In today's swiftly evolving digital landscape, businesses are confronted with an unending array of threats from cybercriminals who are ceaselessly seeking to exploit vulnerabilities and compromise sensitive data. We present an exclusive interview with RuoJian, the General Manager of CloudCoffer. RuoJian introduces us to the revolutionary Web Application Firewall (MatrixShield) and the cutting-edge Sandbox technology (SandSphere). CloudCoffer, trusted by banks, corporations, and governments globally, has played a pivotal role in enabling customers to detect malicious code and prevent cyber threats. Their platform facilitates customized customer features, ensuring holistic protection in the ever-changing realm of cyber threats.In the ongoing battle against cyber criminals, time holds paramount significance. CloudCoffer's cloud-based WAF harnesses the power of advanced artificial intelligence, empowering organizations to promptly counter emerging security vulnerabilities without any lag. With a cadre of adept researchers, a repository of top-tier threat intelligence, and a network of global honeypots, CloudCoffer maintains ceaseless vigilance over the worldwide threat landscape. This proactive approach permits real-time scrutiny against the latest threats and blocks attacks in the cloud, so malicious traffic is not sent to the systems of clients. CloudCoffer's track record boasts the identification and thwarting of both well-known and zero-day issues, thereby averting potential security breaches. On an average scale, at MatrixShield, their monthly detection encompasses hundreds of zero-day attacks.Their malware detection system–SandSphere, capitalizes on advanced machine learning algorithms and a blend of static and dynamic analysis, exhibiting prowess in pinpointing and neutralizing zero-day malicious codes even before it's officially recognized. Clients can place their trust in the cutting-edge technology of CloudCoffer, safeguarding their mission-critical systems against the most intricate cyber intrusions by scanning their codes with SandSphere.Besides, CloudCoffer has unearthed a prevalent issue. Despite banks' earnest endeavors to mitigate security risks, many face challenges in verifying security concerns within their source codes. The three foremost challenges are as follows:Infiltrated Backdoors:Certain backdoors originate from external vendors and supply chains, while others stem from open-source contributions.Leaked Testing Systems:In live production environments, confidential intranet system details like domain names and IP addresses are inadvertently exposed, furnishing attackers with essential information to target and breach critical systems.Compromised 3rd-Party Systems:Banking application codes often incorporate elements from third-party sites, but a fraction of these sites could be compromised. This presents a scenario where banks inadvertently invoke malicious code during dynamic interactions.After scrutinizing 50 banking applications from around the world, the findings reveal that 28% are vulnerable to Issue #1, 20% are vulnerable to Issue #2, and 84% are vulnerable to Issue #3RuoJian highlights that modern attackers are smart enough to conceal malicious codes to bypass most antivirus solutions. When developers include codes from open sources, malware may be packed into the codes already, but there are very few effective solutions to identify these types of issues. To secure systems effectively, it is a must to review critical systems codes. CloudCoffer also offers a campaign to check for codes. This initiative serves as a resounding testament to CloudCoffer's unwavering commitment to fortifying digital landscapes against evolving threats.

DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, today announced that it has partnered with Ambiq to distribute its ultra-low power semiconductors globally.Through the new partnership, DigiKey is now stocking Ambiq's Apollo4 Blue Plus. With one of the lowest dynamic powers for microcontrollers currently on the market, the new SoC allows designers of next-generation wearables and battery-operated smart devices to accelerate their innovation."DigiKey is pleased to add Ambiq to our core supplier line card," said David Stein, vice president of semiconductors at DigiKey. "As a leader in low-power SoC solutions, Ambiq has raised the bar with their new MCU & SoC, and we're excited to support designers, engineers, and builders globally as they work with these innovative solutions to accelerate progress."The Apollo4 Blue Plus is a 4th generation system processor solution built upon Ambiq's proprietary Subthreshold Power-Optimized Technology (SPOT) platform. The device's complete hardware and software solution enables current and future battery-powered endpoint devices to achieve a higher level of intelligence without sacrificing battery life.The Apollo4 Blue Plus with Bluetooth Low Energy has more than enough computing and storage to handle complex AI algorithms and neural networks, always-on voice recognition, and display capability for smooth graphics."Ambiq shares the same value of meeting and exceeding customer's expectations with DigiKey," said Mike Kenyon, vice president of sales and business development at Ambiq. "We're excited to partner with DigiKey to offer our portfolio of ultra-low power, AI-enabled semiconductor solutions to help ease the customer's search for the best electronic components in one place."For more information about Ambiq and to order from their product portfolio, please visit the DigiKey website.DigiKey has partnered with Ambiq to offer their low-power IC solutions, including the Apollo4 Blue Plus, which enables Bluetooth Low Energy (BLE), graphics, and audio for always-connected IoT endpoints.

