Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking heritage, the company offers product design support, prototyping, and manufacturing services for power modules used in electric vehicles, the energy industry, and industrial applications. The rapidly growing automotive industry is driving significant demand for compound semiconductors and back-end packaging to support the growth of power modules, creating a strong demand for power module packaging and manufacturing technologies. The company offers full support to allow power module manufacturers to predictably build quality products at the most competitive price.The Powertrim Flex Line, the flagship manufacturing platform, provides high performance handling, assembly and testing technology for automated power module manufacturing. With its modular architecture, the Flex Line covers the core trim and form processes as well as adjacent process steps like laser marking, laser de-flashing, optical inspection, quality control, testing, loading and unloading.The main focus of Powertrim Technologies is in providing power module back-end packaging equipment and tooling. Through different modular machine designs, they are assembled into production configurations that meet the customized needs of various power module products. The company also provides the well-designed tools to help customers implementing both prototyping, qualification and rapid serial or mass production of power modules.Furthermore, electrification of the automotive transmission system by either battery or hybrid electric motors, new industrial power applications and the massive growth of renewable energy solutions accelerate the need for power modules. With these, Powertrim provides manufacturing equipment, supporting a wide range of power electronics applications, and is strategically collaborating with supply chain partners to centralize services and resources for the EV market, a move designed to meet fluctuating demands efficiently.The existing flagship production line implements a system designed to adapt quickly to changes in product type and quantity, allowing for the efficient production of a variety of power module products on one single machine, hence Flex Line. With this concept, the company is capable of switching between complex product sizes in under 15 minutes. In addition, it can also provide a series of optional add-on units, including loading/offloading modules, laser marking & de-flashing, automatic optical inspection, MES integrated system, which providing software linking to ERP/MES enterprise software platforms. These different arrangements can be flexibly matched and assembled to meet the manufacturing needs.With a presence in the Netherlands, known for its cutting edge semiconductor front-end and back-end equipment, Powertrim Technologies combines precision engineering with scalable automation to unlock markets such as automotive, energy and industrial power applications. At Semicon Taiwan 2025, Powertrim aims to work together with Taiwanese customers to create new opportunities.
Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In addition to its headquarters in the Netherlands, the company has operations in Singapore and China Suzhou. The key technologies of Boschman are silver sintering and Film Assisted Molding (FAM). Boschman uses a pressurized silver sintering process in module packaging to address the stringent challenges and difficulties of power module interconnect technology. The power module market is experiencing substantial growth in Europe and China, driven by the accelerating adoption of electric vehicles (EVs), expansion of renewable energy systems, and increased demand for energy-efficient industrial and consumer electronics. The power modules require sophisticated packaging for high-temperature, high-power, and high-reliability connections. The FAM technologies for protection against harsh environments like high humidity and vibration, as well as to manage thermal and electrical stress. On the other hand, silver sintering offers superior thermal and electrical conductivity compared to traditional soldering process, while FAM with its vacuum-assisted films prevents voids during molding, leading to more reliable and high-performing power modules with better thermal management.Boschman began its journey by developing and manufacturing module packaging molds, then expanded into the research and development of silver sintering packaging equipment. And the company continues to invest in and develop advanced packaging technologies. Boschman specializes in serving the global electronics assembly and semiconductor back-end packaging industries, providing advanced sintering equipment using advanced high-pressure sintering technology. Specifically tailored to the needs of customers of varying sizes and production scales, Boschman's sintering equipment offers a variety of solutions suitable for R&D doing small batches, small- to medium-volume pilot production, and large volume manufacturing environments.Boschman has many years of experience in cooperation with Taiwanese industries, especially in power electronics and components manufacturing service vendors that provide power management, power electronics, and thermal solutions. Among the new business opportunities, OSAT (Outsourced Semiconductor Assembly and Test) companies serve a broad range of semiconductor clients, is one of the key types of customers in Taiwan for Boschman. OSAT customers are providing back-end packaging services such as Tire Pressure Monitor Sensors (TPMS) and other automotive sensors for customers, which has enabled Boschman to gain the benefits.Talking about the business model, Boschman provides customers with packaging design and development, as well as silver sintering process equipment to meet the needs of the automotive supply chains and power system industries. It also provides design proofing and small-batch assembly production services to customers. One more thing, Boschman and Powertrim Technologies, another Dutch company exhibiting at the Netherlands Pavilion, have a collaborative upstream and downstream relationship. These two companies collaborate in the manufacturing of automotive and power module systems in Europe, jointly serving leading Auto and industrial customers.
