According to the 2024 Small OLED Display Annual Report recently published by UBI Research, OLED shipments for foldable phones are expected to increase from 27.4 million units in 2024 to 52.7 million units in 2028.According to the report, Samsung Display's OLED shipments for foldable phones in 2023 will be 13.4 million units, a 6.3% increase from 12.6 million units in 2022. Also, among Chinese panel makers, BOE shipped 6.2 million units of OLED for foldable phones, more than three times the 1.9 million units in 2022, while TCL CSOT and Visionox each shipped 1.1 million units of OLED for foldable phones.Although there is fierce pursuit by Chinese companies, Samsung Display is expected to still take the lead in the foldable phone market. Samsung Electronics, to which Samsung Display supplies panels, is expected to expand the models of the Galaxy Fold series scheduled to be released this year, and Samsung Display's foldable phone panels are expected to be applied first to Apple's foldable iPhone to be released in the future. Based on such technological prowess and competitiveness, Samsung Display's dominance in the foldable phone market is expected to continue for the time being.Credit: Company

What are the differences between cars of the past and present? Today apart from electric vehicles (EV) you see more and more often every day, you might also find cars are getting smarter and come with growingly diverse infotainment and telematic systems as well as safety features such as lane departure warning and forward collision warning. That's tight – EVs and smart cars are the two key mobility trends of the present. At TAIPEI AMPA and AUTOTRONICS TAIPEI 2024, taking place in concurrence with 2035 E-Mobility Taiwan April 17-20 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1), visitors will get a chance to see the latest new energy cars and state-of-the-art smart vehicle features.The automotive market started to recover as the COVID-19 pandemic came to an end in 2023. On top of rapid developments in energy, semiconductor and ICT technologies, the automotive sector is embracing another wave of growth. The prosperity also gives rise to the scale-up of this year's three joint exhibitions. The event will have approximately 1,000 exhibitors hosting 2,700 booths. Iconic corporations will be present to demonstrate their cutting-edge technologies and maximize their visibility.The event organizer has designed a diversity of activities aimed at enabling visitors to clearly capture iconic corporations' solutions on exhibit. Both the general public and professionals in the automotive sector can enjoy a unique exhibition experience suited to their needs. In particular, "Talent Transistors," "Guided Tours" and a series of "ESG Achievement" activities will be this year's highlight that can't be missed.Debuting in 2024, "Talent Transistors" match talents with employers Human resources have always played a vital role in driving industry development. The automotive sector ushering in a mobility revolution especially welcomes new blood. "Talent Transistors," held for the first time at the 2024 event, provide opportunities for automotive professionals and college students to meet with potential employers. Those who are interested can have a holistic view of the job market and network with industry insiders to pave a career path. Companies get chances to discover and recruit talents while raising their brand visibility, which will in turn help them attract more first-rate professionals to jump on board. There are 13 companies with different specialties participating in "Talent Transistors," including automotive component manufacturers Shou Ie Enterprise, Coplus, Truck Body Parts Industrial, Shih Hsiang Auto Parts, Ying Paio Enterprise, Heng Fu and Inventec Appliances as well as smart mobility solution providers Shing Shing Long Industrial, Chun Hon, Shihlin Electric, Remote Sensing Laboratory, Department of Geomatics, NCKU, ZEROVA and Advantech.Upgraded " Guided Tours" available in three languages to create a premium exhibition experienceThe highly praised "Guided Tours" activity will be upgraded this year. Aside from Chinese and English, the tours will also be available in Japanese to serve the largest buyer group – Japan-based companies. The tour routes will also be expanded to nine, adding two important ones – Automotive Safety Equipment and Systems as well as Golden ESG Achievement. Experts guiding the tours will include Eric Hsing from Maloncars, Singer from Jorsindo Motor Club, Tai Choo Yee from CarPlus, and Mark Phillips from Aftermarket Intel. They will guide visitors for an in-depth look into eye-catching products and technologies on exhibit.Visitors can choose a tour route based on their preferences and professional needs. Exhibitors get chances to share their product R&D experiences and thoughts and receive real-time feedback through on-site communication for future enhancements. This is the aim of the "Expert Guided Tours" activity – creating a win-win situation.A glance at Taiwan's patented technology strength and a Line point game for ESG awarenessTaiwan boasts robust technological R&D