the TPCA Show and IMPACT Conference 2023 was held in Taiwan at the Taipei Nangang Exhibition Center Hall 1 from October 25th to 27th. The strategic brand presence of MKS, Atotech and ESI impressed visitors at the show. The crowded booth, the many paper presentations at the IMPACT conference and the specially hosted session on "AI advanced packaging" draw special attention to the company this year, a leader in Taiwan's PCB, IC Substrate and Semiconductor industries.MKS' teams on the show floorThe teams from both strategic MKS brands came together to represent the new combined company and its combined expertise in advanced PCB via drilling systems, lasers, optics and motion with process chemistry and equipment for current process and yield optimization, as well as next generation product development, e.g. for advanced material processing, via formation, glass package substrates, solar, batteries and more. One of the focal points at the show was on Optimize the Interconnect which can be achieved with Atotech and ESI products and services. Optimize the Interconnect is an MKS offering that provides printed circuit board (PCB) and advanced electronics packaging customers with a wide range of products and services for creating interconnects in the most advanced PCB and IC packaging designs. Services include PCB and advanced electronics packaging interconnect creation and evaluation services, access to the MKS Technology Centers for installation, setup and troubleshooting services, application development services, application labs and support, design and development services, and maintenance, repair and calibration services.This unique combination of MKS' via drilling and routing, and chemical plating expertise enables customers to accelerate their product roadmaps, solve the challenges associated with new materials and finer feature sizes, and thereby creating the interconnection more effectively with higher quality output and faster time to market.MKS' Management interviewed by GaryMKS' team with TPCA Mr. BaiWe offer a broad range of MKS' technologies and capabilities?Xsuch as lasers, precision optics, motion control, beam measurement, via drilling systems and process chemistry?Xto provide a unique solution for optimizing the manufacturing of PCB and advanced electronics packaging interconnects, a key part of the overall PCB and advanced electronics packaging manufacturing process."We understand the importance of providing our customers with the best solutions and services including sustainable products and energy-saving equipment to create win-win situations for our customers," said Daniel Schmidt, Global Marketing Director. Throughout the week, various local and international executives were available to meet with teams, customers, partners, and prospects to discuss the way forward with a special focus on the latest industry trends and challenges. The teams made special efforts to welcome and introduce the latest technologies and solutions to key industry participants and customers and the team demonstrated our new synergies and total solution package consisting of PCB production equipment (wet-to-wet process equipment, laser systems, and auxiliaries), chemistry, software, and service to the Taiwanese PCB industry. After one year since the acquisition, the industry and especially our customers are expressing high confidence in our integration, and trust that we can provide them with more complete solutions to support their future product and manufacturing development roadmap.MKS' Industrial Forum and the audiencesPresenters of the MKS' Industrial ForumThe team also presented 8 papers at the IMPACT technical conference this year. A key event was the IMPACT industrial forum on October 25 from 1:30?V 3:30pm, where industry leaders in their respective fields were invited to speak about their contribution to the developments in AI to create a new era of advanced packaging. Daniel Schmidt, Global Marketing Director said: "The special industrial session helped our company to draw attention to industry trends, challenges, and possible solutions. Many questions were asked and discussed during the session, and it showed our contributions not only in our solutions, but also in the technology developments within our industries."

In a recent report, IDC revealed the transformative role of generative AI (GenAI) within IT operations (ITOps) across the Asia Pacific region. IDC's 2023 Future Enterprise Resiliency and Spending (FERS) Survey, Wave 6, highlights that almost half (43%) of organizations surveyed are currently exploring potential GenAI use-cases, with 55% of financial organizations and telecom firms investing in GenAI technology in 2023.With the digital-first mindset gaining momentum in Asia Pacific, businesses are seeking innovative solutions to enhance operations. GenAI stands out as a pivotal technology, offering companies the means to mitigate risks, boost efficiency, and improve overall productivity.Generative AI is gaining popularity in IT operations and IT service management, particularly in cost-sensitive Asia Pacific environments. This technology offers automation of ITOps tasks, reducing operational costs and optimizing resources. The region, which includes mature economies like Australia, Japan, and Singapore, and rapidly growing markets like India and China, has diverse IT requirements and issues. In growing economies, generative AI plays a vital role in facilitating scalable ITOps."Generative AI can increase the overall productivity of ITOps teams by streamlining ITOps workflows, lowering operational expenses, and increasing system dependability. However, GenAI systems must be properly implemented to ensure that they correspond with enterprise goals and that adequate guardrails are in place to manage unanticipated events," said Dhiraj Badgujar, Senior Research Manager, Digital Innovation Practice and xOps Program, IDC Asia/Pacific.In the report, IDC highlights ITOps trends that enterprises need to look out for as the GenAI revolution continues:• Rise of AIOps: AIOps solutions are becoming more popular in Asia/Pacific. ML and AI algorithms are being used by enterprises across the region to automate IT processes, monitor performance, and forecast and avoid IT disasters.• Predictive Analytics: AI-driven predictive analytics in ITOps helps enterprises anticipate IT issues and prevent disruptions.• Hybrid Cloud and Multicloud Management: As enterprises in the region embrace hybrid cloud and multicloud settings, GenAI will be used to manage these complex infrastructures.• Continuous Improvement: GenAI models will evolve in complexity and quality, likely integrating with IoT and edge computing to enhance data collection and analysis.Leading vendors are also diving into the GenAI wave. Notable implementations include Atlassian's Atlassian Intelligence, ServiceNow's generative AI capabilities for the Now Platform, New Relic's Grok, PagerDuty's generative AI for its Operations Cloud, and HCL Technologies Limited's BigFix 11.GenAI-driven ITOps can significantly impact business success for enterprises in the region. The IDC Asia Pacific Software Survey 2023 shows that over 50% of enterprises from countries like India, Indonesia, and Malaysia expect increased operational efficiency and automation from GenAI as part of their digital innovation strategy, highlighting the growing need for IT agility in these industries.