XIVER, 120 employees, located in High Tech Center of the Netherlands, a carve out from Philips Research started its business on January 2025.XIVER is unique in that they combine the strength of a pure-play foundry with more than 20 years of MEMS process development knowledge and experience in high tech micro systems solutions. A state-of-the art cleanroom of 2600m2 (28,000 sqf), independent positioning in the market and European ownership. XIVERs increasing share of wallet of its top-tier customers in medical, semiconductor equipment and defense are driving its initial growth and success. Secured by high barriers of entry and scarce availability of available manufacturing, make XIVER a first option for innovations in high tech market segments like data centers/AI and IR applications. Further strategic investments in Photonics and Transducers will provide longevity and will be driving accelerated growth in mid to long term.
Axelera AI is a startup targeting Edge AI applications. Leveraging its Metis AI Processing Unit (AIPU) chip, embedded hardware AI inference acceleration cards, and Voyager SDK software solutions, the company specializes in imaging application solutions for applications in edge nodes. Unlike AI systems developed in high-density cloud data centers, Edge AI computing offers energy efficiency, information security, low latency, and fast speed of response, rapidly powering real-time vision and smart detection applications for embedded AI systems. Axelera AI's technology offerings span 4K/8K image resolution real-time image recognition, security surveillance, campus safety, and drone imaging, pioneering a new model for the development of high-performance AI inference in diverse fields. The company's Metis chip boasts a computing performance of up to 214 TOPS (TeraOPS) of inference performance at INT8 precision. For example, using ResNet-50 Convolutional Neural Network (CNN) model doing object segmentation and analysis, a single Metis chip can achieve a high processing speed of 3200 frames per second (FPS), providing stable, real-time analysis capabilities while consuming only approximately 10W. This balance of performance and environmental benefits has attracted significant market attention.Meanwhile, the AI inference acceleration cards integrated with Metis chips are also a major product line. There are two types of accelerator cards that support M.2 and PCIe interfaces, which can quickly meet the needs of system integrators, OEM customers and industrial PC (IPC) makers. With these flexible connection interface, Axelera could engage the business with various embedded AI system makers.In addition to the hardware lineups, Axelera's software support is also a key factor in its success. The Voyager SDK software suite facilitates hardware and software integration for system integrators. There are open source software framework currently available on GitHub for computer vision and enabling customers to solve their AI business requirements. This Voyager SDK comes with a Model Zoo, a catalog of turnkey AI models, allowing customers either to import their own AI models or choose from Model Zoo models. These offerings significantly reduce developing time and excels in functional completeness and efficiency.Axelera AI's business model is based on collaboration with system integrators and OEM clients, encompassing joint development of AI projects and customized data architectures, providing clients with one-stop, high-performance Edge AI solutions. Axelera AI is working closely with major Taiwanese industrial PC vendors and OEM/ODM clients to develop key applications for financial and research institutions, medical solution providers and other public facilities that prioritize data security, privacy, and safety. This initiative aims to create emerging applications for Edge AI and unlock its significant value.
Founded in 1993, Prodrive Technologies designs and manufactures mission-critical products that combine advanced engineering, innovative manufacturing, and global expertise. The company empowers semiconductor equipment manufacturers and customers across multiple industries to accelerate innovation and achieve operational excellence. Headquartered in the Netherlands, with regional hubs in the USA, Japan, and China, Prodrive Technologies serves the semiconductor, medical, life sciences, energy, infrastructure, and industrial markets. Its customer-centric approach, deep engineering expertise, and vertically integrated manufacturing enable fast time-to-market, superior quality, and scalable systems.The company's portfolio spans optical and e-beam cameras, embedded computing systems, high-precision motion control and drives, and RF plasma power solutions. These offerings are available as off-the-shelf products, customized systems, or turnkey solutions.With its broad product range, flexible business model, and decades of experience in the semiconductor sector, Prodrive Technologies is now also exploring opportunities in Taiwan. As home to the world's largest semiconductor foundry and a growing ecosystem of equipment manufacturers, Taiwan represents a potentially strategic market where Prodrive's innovation, quality, and speed-enabled by its unique vertical integration-can create significant value.