capability. Taiwan Intellectual Property Office, Ministry of Economic Affairs will host an exhibit titled "Taiwan Patent GO," showcasing winners of the National Invention and Creation Award and outstanding patented products named at the Taiwan Innotech Expo. The exhibit will also shed light on how patents can protect intellectual creations and enable business opportunities. One-on-one consultations with patent attorneys are available for those interested in turning their inventions into profits. Advance booking is required. Spaces are limited so make your reservation early.As part of the continuing efforts to promote ESG, the event organizer has planned ESG sustainability seminars and peer panel discussions to help exhibitors and visitors grasp sustainable development strategies. There will also be a Line points activity jointly organized with companies committed to ESG practices. Visitors to exhibition booths with a gold or green ESG mark can scan a QR code to collect Line points which can be redeemed for succulent plants at the ESG exhibition area. Quantities are limited so act quickly.Presenting the current developments and future trends of the global automotive industry, TAIPEI AMPA, AUTOTRONICS TAIPEI, and 2035 E-Mobility Taiwan will take place April 17-20 at TaiNEX 1. A complete range of all kinds of activities will enable visitors to effortlessly grasp information, build business networks, and get immersed in the mobility revolution. Don't miss out on the chance for an overview of an all-round automotive industry ecosystem.Reserve your spot at https://www.taipeiampa.com.tw/en/index.htmlTAIPEI AMPA 2024 – a perfect opportunity to capture industry dynamics and build business networksPhoto: TAITRA

Glass Acoustic Innovations Ltd. (GAIT) is thrilled to announce a strategic partnership with Nippon Electric Glass Co., Ltd. (NEG), a distinguished leader in glass manufacturing listed on the Japanese Stock Exchange. This collaboration marks a significant evolutionary milestone in the glass and acoustic industries, uniting two industry leaders with a shared commitment to innovation and excellence.In a collaborative effort to meet growing market demands, GAIT and NEG have joined forces to deliver state-of-the-art ultra-thin glass diaphragm technology solutions, integrating glass diaphragms into HiFi speakers, headphones, automotive speakers, marine audio speakers, and much more. NEG, globally renowned for high-quality glass production, specializes in crafting optical and medical glass for a wide spectrum of applications, including display panels, electronic displays, and medical equipment. GAIT, a dominant force in glass diaphragm design and production, offers cutting-edge glass diaphragms across numerous applications that outperform traditional counterparts in every dimension, with enhanced functionality (higher strength and rigidity, proper damping, and accelerated sound propagation speeds), charming aesthetics, and environmental conscientiousness. It is dedicated to the manufacturing and development of a wide range of glass diaphragms from 0.4mm to as thin as 35 µm thickness in loudspeaker membranes to earphone and headphone membranes.Glass diaphragm manufacturers have expanded their focus by venturing into the audio speaker industry, a market valued at approximately US$756 billion, where glass diaphragms in particular account for US$27 billion. The innovative glass diaphragm technology is poised to play a pivotal role in reshaping the audio industry, introducing revamped speaker products and a fresh interpretation of audio that is sleek, contemporary, and refined. Just as visual displays have evolved, with TVs boasting unprecedented resolutions and more sophisticated designs, the audio sector is poised for a similar transformation, shifting beyond traditional "brown goods." The next frontier in consumer electronics will focus on enhancing the audio experience, surpassing even the sophisticated visual upgrades seen with OLED technology.The partnership between GAIT and NEG signifies a historic moment in the glass industry's trajectory. Together, these leading glass and glass diaphragm manufacturers aim to propel the growth and development of glass diaphragm technology into uncharted territory—acoustical glass. By blending NEG's glass technology expertise and GAIT's acoustic craftsmanship, the ceiling for glass diaphragm applications will be limitless—supporting impeccable audio quality from in-ear speakers to large-diameter speakers and beyond. This powerful partnership symbolizes a collective dream: to see glass, touch glass, and HEAR glass.Mr. David Chou, Founder and Chairman of GAIT, and Mr. Mamoru Morii, Director and SVP of NEG, joyfully commemorate the successful establishment of their partnershipMr. David Chou, Founder and Chairman of GAIT, together with the GAIT team, and Mr. Mamoru Morii, Director and SVP of NEG, along with his team, joyously celebrate the establishment of a strategic partnership