One aspect of the electronic supply chain that is unchanging is the effect emerging technologies have on the ebb and flow of the market. As technologies cycle in and evolve, they play a significant role in demand, supply, price, lead times, and manufacturing operations.Of course, this is dependent on consumer adoption as well, but as companies integrate more advanced technologies into end-user products, the market behavior all points in the same direction—up in demand and down in supply.Generative AI: The Emerging Technology that Continues to EvolveToday, generative artificial intelligence (AI) is the major stakeholder in technological advancement. With $1.3 trillion in growth expected by 2032, generative AI is the major driver of electronic component market activity, impacting supply, demand, pricing, and lead times.What Is Generative AI?*The term refers to the algorithms and models that identify the patterns and structures within the existing content.*The purpose is to create new content based on existing content (text, images, video, audio, and other media).*The intent is to deliver real-time, automated results for the end-user.Chipmakers and companies continue to see the rise in its applications with industries like automotive, consumer electronics, energy, healthcare, and more including it in end-user products. These industries apply AI for various use cases like customer communication, improved automation, and optimization.The "popularity" of generative AI stems from its usability, which chipmakers and companies are seeing with the adoption of chatbot programs like ChatGPT, DALL-E, and Bard. These programs rely on AI technologies like natural language processing (NLP), such as language models (LLMs), speech synthesis (SS), and computer vision (CV), which all create a user-friendly, convenient end-product.Demand for High-Performance ChipsThe speed of adoption and continued evolution of AI results in the need for high-performance chips like GPUs and FPGAs. As an example of how these chips are applied,*GPUs are specialized chips that can perform parallel computations for graphics and AI tasks.*FPGAs are reconfigurable chips that can be customized for specific AI tasks.While chipmakers update production lines to support the continued demand for supply, the companies continue to develop end-products to apply them. Among the companies increasing development and driving demand are Nvidia, Google, Amazon, and Microsoft, as they seek more market opportunities in AI applications.While these companies see revenue growth from this technology, it doesn't come without the challenges of competing for manufacturing support from the chipmakers.As Technologies Emerge, Manufacturers Pivot PlansProducing the chips that power AI applications comes with complex challenges. Nvidia leads the pack in the latest benchmark tests for chip speed, but competitors like Google and Advanced Micro Devices are attempting to carve out their own position. However, producing high-performing chips comes at a higher cost due to the design and fabrication requirements. As generative AI models become more advanced, chipmakers must pivot.Currently, manufacturers are allocating resources toward research and development (R&D) and implementing innovative manufacturing techniques. The balancing act between supporting the rise of AI and other verticals is tricky, especially considering Nvidia's head start. Today, Nvidia accounts for more than 70% of AI chip sales, a vast gap for other companies to bridge.Even with their popularity, Nvidia cannot keep up with all the demand, opening the window for other manufacturers to carve out market share. The same level of investment and support is needed in AI hardware and all the other parts of the technology stack, encompassing the data centers where AI applications occur. These centers include components from memory to interconnects, packing, and systems.It remains to be seen if manufacturers seeking unique solutions can allocate manufacturing support to keep up with demand.Strategic Supply Chain BuildingAmid the boon of generative AI, distributors encourage manufacturers and companies to think strategically to source the parts they need for the short and long term. As generative AI evolves, the market will move as it moves with the continued growth in demand and ways to manage supply over time.To learn how to get Out In Front of risks to your supply chain, reach out to Fusion Worldwide today to speak to a procurement specialist. Contact us today.Author: Tobey Gonnerman, President, Fusion WorldwideThe AI Effect: Supply, Demand, and Continued Adoption

When it comes to Field-Programmable Gate Arrays (FPGAs), the market often thinks of Xilinx under AMD, the PSG division under Intel, and Lattice Semiconductor as the major providers. However, in recent years, Chinese companies have started to emerge, gradually gaining ground in the FPGA field.Gowin Semiconductor is one of the few Chinese chip design firms capable of independently developing FPGAs. Since its establishment in 2014 nearly ten years ago, Gowin Semiconductor has grown to about 250 employees. Jason Zhu, the CEO of Gowin Semiconductor, said that the Company was founded in a period of rapid development in China's internet industry. Investors had less interest in the relatively obscure FPGA field. However, Gowin did not only aim to satisfy the Chinese market demand from the beginning; it also sought to meet the needs of other regional markets as part of its long-term strategy. Hence, the Company initially invested in FPGA products with TSMC's 55nm process. Although this process was not the most advanced at the time, TSMC had introduced various versions including low-power consumption and embedded flash memory in their 55nm process, enabling Gowin to launch different grades of product lines according to market demands.Despite Using TSMC's 55nm Process, Product Still Boasts Market Differentiation and CompetitivenessJason Zhu pointed out that Gowin tried to find a suitable product strategy for its positioning at the time. Even though the 55nm process was used, Gowin offered more than double the number of I/O counts compared with other competitors of the same class. Gowin's chip reliability was greatly improved coupled with the high stability of TSMC's process, which significantly outperforms other foundries in terms of process variation. The chip reliability enabled Gowin to easily gain AEC-Q100 