As businesses face dramatic changes in the global market environment, companies worldwide are accelerating their digital transformation efforts, seeking competitive advantages through innovative technologies. Yet, while many departments have embraced automation, legal teams often remain the slowest to digitalize. Manual contract review still dominates daily operations, with a single document taking one to two weeks to pass from sales to legal approval.Such delays not only disrupt decision-making but also affect overall business performance. Addressing this long-standing challenge, LegalSign.ai has launched an end-to-end generative AI legal workflow management platform that accelerates contract and document review with precision and transparency, fundamentally redefining corporate legal operations.According to Chih-Tung Chen, CEO of LegalSign.ai, lengthy manual reviews often force companies to ship products before contracts are finalized - taking on significant legal risk just to maintain business momentum. To tackle these inefficiencies, LegalSign.ai's cross-disciplinary team of legal and AI experts has created a one-stop generative AI legal workflow platform that resolves these long-ignored bottlenecks. The solution is already trusted by leading enterprises such as Acer, CTBC Bank, Cathay Financial Holdings, and ezTravel, proving its value across industries.Integrating legal expertise and generative AI to address three core challengesFounded in 2019 by experienced lawyers and patent attorneys with over 25 years of combined practice, LegalSign.ai operates across Taiwan, the United States, and China. The company's founding mission is to ensure that "legal work is no longer an island buried in paperwork." By combining deep legal expertise with generative AI, LegalSign.ai transforms legal operations into a streamlined, digital, and automated process, helping enterprises manage contracts and risks more efficiently and intelligently.LegalSign.ai's all-in-one platform addresses three major pain points for legal departments - workflow management, compliance auditing, and risk control. Through generative AI, the platform digitalizes the entire contract lifecycle, covering drafting, review, negotiation, signing, execution, archiving, retrieval, and risk management. This comprehensive approach enables enterprises to significantly improve productivity while cutting costs and mitigating legal exposure.Chen explained that the platform integrates three core capabilities: generative AI-powered compliance management, legal workflow lifecycle management, and electronic signature services. For instance, the AI assistant draws on a library of over 400 contract templates to generate legally sound drafts, minimizing hallucinations or logic errors. It can also translate and compare documents, automatically highlighting high-risk clauses to assist in compliance monitoring.Building trustworthy legal AI services on AWSFollowing its recognition with the AWS Generative AI Rising Star Award in 2024, LegalSign.ai joined the Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC) program in 2025 to further expand its visibility and pursue new business collaborations. The company is implementing Amazon Elastic Compute Cloud (Amazon EC2) to leverage cloud GPUs for enhanced AI computation and inference efficiency, aiming to deliver trusted, enterprise-grade legal AI cloud services globally through AWS cloud infrastructure.Chen emphasized that legal AI differs from typical generative AI applications due to its high data sensitivity and territorial restrictions. Given ongoing data security and regulatory concerns in China, Taiwan has emerged as a trusted hub for legal AI solutions serving international enterprises. Leveraging AWS's global cloud infrastructure, LegalSign.ai is executing a "Chinese-language legal AI + AWS Cloud" strategy to bring Taiwan's legal technology to the world. The company's initial overseas expansion targets Japan and the United States, with current collaboration focused on a bilingual legal AI platform serving multinational corporations.
HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable again after use, as well as manage the packaging logistics of high-quality industrial products. They do so for clients in the semiconductor and other high-tech industries.The process procedures and packaging solutions ensure the parts, modules or components of highly sophisticated equipment are fully protected during transportation and logistical arrangements. And at the same time, the system will meet the customer demand for protection of valuable products during transit while adhering to environmental, social, and governance (ESG) principles. The packaging design incorporates features like sustainable materials, waste reduction strategies, and carbon footprint minimization, alongside ensuring the integrity of high-value goods through robust physical protection.The company provides complete packaging solutions, starting with the development and sourcing of customized packaging materials. HQ Pack's regional Service Centers ensure that reusable packaging materials are ready to use again by cleaning and repairing them to like-new condition. They can also support reuse of parts by harvesting them before scrapping for new build packaging. If there is material destined for waste management, HQ Pack supports this at the same time. Because most of its high-tech clients operate on a global scale, HQ Pack operates not only at its headquarters in Eindhoven, the Netherlands, but also in Johor and Penang in Malaysia, Taiwan, Singapore, Germany, and in the United States (locations in Brookfield (CT), Newark (CA), and San Diego (CA)) providing the same quality and service at each location. With their Service Centers they support both their customers' sustainability goals as well as their own.Their slogan "We Create to Protect" is exactly what they do. The high-quality packaging solutions ensure that valuable and fragile products, modules, components and/or parts can be safely transported worldwide. With over 40 years of experience and global presence, no compromission on quality, flexibility at the heart of our organization, they are a full-service provider with fast, reliable and sustainable packaging solutions.
Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation, light etching and processing, as well as UV photoresist curing and charge erase. It also manufactures UV curing equipment, focusing on equipment used in compound semiconductor processes. These equipment are used in the production of wide-bandgap semiconductor power devices such as silicon carbide (SiC) and gallium nitride (GaN), as well as other important processes such as communication power amplifiers (PAs).Trymax has been established for over 25 years and has a considerable customer base and brand recognition in the Taiwanese market. At Semicon Taiwan 2025, the company primarily serves to promote its products and connect with key clients. With a product portfolio ranging from 100mm to 300mm wafer size, Trymax's clients are on both sides of the Taiwan Strait becoming major suppliers to the manufacturers of power amplifiers and RF components. In the global presence, Trymax has significant market shares at foundries, IDMs and wafer level packaging houses for end applications in Power semiconductor, automotive, MEMS, LED and CMOS.Trymax's NEO series plasma dry descum systems are suitable for cleaning and activation processes in the semiconductor industry, offering high efficiency, uniformity, and repeatability. These systems utilize RF/microwave power to generate high-energy, disordered plasma under vacuum conditions. They can process a wide range of substrate sizes and offer a variety of processing technologies for flexible customer selection, meeting the needs of diverse semiconductor process technologies.Trymax continuously innovates to support its customers’ needs. In addition to the compound semiconductor processes, it is also widely used in application fields such as MEMS microelectromechanical systems, microfluidic devices, SOI substrate manufacturing, advanced packaging and optoelectronic displays. Among them, the global installed capacity of NEO system equipment has exceeded 300 sets.
Empowered by the Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC), eNeural is redefining the landscape of edge AI with two flagship innovations - AI-Craft, an automated AI development platform, and an edge AI self-learning solution. These breakthroughs aim to make AI truly self-learning and self-evolving, helping industries overcome long-standing barriers in deploying AI at the edge.As AI applications rapidly expand across industries, enterprises have realized that beyond computing power, the biggest barriers to AI implementation lie in the high cost and lengthy cycle of model training. For system integrators, success increasingly depends on the ability to integrate optimized AI models into lightweight edge devices to deliver reliable inference services in real time.A spin-off startup from National Yang Ming Chiao Tung University (NYCU), eNeural combines strong academic research foundations with practical AI R&D experience. The company has already forged partnerships with major electronics manufacturers including Quanta, Compal, and Lite-On, and is collaborating with a North American e-commerce logistics fleet on developing an AI-based collision warning system.According to eNeural CEO Eric Huang, edge devices are typically designed to be small, lightweight, and energy-efficient, which makes AI model optimization particularly challenging. "Our AI-Craft platform provides a one-stop, modular, and standardized AI development workflow," said Huang. "It allows developers to automatically generate optimized models as efficiently as products rolling off an intelligent production line."Edge AI self-learning accelerates model optimization and reduces costsFounded in 2022, eNeural focuses on proprietary AI technology R&D, with AI-Craft serving as the backbone of its innovation. The platform integrates four key technology modules - automated annotation, model pruning, model quantization, and generative AI data augmentation - to make AI development faster, more scalable, and more energy-efficient.Using pre-trained AI models and advanced image analysis algorithms, AI-Craft boosts data labeling efficiency by 10 to 100 times, significantly shortening AI project launch time. Model pruning removes redundant parameters to enhance computational efficiency by up to 90% without compromising accuracy, while reducing the memory and processor load.Model quantization converts floating-point operations into 8-bit, 4-bit, or even 2-bit precision, dramatically lowering power consumption and enabling smooth deployment of AI models on compact edge devices. Meanwhile, generative AI data augmentation automatically creates training data for rare yet critical conditions - such as night, rain, snow, or backlight - improving AI model robustness and generalization.Traditionally, AI models deployed on edge devices must send large amounts of data back to the cloud for retraining - a process that consumes time and resources. eNeural's Edge AI Self-Learning technology allows models to learn and recalibrate autonomously in real time, reducing the need for cloud data transfer."For example," Huang explained, "when fleet vehicles operate under different weather, lighting, or road conditions, the AI model can automatically adjust its decision logic to maintain accuracy. With federated learning, training results are securely shared across thousands of vehicles." This innovation reduces retraining cycles from months to weeks and significantly lowers AI operation and maintenance costs.AWS JIC Accelerates cloud transformation and strategic collaborationSince joining the AWS JIC in 2025, eNeural has leveraged the expertise of AWS specialists to upgrade its AI-Craft platform using Amazon SageMaker, a fully managed machine learning (ML) service, and Amazon Elastic Compute Cloud (Amazon EC2) GPU computing power. This transformation has turned AI-Craft into a cloud-based development solution, enabling developers to perform automated annotation, model pruning, and quantization in the cloud. With dynamic AWS resource allocation, eNeural can efficiently run multiple AI projects in parallel with greater scalability and cost efficiency.Participation in the AWS JIC program has also opened doors for new business collaborations. Huang shared that while earlier partnership talks with Advantech did not progress, joining the AWS JIC program led to the successful signing of a Memorandum of Understanding (MOU) between the two companies in 2025. Under this collaboration, eNeural will feature its two flagship AI solutions on Advantech's Marketplace, paving the way for deeper engagement with system integrators worldwide.Beyond Taiwan, eNeural is actively expanding into the U.S., Japan, and India. Leveraging AWS's global cloud infrastructure and innovation ecosystem, the company is pursuing a "software-driven core + hardware collaboration" strategy, collaborating with global players to unlock new opportunities in the rapidly growing edge AI market.
