedded applications are ensured.In addition to the aforementioned technologies, ArmorFlash also offers a physical unclonable function (PUF), which functions similarly to chip biometrics with a fundamental encoding method. This equips the chip with a chip fingerprint capability, providing memory chips with unique, unpredictable physical characteristics and non-replicable key features. These properties offer high-level encryption and are applied in various information security and confidentiality applications.Huang emphasized that the identification and prevention of potential information security and cybersecurity threats is an ongoing pursuit. Macronix has already obtained automotive information security standard certifications but continues to reinforce efforts at every stage, from product design and development to volume production and market launch. This ongoing effort aims to identify potential threats and security vulnerabilities, establishing a common foundation for cybersecurity risk management. The newly launched ArmorFlash MX78 series of flash memory solutions significantly shortens the time to market for customers' products, meeting the urgent needs for the automotive, industrial control, and embedded application markets. Through ArmorFlash technology, Macronix is in a strong position to expand its international market presence and continue collaborating with global customers to sustain its success.Macronix ArmorFlash MX78 Serie Achieves ISO/SAE 21434 Information Security Standard Product Certification

Mexico: powering the future with electronics, semiconductors, and AIFor decades, the narrative surrounding electronics manufacturing has revolved around giants like China, South Korea, and Taiwan. However, a new contender is emerging in Mexico. Mexico's electronics industry is experiencing a remarkable surge, transforming the nation into a powerhouse for semiconductors, AI applications, and beyond.Despite the exciting prospects, Mexico's electronics industry faces several challenges. Upgrading infrastructure, particularly reliable power grids and advanced cleanroom facilities, is crucial for attracting top-tier chip fabrication companies. Additionally, developing a skilled workforce capable of handling complex AI projects requires ongoing investment in education and training programs.However, the opportunities are vast. The Mexican government's commitment to infrastructure development and education, coupled with potential foreign investment seeking to diversify supply chains, paints a bright future. Mexico's young and tech-savvy population creates a fertile ground for fostering a dynamic AI innovation hub.Mexico: a land of opportunityMexico's electronics industry is a sleeping giant awakening. With its strategic location, skilled workforce, and growing focus on cutting-edge technologies, the nation is poised to become a major player in the global electronics landscape. This presents a wealth of opportunities for companies seeking to tap into new markets and optimize their operations. Mexico's electronics industry has witnessed significant growth in recent years. This can be attributed to several factors:Strategic location: Mexico boasts a prime location bordering the United States, offering proximity to a massive consumer market and simplified logistics for North American companies.Free trade agreements: Trade agreements like USMCA (previously NAFTA) have facilitated the smooth flow of components and finished goods between Mexico, the US, and Canada.Cost-effectiveness: Compared to some Asian counterparts, Mexico offers competitive production costs while maintaining high-quality standards. This makes it an attractive option for companies seeking to optimize their supply chains.Mexico's strategic role in the global semiconductor ecosystemWhile Mexico may not yet be manufacturing the most advanced chips, its role in the global semiconductor ecosystem is crucial. The nation excels in assembly and packaging, the vital final steps before a chip reaches its end user. This "middle ground" position allows Mexico to capitalize on the booming electronics market without requiring massive investments in top-tier fabrication facilities.Mexico's contributions extend beyond hardware; the country is also embracing AI's potential. The government actively supports AI development through R&D grants and collaborations between research institutions, universities, and private companies. This focus on fostering innovation positions Mexico at the forefront of applying AI solutions in various sectors, from optimizing agricultural practices to automating industrial processes.Mexico's geographical advantage is undeniable. Sharing a border with the US, the world's largest consumer electronics market offers unparalleled access and streamlined logistics. But Mexico isn't just about proximity. The nation boasts a highly competitive production cost structure compared to traditional manufacturing hubs. While Mexico doesn't manufacture the most advanced semiconductors, it excels in assembly and packaging. This "middle ground" offers several advantages:Faster time to market: Companies can leverage established Mexican facilities to get products to market quicker than building new fabs from scratch.Cost-effectiveness: Mexico offers competitive labor costs compared to some traditional manufacturing hubs.Proximity to the US market: Quick and efficient movement of components between Mexico and the US streamlines production processes.By leveraging its strengths in assembly and packaging and strong commitment to AI development, Mexico is strategically positioned to play a pivotal role in the global electronics and semiconductor industries.Mexico's electronics industry: major investments signal a bright futureMicron, a leading memory chipmaker, has announced plans to invest billions of dollars in a semiconductor engineering center in Mexico. This significant investment underscores Mexico's potential to move beyond assembly and packaging, positioning itself as a key player in advanced chip fabrication.Similarly, Foxconn, a major electronics manufacturer, is expanding its operations in Mexico. The company is reportedly considering establishing facilities to produce artificial intelligence (AI) hardware, a move that would further solidify Mexico's position as a hub for cutting-edge technology.These concrete developments signal a significant shift in the global electronics landscape. Mexico's rise as a major player presents exciting opportunities for companies looking to diversify their supply chains and tap into a growing market.Unlock Opportunities in Mexico's Booming Electronics Sector with Fusion WorldwideThe future of Mexico's electronics industry is promising, with both challenges and opportunities on the horizon. With strategic investments and continued support, Mexico's thriving electronics sector offers many opportunities for businesses looking to expand. Fusion Worldwide, with our strong presence in Guadalajara, Mexico, is perfectly positioned to help you navigate this dynamic market.Christopher Kolodko, VP of Sales for America, elaborates, "Fusion Worldwide excels in sourcing reliable suppliers, managing complex cross-border logistics, and bridging language barriers. Beyond simple transactions, we provide strategic advice on the Mexican market and emerging technologies."With Fusion Worldwide as your guide, you can unlock the exciting possibilities of the Mexican electronics industry. Our local presence, global network, and industry expertise empower you to seize this dynamic market's opportunities. Contact us to discover how we can work together to build a successful future in Mexico's electronics revolution.Alan ChewStrategic Account DirectorFusion WorldwideTo learn more, visit fusionww.com or follow us on LinkedIn, Facebook, Instagram, and X.Download Fusion Worldwide's State of the Industry Report Volume 1.About Fusion WorldwideFusion Worldwide is the preeminent open-market distributor of electronic components and products. We source, inspect, test, and deliver a wide range of components to a large and diversified customer base that includes OEMs, CMs, and ODMs across a wide array of verticals. Founded in 2001, Fusion is headquartered in Portsmouth, New Hampshire, and maintains offices and quality centers in major manufacturing hubs worldwide.