certification and quickly enter the automotive market. Jason Zhu also noted that Gowin has been widely accepted by many customers in recent years due to the shortage caused by the pandemic. Customers became aware of Gowin while seeking for alternatives and were further attracted by shorter delivery times. Effective technical support from various dealers also played a crucial role. These factors have gradually led to market recognition of Gowin's technical capabilities. To date, Gowin has shipped over 3 million automotive products.Diversified Collaboration in the Automotive Sector, Open to Any Cooperation PossibilitiesSpeaking of developments in the automotive market, Jason Zhu revealed that China's electric car market has been thriving in recent years. Car manufacturers have a high degree of control over power transmission systems and often opt for independent development rather than relying on other suppliers. Under the premise, SAIC Motor of China once utilized Gowin's FPGA for gearbox development. In regard to IGBT-related system design, some Chinese car manufacturers have adopted Gowin's FPGA chips instead of the traditional designs using automotive MCUs (Micro Control Units) to reduce overall system costs.For vehicle cockpit system applications, Gowin collaborates with well-known processor companies such as MediaTek and UNISOC. Jason Zhu pointed out that traditional automotive processors have a relatively limited number of MIPI design channels. However, the current development of vehicle cockpit systems has moved towards multi-screen output. As processors from MediaTek and other SOC vendors struggle to effectively respond to multi-screen output, Gowin's FPGA can overcome this problem. Playing a similar bridging role in the development of ADAS and autonomous vehicles, how can signals from automotive sensors like cameras, radar, and LiDAR be processed by NVIDIA's GPU? In fact, most early automotive FPGA products did not include a MIPI interface; but Gowin's FPGA comes equipped with the MIPI interface, supporting at least six camera image inputs.Moreover, automotive screen manufacturers are beginning to introduce miniLED technology, featuring local dimming that can instantly react to different brightness areas on the screen. Based on this demand, large car screen manufacturers like BOE and LG have started to cooperate with Gowin. Jason Zhu candidly stated that Gowin plans to attend an exhibition in Japan in the upcoming November, and BOE is willing to lend Gowin the design samples developed cooperatively for the exhibition.The digital rearview mirror is another automotive system with great emphasis on instant reaction. Jason Zhu mentioned that the system design is complex, involving optical imaging technology for image capture from automotive cameras, to screen output in digital rear-view mirrors. Image correction on its own, which enables the driver to identify the objects instantly, already entails different professional fields and considerable technical difficulty. Not to mention the various weather changes that must be dealt with, such as rain and fog. Clear display on digital rearview mirrors is imperative in all these conditions. Thus, Gowin maintains a close cooperative relationship with relevant solution providers.Actively Expanding into the Global Automotive Market Beyond Satisfying China's Domestic DemandRegarding the future development of Gowin Semiconductor and the automotive electronics market, Jason Zhu clearly states that Gowin not only aims to meet the demand of the domestic market in China, but also has considerable ambitions for regions such as Europe, America, Japan, and Taiwan.In Taiwan, for example, Gowin collaborates with local distributors and has substantial cooperation with leading providers of power supply and green energy solutions. In Japan, there are ongoing collaboration plans with top-tier car manufacturers. In the European and American markets, Gowin is currently working with German TÜV Rheinland to further obtain ISO 26262 functional safety certification for its products, facilitating quick entry into the supply chains of international car manufacturers.Gowin also has a next-generation automotive FPGA, Arora V, set to launch soon. It's expected to adopt TSMC's 22nm automotive process, representing a significant upgrade from the previous 55nm technology. Naturally, this brings substantial improvements in terms of power consumption and performance. Jason Zhu candidly stated that the launch of Arora V aims to follow the successful formula of the previous generation while carving out a unique market position different from traditional FPGA giants, aiming to address many pain points in the development of secondary automotive systems. Moreover, Arora V has made significant advancements in SerDES (Serializer/Deserializer) technology, which may have the opportunity to disrupt the dominance of traditional IDM companies in high-speed signal transmission for automotive applications. In the field of electric vehicles, as the next-generation SiC power semiconductors gradually become mainstream in the market, Gowin does not rule out collaborating with leading international SiC component manufacturers in the fields of inverter and OBCs.In summary, although Gowin Semiconductor is a rare Chinese FPGA chip design company with a history of only about ten years and a market share that is still not as substantial compared to international giants, Gowin's ambition in automotive and diverse vertical applications is still evident. The advent of its new 22nm product is expected to gradually strengthen its position in the FPGA market and provide more visibility.Jason Zhu, CEO of Gowin Semiconductor, stated that the forthcoming next-generation automotive FPGA Arora V will likely use TSMC's 22nm automotive-grade process, hoping to follow the successful formula of the previous generation to address many pain points in the development of secondary vehicle systems.Gowin Semiconductor's latest 22nm FPGA product series, Arora V, supports high-performance DSP for AI computations, high-speed LVDS interfaces, and ample BSRAM memory resources. Arora V simultaneously integrates an independently developed DDR3 interface and 12.5Gbps SERDES which supports various protocols, along with diverse packaging choices. It is highly suitable for applications in various industries, such as netcom, servers, industrial, medical, automotive, and power systems needs, etc.