Not only has space exploration been a dream of humankind, but it has also played a crucial role driving the innovation and advancement of cutting-edge technologies. Space technology achievements are therefore seen as an indicator of national prestige and power. To keep abreast of the global space industry development trends and to comply with Taiwan's policies to build a solid space industry foundation, the Small and Medium Enterprise and Startup Administration (SMESA) of the Ministry of Economic Affairs sponsors the International SpaceTech Startup Supporting Program, which is part of Taiwan Accelerator Plus (TAcc+). Organized and executed by the Industrial Technology Research Institute (ITRI), the program is aimed to achieve three goals: attracting international space startup talents to Taiwan, helping Taiwan-based space startups explore business opportunities and tap global markets, and bridging enterprises with startups for partnerships and global market expansions.To achieve the first goal of attracting international space startup talents to Taiwan, ITRI works with international startup accelerators and incubators and selects foreign space startups with mature critical technologies to come to Taiwan. ITRI provides them reception, education and matchmaking services while helping them connect with Taiwan's space industry and participate in space technology exhibitions.To achieve the second goal of helping Taiwan-based space startups explore business opportunities and tap global markets, ITRI plans to pair Taiwan-based space startups with foreign mentors to guide them on business model optimization and business expansion. ITRI also engages with international startup accelerators and incubators to lead Taiwan-based space startups' foray into worldwide markets.To achieve the final goal of bridging enterprises with startups for partnerships and global market expansions, ITRI endeavors to match foreign startups with domestic industries. The efforts not only promote their collaboration and communication but also help Taiwan-based startups penetrate into the global space industry ecosystem.Thanks to joint government-industry-academia-research efforts, Taiwan's FORMOSAT 1, 2, 3, 5, and 7 missions successfully completed, laying a solid foundation for independent satellite development. This shows Taiwan is capable of making satellites and sounding rockets domestically and more importantly, Taiwan has an outstanding team of aerospace engineers and experts. Having identified the space industry as one of the six core strategic industries, the Taiwan government intends to keep driving space technology advancement and industry development, aiming to establish a presence in the global marketplace.Right after kick-off, the International SpaceTech Startup Supporting Program 2023 was met with great interest from promising space startups all over the world. A total of 16 teams were selected to come to Taiwan, including German-based deltaVision GmbH in the satellite manufacturing sector, India-based Vellon Space in the launch service sector, and Czech-based Hikade Technologies in the satellite service sector. The International SpaceTech Startup Supporting Program 2023 culminated in the signing of six MOUs, intertwining global startups with the Taiwanese space sector. These startups also engaged in over 300 discussions with local suppliers at the Taipei Aerospace & Defense Technology Exhibition, injecting vitality and fresh perspectives into Taiwan's aerospace community.Considering opinions from the Taiwan space supply chain, SMESA has decided the International SpaceTech Startup Supporting Program 2024 will highlight satellite manufacturing system integration, sensing and imaging technologies for satellite application, and critical components for rocket manufacturing/launching. The aim is to leverage Taiwan's strength in IC design, satellite manufacturing, ground equipment, and startup ecosystem to build expertise and experience in the space sector.In view of the space technology development progress across different parts of the world, the 2024 program will focus on startup teams from Europe, India, and Japan with a certain degree of maturity. With the success of the 2023 program, this year SMESA hopes to invite 10 startup teams from abroad to Taiwan and matchmake at least two partnership deals with Taiwan-based firms.On top of solid foundations and brilliant performances in the semiconductor, ICT, and precision machinery sectors, Taiwan also has the capabilities to develop and manufacture satellites and rockets domestically. The synergy of the two will allow Taiwan to build up strength in the global space competition, which is set to become a key growth engine for Taiwan's economy.Visit https://taccplus.com/en/international-program/ for more information.Applications for International SpaceTech Startup Supporting Program 2024 are now being acceptedPhoto: ITRI