As global urbanization accelerates and populations significantly age, cities worldwide are investing heavily in smart city development. The goal is to create safer and more efficient urban environments through AI and digital technologies, enhancing citizens' quality of life. With the emergence of Vision-Language Models (VLM) combined with generative AI, smart city applications have entered a new phase - enabling systems to automatically interpret traffic flow, pedestrian behavior, and unexpected incidents from video footage, and thereby supporting real-time decision-making.In his keynote address ahead of COMPUTEX 2025 in Taipei, NVIDIA CEO Jensen Huang highlighted Kaohsiung's "Smart Kaohsiung Lighthouse Project," which leverages a VLM-based digital twin architecture to interconnect tens of thousands of city surveillance cameras, significantly improving the efficiency and service capabilities of the municipal government. The key technology driving this initiative comes from Linker Vision, a company renowned for its expertise in computer vision technology.Joining the NVIDIA ecosystem to advance smart applicationsWith more than a decade of experience in AI-powered image recognition, Linker Vision has become a trusted partner for many leading global brands. Following the rapid rise of generative AI in 2023, the company began applying VLM's powerful visual comprehension and semantic reasoning capabilities to achieve a deeper understanding of real-world scenes.Unlike traditional object recognition models, VLM can identify a broad range of objects without additional training while discerning contextual relationships among them. This enables the system to detect complex incidents and assess damage that conventional models often fail to recognize. Building on its solid foundation in visual recognition, Linker Vision utilizes VLM's multimodal data processing capabilities to develop a suite of solutions for smart city and smart factory applications.Yi-Ting Liu, Senior Sales Manager at Linker Vision, explained that the company's smart factory solutions are designed to address enterprises' dual challenges of improving workplace safety and operational efficiency. In smart safety applications, the system can accurately detect fires, chemical leaks, or safety violations - such as workers entering restricted areas or failing to wear protective gear - and even identify complex behaviors like "smoking within a restricted zone," triggering composite alerts in real time. Beyond safety, the solution also monitors employee productivity, status, and compliance with standard operating procedures (SOPs), providing factory managers with a visualized, data-driven management tool that effectively reduces human error.Building global presence through AWSLinker Vision has built its solutions on Amazon Web Services (AWS) for many years, achieving outstanding results in the smart city and smart factory domains through modular and standardized system architectures. Yi-Hsuan Lin, Product Manager at Linker Vision, noted that the company extensively utilizes AWS's AI computing power and services, including Amazon Elastic Kubernetes Service (Amazon EKS), Amazon Elastic Compute Cloud (Amazon EC2), and Amazon Bedrock, a fully managed service that offers a choice of high-performing foundation models (FMs) and tools to deploy and operate agents.The key advantage, Lin said, lies in AWS's on-demand flexibility, which enables the team to access the latest GPU resources anywhere in the world, substantially reducing hardware procurement and maintenance costs. When conducting proof-of-concept (PoC) trials across borders, deployments can be launched instantly on AWS's local infrastructure closest to customers, eliminating the time and expense required for purchasing and installing physical hardware. Amid the global push toward Sovereign AI, Linker Vision also offers hybrid cloud and on-premises services, helping enterprises optimize AI models, develop tailored solutions, and ensure data privacy compliance.Expanding internationally with AWS JIC supportLiu emphasized that participation in the AWS Joint Innovation Center (JIC) has laid a strong foundation for Linker Vision's market development and international expansion. Beyond providing abundant cloud resources and technical expertise, the JIC offers a comprehensive set of empowerment services, including business networking, corporate matchmaking, and marketing exposure, helping Linker Vision connect with strategic partners and accelerate business growth.With rapid momentum in the Taiwan market, the company now aims to expand globally-targeting the Middle East, Southeast Asia and the United States-to capture the vast opportunities in smart city and smart factory development.