DigiKey, a leading global commerce distributor offering the largest selection of technical components and automation products in stock for immediate shipment, announced the launch of its new MedTech Beyond video series.Sponsored by NXP Semiconductors and RECOM Power, the MedTech Beyond is a three-part video series that dives into how medical devices are evolving and allowing for faster and more accurate diagnosis and treatment. From wearables to immersive tech and AI-powered innovations, the series explores how medical technology is creating opportunities to live longer, more fulfilling lives."As healthcare needs and technology both rapidly advance, DigiKey is proud to support the needed technology advancements," said Josh Mickolio, supplier business development manager – wireless and IoT for DigiKey. "Medtech advancements are enhancing every aspect of healthcare and ultimately leading to longer, more fulfilling lives.""Our power supplies play a pivotal role in enabling cutting-edge medical devices to operate flawlessly, ensuring precision and reliability," said Chris Wolf, president, RECOM Power. "At RECOM, we take pride in contributing to the advancement of medical technology, and we remain dedicated to powering a healthier and more connected world.""An important change in the medtech landscape is the 'scale' of care, as we see an increased need to manage healthcare in the home," said Luca Difalco, senior vice president, global sales offerings for NXP Semiconductors. "Our technology enables the democratization of health monitoring and diagnostics while helping to ensure the security of the data and device. The ability to offer advanced quality, long product lifecycles and a wide portfolio of offerings positions NXP well to help advance the medtech industry."The first of three videos in the series, "Holistic Health," is now live on DigiKey's website, and investigates the evolution of tech-assisted personal wellness and patient care. Personal wellness tech is no longer limited to counting steps. A new generation of patient care and personalized medical devices are using the latest technology to provide a better patient experience and a more holistic look at daily health.The second video, "Engineering Better Health Outcomes," explores how innovation happens behind the scenes with industry leaders. Given the critical importance of patient safety and security, medical device engineers, designers and supply chains face more pressure than most.The third and final video in the first season of the series, "Curing Tomorrow," examines the big thinkers investigating the next medtech breakthrough. From AI-powered diagnostics to predictive analytics, investigate how today's innovations are helping diagnose and treat the diseases of tomorrow.To learn more about the video series and how DigiKey is supporting the rapidly evolving medtech sector, visit the DigiKey website.

Prosemi Pte Ltd Singapore, a leading provider of electronic testing services, is proud to announce that it has been approved for ISO/IEC 17025:2017 and AS6171 (Detection of Suspect/Counterfeit Parts) accreditation from the ANSI National Accreditation Board (ANAB), Certification No. AT-3240. This accreditation is the international standard for the competence of testing and calibration laboratories. It is a prestigious accreditation that demonstrates Prosemi's commitment to providing high-quality testing services."We are very proud to have been awarded ISO 17025 accreditation," said Mr. Sheng Chuan Lee, Quality Director of Prosemi Pte Ltd Singapore. "This accreditation demonstrates our commitment to providing our customers with the highest quality testing services. We are confident that our ISO 17025 accreditation will give our customers the peace of mind of knowing that their products are being tested by a competent and accredited laboratory."To achieve ISO 17025 accreditation, Prosemi underwent a rigorous assessment by ANAB. The assessment included an evaluation of Prosemi's technical competence, management system, and quality assurance procedures. ANAB found that Prosemi meets all the requirements of ISO/IEC 17025.

The first carbon-neutral seminar for the communication industryPhoto: DIGITIMESThe seventh annual seminar of the Auden Techno Corp. recently concluded (9/26) at the Hua Nan Bank International Convention Center. In response to the impacts of climate change and the increasingly important topics of energy conservation and carbon reduction in different industries, this year's theme was "Wireless Convergence for Infinite Sustainability." Exploring the idea of "Infinite Sustainability," the goal was to integrate wireless communication through smarter software, more efficient designs, and more open architectures, building networks that are ubiquitous across various domains. This year's seminar notably added the topics of ESG, the net-zero carbon emissions goal, and sustainable development as a whole. This event was the first carbon-neutral seminar in the communications industry. Besides encouraging participants and staff to bring their own water bottles and environmentally friendly utensils to reduce carbon emissions, under the guidance of the new group venture, - Auden Intelligence Carbon Solution Co. Ltd., international carbon rights were purchased to offset the carbon emissions from this event, actively responding to international climate action and putting it into practice.@ A Collaboration of Industry, Government, Academia, and Research, Covering a Diverse Range of Topics,The chairman of the Auden Techno Corp., Chang Yupin, mentioned that the group has hosted the seminar for seven years now and expressed his gratitude for the wide-ranging support received. He acknowledged various government agencies such as the National Development Council and the Ministry of Digital Affairs, for their project and financial support, which allowed Auden Techno to continually make strides in forward-looking research. In addition to its new subsidiary, Auden Intelligence Carbon Solution Co. Ltd., which assists companies in achieving global carbon neutrality, another subsidiary, Auray Technology Corp., is one of the major globally recognized ORAN laboratories. It is committed to promoting open communication standards. There were separate sessions in the afternoon discussing topics related to ORAN and information security. Other topics included wireless communication, smart healthcare, energy conservation, and carbon reduction, with the hope of fostering exchanges between all participants.Chairman of the Auden Techno Corp., Chang YupinPhoto: DIGITIMESThe opening ceremony invited distinguished guests such as Vice Director Hu Peiti from the Administration for Digital Industries of the Ministry of Digital Affairs, Convener Wu Juipei of the Taiwan Electromagnetic Industry-Academia Consortium, Director Chen Weichun from the Space Technology Application Division of the Taiwan Space Agency, and Vice Director Chen Chiunghua from the Industrial Development Division of the National Development Council. Vice Director