Silicon Application Corp. (SAC) Group, a member of WPG Holdings, has facilitated the adoption of various industrial applications for its partner brands. Today, at Embedded World 2024—world's largest exhibition for embedded electronics and industrial computing—MediaTek unveiled an array of smart IoT devices. These innovations, developed by partners including SAC Group, MSI, and Cypress Technology (CYP), leverage MediaTek's Genio IoT platform. The device portfolio covers a wide range of applications, including edge computing equipment for factories, warehouse management systems, human–machine interfaces (HMIs), robotics, rugged computers, and in-flight entertainment systems.Among the various applications exhibited, two devices were developed under the collaborative support of the SAC Group and MediaTek: An industrial tablet computer from MSI, which can be utilized in smart agriculture, smart factories, and smart buildings sectors; and a real-time audio and video streaming conversion device from CPY, which allows food and beverage retailers to deliver different audiovisual content to different screens within their stores. Both devices are powered by MediaTek's latest IoT chipset, the Genio 510. In the future, SAC Group and MediaTek will continue to assist global IoT device manufacturers in building smart IoT devices for diverse applications.Hongji Chen, Vice President of Technical Support Center at SAC Group, stated that through the collaboration strategy, which involved FAE teams covering different fields such as software, hardware, and RF, as well as close communication with the original chip manufacturers, SAC Group is able to serve as an extension of MediaTek, providing customers with comprehensive consulting services and technical support from motherboard design to development in order to accelerate customers' adoption of MediaTek's IoT solutions.Alan Liu, Director of the IoT Business Unit at MediaTek, pointed out that the diversity of smart IoT applications often presents device-makers with challenges of fragmentation. To address this, MediaTek is capitalizing on SAC Group's extensive network in the IoT sector. By extending the scope of their decade-long partnership into the IoT domain, they aim to offer more prompt and efficient technical support and service capabilities to IoT equipment system manufacturers.MediaTek is addressing the unmet need for Arm-based smart IoT devices and systems by developing a suite of Arm-based chipsets. These chips are designed for universality, openness, and compatibility, offering system manufacturers around the world high-performance, energy-efficient, and easy-to-integrate SoC solutions. This accelerates product development and time-to-market entry, boosting competitiveness.At the exhibition, MediaTek showcased their latest smart IoT chip, Genio 510, which boasts a 6-nanometer hexacore processor. The Genio 510 supports cutting-edge wireless technologies like 5G and Wi-Fi 6 and offers a variety of I/O options such as PCIE, GbE, USB3.1, and USB 2.0 ports, ensuring broad peripheral connectivity. Genio 510 comes with an integrated AI processor and a 32MP ISP, capable of handling AI tasks like facial and object recognition without an external graphics card. It also supports multiple video codecs, including AV1, VP9, H.264, H.265, and 4K output, delivering sharp images for multimedia IoT uses, such as digital signage in retail.

iCatch Technology, a leading AI image processing IC design company, is pleased to announce its participation in ISC West 2024. Several key technology advancements in battery-powered security camera will be demonstrated live at the event based on its Vi57 AI imaging SoC, including high-quality color pre-roll video, AI-powered audio noise suppression, and rapid press-to-live-view performance.One of the key highlights is the collaboration with OMNIVISION OA07600 video co-processor to enable color pre-roll video on battery-powered camera devices. With this video co-processor, Vi57 can record the pre-event color video footage to assure no critical event is missed at exceptionally low power consumption. Moreover, with the color night vision technology in Vi57, these color pre-event videos can be recorded clearly even under extreme low-light conditions without the need of active lighting to improve the traceability and user experience.Additionally, the AI-powered audio noise suppression feature in Vi57 provides clear audio quality while operating in a noisy environment, making it ideal for two-way audio communication in home security applications. Whether the camera is placed under windy or noisy environments, users can still communicate effectively between the camera and their smart devices.Furthermore, Vi57 offers unparalleled fast-boot performance with an 8-bit SPI interface built-in. This technology not only ensures that crucial events are always securely captured but also enables ultra-low-power camera system design to greatly improve battery life."We are thrilled to showcase the new features realized on our Vi57 AI imaging SoC at ISC West 2024," said Weber Hsu, GM of iCatch Technology. "These advancements can support brand names in bringing home security camera to the next level and we can't wait to share them to the visitors at the exhibition. "ISC West 2024 is a renowned event in the security industry, attracting professionals from around the world to explore the latest security camera innovations. The exhibition will be held from April 9-12, 2024, at the Venetian Expo in Las Vegas.For any request, please drop your message at: https://www.icatchtek.com/RequestsiCatch Technology Debuts Revolutionary Camera Advancements for Home Security at ISC West 2024Photo: iCatch Technology

