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Friday 5 December 2025
Navigating Semiconductor Demand and Supply Challenges in 2026
At NewPower Worldwide, we are closely monitoring the accelerating shifts in the semiconductor market as global demand surges to unprecedented levels. Procurement professionals across every industry are preparing for 2026, a year that is shaping up to be fiercely competitive as demand continues to soar while supply remains limited.
Thursday 4 December 2025
ASIC Shift for High-Speed Computing: PGC's Design Service Turnkey Platform Speeds Time-to-Market
As AI workloads move from cloud to edge, the volume of image and sensor data across industries is rising rapidly. Edge devices that previously relied on FPGAs and off-the-shelf modules are now running into combined constraints in power, latency, and cost...
Wednesday 3 December 2025
TUVIT powering industrial IT security and cybersecurity with testing, compliance and certification
The European Union Artificial Intelligence Act (EU AI Act) is set to be fully implemented in 2026, and the Cyber ??Resilience Act (CRA) is scheduled for 2027. Adding the Radio Equipment Directive Delegated Act (RED-DA) already took effect on August 1, 2025, those three legislative measures collectively emphasize mandatory requirements for information security and cybersecurity.
Tuesday 2 December 2025
NEXCOM and Stereolabs announce collaboration to deliver AI Vision solutions for Mobility, Robotics and Industrial Markets
NEXCOM International, a global leader in rugged edge computing platforms, and Stereolabs, a pioneer in AI vision and 3D perception,  announced a long-term collaboration to deliver cutting-edge AI vision solutions for B2B organizations across mobility, robotics, and industrial automation sectors...
Thursday 27 November 2025
Fusion Worldwide: The Three Resources That Actually Gate AI Progress Right Now
From TSMC to SK hynix, every Q3 2025 earnings call delivered the same sobering message, the AI build-out is being throttled by three physical choke points that no amount of 2025 capex can fix fast enough. Leading-edge foundry, HBM memory, and advanced packaging are all sold out, not just for next quarter, but for the next three to five years. Here’s exactly where the wall is.
Wednesday 26 November 2025
GaNrich Delivers Portfolio from 40V to 1200V For the Data Center HVDC Architecture
As energy consumption in AI servers and data centers rapidly increases, High Voltage Direct Current (HVDC) has emerged as a key direction for next-generation power system. Traditional AC/DC multi-stage architectures suffer significant conversion losses, limiting overall efficiency to around 85%, prompting the industry to accelerate its transition toward 800V (or ±400V) HVDC systems.
Wednesday 26 November 2025
Smart dining transformation accelerates: ASUS IoT IoRT solutions enhance operational efficiency in chain restaurants
As digital technology becomes more prevalent and customer expectations rise, digital menu boards have emerged as crucial tools for chain restaurants looking to boost branding and operational efficiency...
Wednesday 26 November 2025
Facing the rise of AI, how does Global Instrument Technology leverage Chunghwa Telecom's IDC for the manufacturing industry's AI-driven transformation
The manufacturing industry is facing major changes with the rapid development of artificial intelligence (AI) technology, which has made computing power and AI application services the "new oil" that fuels the competitiveness of enterprises. However, simply stacking hardware is not enough to run AI models, which are highly dependent on a stable and secure computing environment with low latency...
Tuesday 25 November 2025
ASUS IoT AISEHS raises intelligent security standards, helping semiconductor industry move from passive to active protection
The semiconductor sector demands stringent security and cybersecurity standards; any lapse may compromise brand reputation and operational integrity...
Monday 24 November 2025
Leading the Liquid Cooling Revolution: Southco's Blind Mate Floating Mechanism Empowers Efficient Cooling in Data Centers
Global computing power is growing aggressively and pushing high-density chip power consumption. As this power density increases, traditional air cooling is reaching its physical limits, and once-fringe liquid cooling technology, boasting thermal efficiency hundreds of times greater than air cooling, is rapidly becoming core infrastructure.