Hu Peiti stated that the government announced last year that a dedicated 5G network would be launched this year. After joint efforts by industry, government, academia, and research institutions, it has finally been implemented and has been done so with more flexible pricing. This year, 20 companies have applied for the 5G dedicated network. For example, Taipei Mackay Memorial Hospital has realized telemedicine through the 5G dedicated network, allowing doctors to more easily grasp patients' heart or abdominal conditions and provide medical services. Ms. Hu expressed hope that advances in communications can bring changes to human life. Director Chen Weichun discussed how Auden Techno has continuously made technological breakthroughs in the field of low-orbit satellites and is a member of the Taiwan Space Industry Development Association and the Low Earth Orbit Satellite Alliance. He anticipates that Auden will lead the industry and play an important role in the process from millimeter-wave antenna technology to comprehensive Low Earth Orbit Satellite development. Convener Wu Juipei pointed out that climate change has begun to attract the attention of the electronics and electrical industries. It has also led to the cultivation of related talents and planning for how enterprises should respond to future technical blueprints. At this year's Auden Techno seminar, it was evident that these related issues could not be ignored. As people look forward to technological developments, it's expected that carbon reduction actions will be implemented.From left to right in order are Convener Wu Juipei, Vice Director Chen Chiunghua, Vice Director Hu Peiti, Chairman Zhang Yubin, and Director Chen Weichun of the Taiwan Space Agency.Photo: DIGITIMES@ Regulations Regarding High-Frequency Wireless Power Absorption in the Human Body Catch the Attention of Regulatory Agencies Worldwide The morning keynote speech was chaired by Professor Wu Tsunglin from the National Taiwan University. It brought together professionals from industry, academia, and research institutions to share significant technical developments and market trends. The first session was delivered by Dr. Niels Kuster, a professor from the IT'IS Foundation and the Swiss Federal Institute of Technology Zurich. His talk, "Methods and Procedures to Determine the Absorbed Power Density," focused on the issue of bodily absorption of wireless radio frequency power. Dr. Niels Kuster stated that there is still no definitive conclusion on the regulations for the absorption power density of wireless radio frequencies in humans continuing into the development to 6G from 5G. However, regulatory bodies worldwide have already begun launching related testing plans to prevent unnecessary harm to the human body. At this stage, frequency bands below 10GHz have been regulated, which is particularly important for the soon-to-be-widespread Wi-Fi 7 technology.However, as we enter the realm above 10GHz, more discussions are necessary. Many standard-setting organizations have also started drafting regulations with concrete results expected in 2 to 3 years. Currently, the IT'IS Foundation has made progress in this area. Dr. Kuster shared several different methods for measuring absorption power density such as the scanning system, which is expected to offer commercial solutions to meet market demands by the end of this year.Director, IT'IS Foundation & ETH Zurich /Prof. Dr. Niels KusterPhoto: DIGITIMES@Metamaterials Contribute to Enhanced Performance in Space Antenna Design Following that, Dr. Erik Lier from Lockheed Martin Corporation shared his insights on "Practical new antenna designs based on metamaterials." Lockheed Martin, with 100,000 employees worldwide, covers a range of businesses including aviation, missile and fire control systems, aircraft manufacturing, etc. Given that most operating GPS satellites are manufactured by the Company, its significance in the aerospace industry is evident.Dr. Erik Lier is dedicated to technical developments in the space sector, discussing the development of Metamaterials in various application areas, as well as sharing the current status of antenna system developments such as Short Backfire Antennas (SBFA) and High Gain Low-Index Metalens Antennas. The development of Short Backfire Antennas has been ongoing for over sixty years, and they can be seen in use by NASA, on ships, and even on the New York TV tower. However, despite the impressive performance of these antennas, Dr. Lier pointed out that SBFAs have a relatively low aperture efficiency. To enhance antenna performance, they tried to increase the quality of the antennas, which led to an increase in the antenna mass - a challenge not easily overcome in the space domain. This issue led to the exploration of whether metamaterials could provide a solution. The results demonstrated that indeed, metamaterials could resolve the aforementioned problem.Senior Technical Fellow, Lockheed Martin Space Life Fellow, IEEE and IEEE DL /Dr. Erik LierPhoto: DIGITIMES@ Net Zero Carbon Emissions Has Become a Consensus and Target Among Taiwan's Industry and Government Echoing the theme of sustainability, Dr. Lo Shihfang from the Chung-Hua Institution for Economic Research discussed "Corporate Net Zero Carbon Emission Pathways and Internal Carbon Pricing." She mentioned that internationally, the goal is to achieve net zero carbon emissions and natural gas usage by 2050, with plans being made to progressively approach this target. However, the practical means of achieving these standards are areas that need discussion. Initially, Taiwanese businesses were relatively passive regarding the topic of net zero carbon emissions. It was not until TSMC joined RE100 that the attitude changed to be more positive. TSMC has also announced that it will accelerate its progress towards the RE100 sustainability goal and achieve it by 2040, hoping to exert its influence and motivate Taiwanese enterprises to practice environmental sustainability goals. The Taiwanese government also has corresponding plans for the net zero targets. Dr. Lo Shihfang quoted content previously released by Kung Minghsin, Chairman of the National Development Council, stating that the Council has planned related budgets up to 2050. In other words, this is the largest budget plan from the public sector so far.Furthermore, Dr. Lo talked about twin transformation, which represents the sweet spot between digital transformation and sustainability transformation. How can enterprises find this balance? She cited data from the World Economic Forum indicating that if businesses introduce digital technology, they can achieve a 20% reduction in carbon dioxide emissions. Taking Qisda Corporation as an example, the Company claims that "one hour after a product officially enters mass production, a carbon footprint report can be presented." Dr. Lo believes this is not easy in practice, and the cooperation with numerous suppliers aside from their own factories will also be a significant challenge. She, however, recognized