The second edition of the 2024 Chroma Precision Machinery and Measurement Technology Paper Award, organized by the Chroma Foundation and co-organized by the Industrial Technology Research Institute (ITRI), has concluded successfully.Having kicked off in June 2023, the competition lasted for 9 months. The final review and awards ceremony took place on March 14, 2024, bringing together elites from academia, industry, and research to commend the winners. The number of submissions for this year's competition increased by 55% compared to the first year. Students from 25 universities and 35 research institutes participated enthusiastically. The submitted papers covered a wide range of topics, including semiconductor optical inspection technology, electric power conversion and drive control technology, key components and modules in power electronics, electric vehicle powertrain testing technology, thermal interface material / thermal resistance measurement technology, micron-level precision machinery technology, integrated photonics chip testing technology, machine learning (ML) applications in precision testing or control technology, microwave and millimeter-wave measurement technology, and semiconductor testing for AI and ML, totaling ten main themes.Fostering the Next Generation of InnovatorsChroma ATE Chairman Leo Huang emphasized the award's commitment to nurturing the next generation of talent. "The Chroma Paper Award aims to inspire young minds to explore creative applications in precision measurement," said Huang. "By encouraging collaboration between academia and industry, we can cultivate exceptional talent to address the evolving R&D needs of Taiwan's technology sector and fuel future innovation."Chroma ATE Chairman Leo Huang delivering the opening speechGroup photo of distinguished guests and judges at the banquetGroup photo of student participants with Chroma Foundation Chairman Paul YingPaper Award Activity Series: Tech Industry Advocacy and Career Consultation FairOn the day of the final review, Chroma concurrently held the Tech Industry Advocacy and Career Consultation Fair, inviting all participating students and their advisors to take part. At the event, Chroma's R&D leads, product managers, and technical specialists shared their insights on various topics, including Chroma's role in the tech industry, corporate sustainability, career paths from novice engineer to R&D leader, and technological innovation. Six of Chroma's technical experts provided face-to-face career consultations, drawing a large number of students and creating a lively atmosphere at the venue.Gold Award WinnersThe coveted gold award was given to a team from the Department of Power Mechanical Engineering at National Tsing Hua University. Yu-Hsiang Wen, Wei-Chen Kuo, Yi-Kuo Wu, Chun-Yu Wu, and Yu-Chen Wu were recognized for their paper titled "Development of a Full-field Real-time Stress and Strain Measurement System". Their faculty advisors were Professor Dr. Wei-Chung Wang and Dr. Po-Chi Sung.Chroma ATE Chairman Leo Huang (2nd from right) and Gold Award students with Professor Wang Wei-Chung (1st from left).The detailed list of winners can be found on the official website of the Chroma Paper Award.Closing the ceremony, I-Shih Tseng, President of Chroma's Integrated Systems BU, gave a speech: "Generative AI has made people anxious, everyone may be wondering when they will be replaced by AI. However, no matter how technology changes, the need for precise and reliable measurements will always exist. My advice to students is that going to a large company may seem promising, but you may be put in a very small position and stay there for a lifetime.At Chroma, we offer a dynamic and highly challenging work environment. Our colleagues are constantly challenged by Wall Street's "Big 7". For us, every time we have a breakthrough project, we see these technologies being promoted all over the world, going on to shape a better future. We really enjoy the process of making breakthroughs, and we hope that more people can join us in this experience."Group photo of the participants at the 2nd Chroma Paper Award ceremony and banquet

Rugged embedded computer brand—Cincoze has launched two new compact embedded computers in the Rugged Computing—DIAMOND product line. The DA-1200 is a palm-sized device suitable for most industries' basic applications and at a price point that has made it a popular choice among customers for many years. With this latest performance boost, it will likely remain a top choice. The DV-1100 supports the latest 13th/12th generation Intel Core CPUs, providing powerful performance in a streamlined configuration and maximizing cost-effectiveness. It is recommended for industrial sites with high-performance computing needs but limited installation space, such as smart manufacturing, machine vision, and railway computing.Powerful & Tiny Computer – DA-1200Powerful & Tiny Computer – DA-1200The DA-1200 industrial embedded computer has a 12W ultra-low