When spine surgeons talk about pressure, few procedures rival C1–C2 fixation - a surgery so delicate that a deviation of just a few millimeters can mean the difference between success and catastrophic complications.

In today's wellness-driven world, yoga has evolved into more than just a physical practice - it has become a daily ritual for hundreds of millions of people worldwide. It now stands as one of the most widespread and diverse disciplines in the health and fitness industry.  Yet between "doing yoga" and "doing it right," a persistent instructional gap remains.

Luna, the health-tech company behind the Luna Ring today announced the launch of LifeOS V1, a foundational upgrade to the Luna Ring that introduces one of the first truly vertically integrated AI systems designed to unify the full spectrum of personal health data into a single, intelligent interface...

ROHM Co., Ltd. (hereinafter "ROHM") has decided to integrate its own development and manufacturing technologies for GaN power devices with the process technology of TSMC, with which ROHM has an ongoing partnership, to establish an end-to-end production system within the ROHM Group...

Teamsworld Innovation Inc. announced its AI-powered manufacturing matchmaking platform, targeting multinational enterprises seeking to diversify supply chains. The platform connects clients with precision component manufacturers in Taiwan and mass production facilities in Vietnam, addressing information gaps and geopolitical risks in cross-border sourcing...

XTPL (WSE:XTP), a developer of Ultra-Precise Dispensing (UPD) technology for nanomaterial deposition, has entered a strategic partnership with Manz Asia to support the development and commercialization of advanced semiconductor packaging applications.

Seoul, February 26, 2026 – SK hynix Inc. (or "the company", www.skhynix.com) and Sandisk Corporation held 'HBF Spec. Standardization Consortium Kick-Off' event at Sandisk Headquarters in Milpitas, California on the 25th(local time) announcing global standardization strategy of next-generation memory solution HBF(High Bandwidth Flash) aimed at the AI inference era.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced it has successfully taped-out industry-leading, Universal Chiplet Interconnect Express. (UCIe.) IP, achieving a data rate of 64 Gbps per lane, the highest speed defined in the UCIe specification...

ASUS today announced ASUS Optimized Liquid-Cooling Solutions and a strategic partner framework designed to address the escalating thermal, power, and density challenges of next-generation AI and high-performance computing data centers.

Tong Hsing Electronic, a global leader in semiconductor assembly and testing services, today announced a strategic collaboration with Singapore-based AI solutions provider SixSense, following a comprehensive market evaluation. The partnership aims to advance Tong Hsing's smart factory initiatives, with an initial focus on AI-driven defect classification (ADC) in manufacturing processes.