their efforts towards carbon reduction.Dr. Lo Shihfang, Researcher at Chung-Hua Institution for Economic ResearchPhoto: DIGITIMES@ ITRI's Information and Communications Research Laboratories Empowers Domestic Sustainable Living Development through Technical R&DThe keynote speech by Dr. Ting Pangan, director of the Information and Communications Research Laboratories of the Industrial Technology Research Institute (ITRI), was titled "A Discussion on Communication Network Ecosystems Supporting Greening, Intelligentization, and Openness." He mentioned that from the perspective of the Information and Communications Research Laboratories, the vision for 2035 revolves around four major axes: smart living, healthy lifestyle, sustainable environment, and resilient society. The sustainable environment can be further subdivided into three sub-items: decarbonized energy, low-carbon life, and resource circulation. Based on the current technical and application scope covered by the department, they will assist in the successful development of the aforementioned four major axes through smart networking, green sustainability, intelligent empowerment, and innovation.From the perspective of green sustainability, the department also has many technological advancements that assist in putting the application scenarios into practice. For example, in data center applications, that have been increasingly popular in recent years, immersion cooling technology can reduce space and energy consumption by 40% compared to traditional air-cooling technology. The Department provides system software for immersive technology, which can support all server products available on the market.Dr. Ting Pangan, Director of the Industrial Technology Research InstitutePhoto: DIGITIMES@ ORAN's focus on RIC technology aids diverse application scenariosORAN has always played a crucial role in discussions related to 5G technology and applications. Auray Technology Corp. was the first OTIC third-party impartial laboratory globally recognized by the international O-RAN. Dr. Jinsung Choi, the chairman of the ORAN Alliance, was specially invited to share "AI-Driven Open RAN: Reimagining Wireless Networks" at this seminar.Dr. Jinsung Choi not only reiterated the basic principles of ORAN, such as openness and compliance but also considered AI to be an important technical criterion in its development. He gave examples such as the RAN Intelligent Controller (RIC), management systems based on AI and machine learning, and automated deployments to enhance operational efficiency, etc. He further introduced the features of RIC. Conceptually, RIC can be divided into two types. One is for near real-time responses, and the other is primarily non-real-time responses. There is only a one-second time tolerance difference between the two. However, these two different RICs can flexibly respond to various application scenarios due to this time difference.According to the data quoted by Dr. Jinsung Choi from research reports, the majority of manufacturers believe that RIC is crucial in network deployment and plays a very important role in the field of ORAN. He further extended the discussion related to RIC, comparing it with SON (Self-Organizing Network) and IBN (Intent-Based Networking). Each of these three technologies has its pros and cons, but they all aim to optimize the performance and cost of 5G networks to a considerable extent and achieve automation. In other words, these three technologies can complement each other to meet the increasing network demands of the future.Chairman, O-RAN ALLIANCE /Dr. Jinsung ChoiPhoto: DIGITIMES@ The Afternoon Session Brings Together Professionals From the Industry, Government, Academia, and Research Institutions, Combining Forward-thinking And Practical ConceptsIn the afternoon session, professionals from industry, academia, government, and research institutions gathered to present forward-looking and practical concepts. The agenda broadly covered fields like the integration of communication technologies, construction of B5G/6G ecosystems, biomedical electronics development under precision medicine, ORAN and network information security verification technology, and regulations for green energy and carbon reduction.Track A, titled "Unified World: Full Network Integration" focused on B5G and 6G technical developments. Chaired by Associate Professor Chung Mingan from the National Taipei University of Technology, the session included talks held by the Auden Group's Senior Director Tuan Chunchung and Senior Manager Hsu Yuchun on the design challenges of multi-orbit satellite UT. Professor Hu Chengnan of the Asia Eastern University of Science and Technology, CEO Dr. Chou Hsienkuang of the Ship And Ocean Industries R&D Center, and CEO Dr. Chu Chihyuan of Ohmplus Technology Inc. were also invited to share their experiences and observations.Track B, "AI Simulation: Smart Medicine," was chaired by Dr. Tsai Chengen, Vice General Manager of OBI Pharma, Inc. This panel invited Dr. Taylor Newton from IT'IS Foundation to discuss personalized bioelectromagnetic modeling in precision medicine. Dr. Kuo Liwei from the National Health Research Institutes, Professor Yang Chihchieh from the National Yang Ming Chiao Tung University, and Professor Li Polei from the National Central University also shared their research outcome and contributions.Track C, "Deconstructing Telecommunications: Secure Openness," which targeted ORAN and cybersecurity issues, was hosted by Professor Cheng Juikuang of National Taiwan University of Science and Technology. Invited speakers included Vice Group Leader Chiu Pichen from the ITRI, Director Tsai Chengyu from the Institute for Information Industry, Kuo Tsolin from Telecom Technology Center, and Project Manager Lin Tsungyi from Auray Technology Corp.In response to industry trends and this year's theme, a new track was added: Track D, "Enterprise Sustainability: Zero Carbon." It covered international and Taiwanese sustainable development trends and corporate strategies. The session was chaired by Yang Chihchien, the project host from the National Renewable Energy Certification Center. Invited speakers included Group Leader Huang Chihwen from the Bureau of Standards, Metrology and Inspection, Assistant researcher Feng Kuanchuan from Taiwan Institute of Economic Research, Distinguished Professor Wang Lichih from Tunghai University, and Manager Chiu Tsungyung from Auray Technology Corp.The Auden Group has been deeply involved in the communication field for many years, accumulating rich resources in industry, government, academia, and research institutions. In addition to continuous technological innovation to improve quality of life, it also addresses global net zero carbon emission issues, takes on corporate sustainability responsibility, strives toward global carbon neutrality with practical actions, and offers a unique perspective in the communication industry. Looking forward to the future, the Auden Group seminar will bring more imagination to the next generation of smart life through the integration of diverse industry topics, collectively marching towards the goal of net zero emissions!The seventh Auden Group seminar concluded recently at the Hua Nan Bank International Convention CenterPhoto: DIGITIMES