power consumption Intel Alder Lake-N processor and supports 16GB DDR5 4800 MHz memory. Equipped with two M.2 Key B slots (convertible to M.2 Key E with an adapter card), the DA-1200 can cover all wireless communication needs (5G, WIFI, GNSS, etc.) and caters to storage options such as 2.5″ SSD, half-slim SSD, and M.2 SSD. The palm-sized DA-1200 is only 150 x 105 x 52.3 mm, packing the maximum application flexibility into a tiny package.The DA-1200 is easy to install and maintain. It supports wall mount, side mount, and DIN-rail mount options for ease of installation in space-constrained applications. To make setup and adjustment easier for customers, all the key settings and switches—the reset switch, AT/ATX switch, and SIM card slot are all accessible on the front panel maintenance area, making them more convenient. It is an entry-level choice that inherits the rugged DNA of the Cincoze industrial computer lineup. It works across a wide temperature range (-40 to 70°C) and wide voltage range (9 to 48V), complying with the US military shock resistant vibration standard MIL-STD-810H and the EMC test standard for industrial environments (EN IEC 61000-6-2 and EN IEC 61000-6-4).High-performance & Cost-effective Computer – DV-1100High-performance & Cost-effective Computer – DV-1100The DV-1100 supports the latest 13th/12th generation Intel Core CPU and up to 32GB of DDR5 4800 MHz memory and provides high-speed NVMe SSD storage for maximizing processing capabilities. Measuring only 224.1 x 162 x 62mm and supporting 2.5G LAN and 10G USB3.2 Gen2x1, the DV-1100 is the smallest high-performance Cincoze model and an ideal choice for industrial applications such as machine vision and real-time image monitoring that require a computer with a small footprint and high-speed communications. The DV-1100 has built-in M.2 Key B and Key E slots, and I/O and IGN functions can be added using exclusive Cincoze CMI and CFM modules.The DV-1100 passes and complies with several industry certifications or standards, such as EN 50155 (EN 50121-3-2 only) for railway computing, the US military shock-resistance and vibration standard MIL-STD-810H, and the EMC test standard for industrial environments (EN IEC 61000-6-2 and EN IEC 61000-6-4). To ensure we provide our customers with industry-leading quality, the entire Cincoze Rugged Computing—DIAMOND series can not only operate in a wide temperature range (-40 to 70°C) but also pass our stringent internal testing, including a rigorous four cold starts over 17 hours at -40°C. This test challenges current industry limits and ensures the DV-1100 can reliably maintain stable operation in harsh environments.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronic applications, announces an advanced process based on 18nm Fully Depleted Silicon On Insulator (FD-SOI) technology with embedded Phase Change Memory (ePCM) to support next-generation embedded processing devices. This new process technology, co-developed by ST and Samsung Foundry, delivers a leap in performance and power consumption for embedded processing applications while allowing larger memory sizes and higher levels of integrating analog and digital peripherals. The first next-generation STM32 microcontroller based on the new technology will start sampling to selected customers in the second half of 2024, with production planned for the second half of 2025.Remi El-Ouazzane, President of Microcontrollers, Digital ICs and RF products Group at STMicroelectronics, said: "As a leading innovator in the semiconductor industry, ST has pioneered and brought to our customers FD-SOI and PCM technologies for automotive and aerospace applications. We are now taking the next step to bring the benefits of these technologies to developers of industrial applications starting with our next-generation STM32 microcontrollers."Technology benefitsCompared to ST 40nm embedded non-volatile memory (eNVM) technology used today, 18nm FD-SOI with ePCM vastly improves key figures of merit:*More than 50% better performance-to-power ratio*2.5-times higher non-volatile memory (NVM) density enabling larger on-chip memories*Three times higher digital density for integration of digital peripherals such as AI and graphics accelerators and state-of-the-art security and safety features*3dB improvement in noise figure for enhanced RF performance in wireless MCUsThe technology is capable of 3V operation to supply analog features such as power management, reset systems, clock sources, and digital/analog converters. It is the only sub-20 nm technology supporting this capability.The technology also delivers the reliability required for demanding industrial applications thanks to the robust high-temperature operation, radiation hardening, and data retention capabilities already proven in automotive applications.Additional information on FD-SOI and PCM is available on ST.com.Benefits to STM32 microcontroller developers and customers Microcontrollers based on this technology will bring developers a new class of high-performance, low-power, and wireless MCUs. The large memory sizes support the growing needs of edge AI processing, multi-protocol