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is holding its first-ever ST Taiwan Tech Day at the Taipei New Horizon on November 2. The event is designed to provide valued customers and partners with the most up-to-date information on ST products and solutions to facilitate innovation and achieve success.With the theme "Our Technology Starts with You," this extensive technology event, ST Taiwan Tech Day, will offer insightful speeches and showcase over 40 demonstrations centered around four mega trends: Smart Mobility, Power & Energy, IoT & Connectivity, and Sensing the World. Attendees can experience first-hand the latest innovations and learn how ST's technologies are contributing to a safer, greener, and more connected world. It will also be a great opportunity to help developers and innovators stay ahead of the curve in today's rapidly evolving market.Innovation highlightsSmart MobilityZonal Gateway: Zonal Gateway acts as a bridge between the automotive central computer and traditional signal-based ECUs. This technology is supported by ST's wide range of automotive-grade products and enables Service-Oriented Architecture (SOA) with Data Distribution Service (DDS) protocol and Firmware Over-The-Air (FOTA). The Zonal Gateway offers a solution for modernizing automotive systems, allowing for seamless communication between different components and enabling efficient and secure updates.3rd-Generation SiC Modules: The industry leader in Silicon Carbide (SiC), ST offers a wide range of solutions to help developers improve the power efficiency and reduce the size and weight of automotive inverters with its 3rd-generation SiC modules. The traction inverter is a critical component in electric vehicles as it converts energy from the battery to drive the motors in the drivetrain. These converters must handle high power and currents, provide fail-safe operation, and handle EMC challenges. Alongside the SiC modules, ST's range of solutions includes AEC-Q101 qualified IGBTs, silicon and silicon-carbide MOSFETs and diodes, AEC-Q100 qualified galvanically isolated IGBT and MOSFET gate drivers, and SPC5 32-bit automotive microcontrollers. These offerings enable scalable, cost-effective, and energy-efficient EV traction inverter solutions.Power & EnergyDigital Power: ST's digital power solution is a comprehensive set of reference designs that empower designers to create efficient, feature-rich power supplies for a wide range of applications. The demo highlights two powerful solutions: the 25kW DAB DC/DC converter with ST's ACEPACK module, a highly efficient and reliable power converter ideal for industrial and automotive applications, and the 30kW Gen3 SiC MOSFET three-phase interleaved LLC solution with an STM32G4 MCU for ultra-high voltage EV charger -- a cutting-edge power supply designed to provide ultra-fast charging for electric vehicles.With these solutions, designers can create custom power systems that are efficient, reliable, and tailored to their specific needs.Precision Position Control: ST is a leading technology provider for motor control and servo drives, offering power device technologies, computational processing, isolated devices, industrial safety, ecosystem for industrial automation, connectivity, and predictive maintenance. With ST's state-of-the-art motor-control technologies, the motor can precisely control movement to a specific position. The demo consists of two small BLDC motors that can hold two shapes that do not fit together when they are in phase. The precision motor-control algorithm enables the rotation and movement of the shapes towards each other at any time, offsetting the relative position of the two shapes by 90 degrees while rotating. This unique position allows coupling between the shapes, with a rotation speed that ensures the phase shift is not noticeable, demonstrating precision position control in a harmonic movement coordinated simultaneously with other shapes.IoT & ConnectivityEdge AI Washing Machine Solution: This solution utilizes artificial intelligence (AI) to achieve unparalleled levels of energy and water efficiency by accurately measuring the weight of clothes inside the machine. The AI model generated by ST's NanoEdge AI Studio significantly improves measurement accuracy compared to traditional algorithms by analyzing and learning the features of current signals. This technology can advance the washing-machine industry to a next level by optimizing energy and water consumption while providing more accurate measurements.Compact Production Line with IO-Link System: The IO-Link automated product line demonstrates ST's total solution application in a smart factory, utilizing IO-Link technology to manage digital input/output, sensors, and solenoid air valve drivers. The demos include digital IO boards, sensor boards, and actuator boards from ST's Automation Competence Center's reference demo boards. The IO-Link products simplify the installation, setup, maintenance, and repair of factory automation systems, enhancing system flexibility to produce different product models. The IO-Link diagnostic function enables smarter and more reliable factory operations.Sensing the World3D Sensing Solutions: ST showcases the advanced imaging capabilities of the 3D stereo-vision camera solutions for machine-vision applications. The eYs3D stereo camera reference design features ST's high-performance, near-infrared VD56G3 global-shutter image sensors, ensuring the highest quality depth sensing and point-cloud creation. Additionally, the VD55H1 low-noise, low-power, indirect Time-of-Flight (iToF) sensor die, manufactured using advanced backside-illuminated, stacked-wafer technology, enables the creation of a small form-factor 3D camera capable of producing high-definition depth maps with a typical ranging distance of up to 5 meters in full resolution and beyond 5 meters with patterned illumination. This demo highlights ST's commitment to providing cutting-edge technology for machine-vision applications.ISPU for personal electronics: ISPU (Intelligent Sensor Processing Unit) is a new processing category embedded in ST's LSM6DSO16IS MEMS module. It is an ultra-low-power, high-performance programmable core that can execute signal processing and AI algorithms in real-time. The ISPU offers C programming and an enhanced ecosystem with libraries and 3rd-party tools/IDE, making it a state-of-the-art feature for any personal electronics.In addition to the insightful speeches and exciting technology showcase, more than 20 in-depth technical presentations covering Smart Mobility, Power and Energy, and IoT and Connectivity will provide a close look at the cutting-edge technologies that are shaping our world.To learn more about the exciting demos and program, please visit the ST Taiwan Tech Day event page.