RF stacks, over-the-air updates, and advanced security features. The high performance and large memory size capabilities will give developers using microprocessors today the option to use more highly integrated and cost-effective microcontrollers for their designs. It will allow further steps in power efficiency for ultralow power devices where ST's portfolio is industry-leading today.The first microcontroller based on this technology will integrate the most advanced ARM Cortex-M core, providing enhanced performance for machine learning and digital signal processing applications. It will offer fast and flexible external memory interfaces, and advanced graphic capabilities and will integrate numerous analog and digital peripherals. It will also have the advanced, certified security features already introduced on ST's latest MCUs.18nm FD-SOI with embedded Phase Change Memory (ePCM) to deliver a leap in performance and power consumption

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed a new high-performance device that punches above its weight by combining the performance, scalability, and security of microprocessor-based systems that are typically more complex with the simplicity and integration of microcontrollers (MCUs).Using these new STM32H7 MCUs, producers of equipment like smart appliances, smart-building controllers, industrial automation, and personal medical devices can evolve their products more quickly and cost-effectively as end-user demands continue to increase. Examples include adding richer, colorful user interfaces and performing multiple functions simultaneously, which is usually achieved with microprocessors (MPUs)."Our STM32 is already the world's most popular Arm Cortex-M microcontroller family, and the latest STM32H7 devices let designers address even more use cases within this powerful ecosystem," said Patrick Aidoune, General Purpose MCU Division General Manager, STMicroelectronics. "Its MPU-like qualities deliver outstanding core performance with the peripheral integration and convenience of an MCU, at a cost-effective price point.""With a dedicated graphics processor and fast memory interfaces on-chip, these MCUs are perfectly aligned with our mission to push the boundaries of what's possible in embedded displays," commented Kamil Kozlowski, CEO of Riverdi, a lead customer for the STM32H7R/S MCUs. Riverdi has chosen the devices to power its next generation of display modules. "The MCUs promise to enhance the visual performance and responsiveness of future displays, enabling more engaging and interactive user experiences. This represents a significant step forward in our journey to provide cutting-edge display solutions to our customers."ST's new STM32H7R and STM32H7S microcontrollers come with robust security features, needed to address Internet of Things (IoT) applications. They include protection against physical attacks, memory protection, code isolation to protect the application at runtime, and platform authentication. The STM32H7S devices provide further security enhancement by integrating immutable root of trust, debug authentication, and hardware cryptographic accelerators that support the latest algorithms to prevent unauthorized access to code and data. With these security features, the devices are targeting up to SESIP3 and PSA Level 3 certifications, meeting the highest industry standards for cyber protection.The STM32H7 MCUs combine the highest-performing Arm Cortex-M core ST that has yet to be announced (Cortex-M7 running at up to 600MHz) with minimal on-chip memory and high-speed external interfaces. They let engineers build systems with extra performance and flexibility using simple, low-cost microcontroller development tools. The devices available are further divided into the STM32H7R3/S3 general-purpose MCUs and the STM32H7R7/S7 with enhanced graphics-handling capabilities. Developers can share software extensively between the two lines, enabling efficient use of project resources and faster time to market for new products.Michela Menting, Senior Research Director from ABI Research, said: "IoT hardware security is the holy grail for created trusted devices. The difficulty has been to offer a high level of security for MCU-based embedded hardware while cost-effectively achieving MPU performance; three criteria that are not often seen together in the market. The new STM32H7 MCUs appear to offer just that, with security front and center, built to perform the multi-application requirements of privacy-hungry markets in the consumer and industrial space."ST's new STM32H7 MCUs are scheduled to enter volume production from April 2024. Sample requests and pricing information are available from local ST sales offices.The STM32H7S8-DK demonstration and development platform, and the affordable and extendable NUCLEO-H7S3L8 MCU board, are available to accelerate building applications using the new devices.For more information, please go to www.st.com/stm32h7rs-product-overview.New STM32H7R/S microcontrollers raise embedded-application performance to new levels for next-generation smart devices in factories, buildings, infrastructure, eHealth