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Tuesday 24 February 2026
QuiX Quantum and Artilux Partner on Energy-Efficient Photonic Quantum Computing
QuiX Quantum, a leading provider of photonic quantum computing hardware, and Artilux, a developer of advanced semiconductor-based photonic detector technologies, today announced the signing of a Memorandum of Understanding (MoU).
Monday 9 February 2026
iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
iCatch Technology, a Taiwan leading image processing SoC and solution provider and DXOMARK, the global authority in image quality evaluation as well as provider of imaging solutions, have entered into a strategic collaboration to establish the first automatic  image quality performance evaluation lab in Taiwan...
Friday 6 February 2026
2026 Market Outlook: Key Opportunities & Risks to Watch
Entering 2026, the electronics supply chain is defined by strong demand, shifting trade policies, and ongoing geopolitical uncertainty. Customers increasingly seek supply assurance and smarter inventory strategies...
Thursday 5 February 2026
Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
Attopsemi, a pioneering provider of innovative One-Time Programmable (OTP) IP solutions, today announced a significant technological leap: its proprietary I-fuse technology has achieved silicon validation on the 7nm FinFET process...
Wednesday 4 February 2026
Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
Tactile sensing is rapidly emerging as a critical foundation for next-generation applications across consumer electronics, robotics, automation, healthcare, manufacturing, and immersive technologies such as VR/AR and telepresence...
Tuesday 3 February 2026
Asia FinTech Alliance (AFA) Announces Leadership Election Results
The Asia FinTech Alliance (AFA) recently announced the results of its latest leadership election, conducted in full accordance with the AFA Bylaws unanimously adopted by all members in 2025.
Monday 2 February 2026
Smiths Interconnect to Showcase Next-Generation Test Solutions at DesignCon 2026
DesignCon, the United States' premier annual gathering for chip, board, and systems design engineers, returns to the Santa Clara Convention Center from February 24-26, 2026. For over three decades, this flagship Silicon Valley event has served as the essential forum for industry professionals to discover innovative solutions to the most pressing signal and power integrity challenges.
Friday 30 January 2026
BIWIN Mini SSD Ecosystem Application Seminar Concluded Successfully
The "From Shenzhen to Global Opportunity: BIWIN Mini SSD Ecosystem Application Seminar", jointly hosted by BIWIN and Intel, was successfully concluded at the Intel Greater Bay Area Innovation Center in Shenzhen.
Wednesday 28 January 2026
SK hynix Announces FY25 Financial Results
SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has achieved record financial results in 2025 – 97.1467 trillion won in revenue, 47.2063 trillion won in operating profit (with an operating margin of 49%), and 42.9479 trillion won in net profit (with a net margin of 44%).
Wednesday 28 January 2026
Lightmatter and GUC Partner to Produce CPO Solutions for AI Hyperscalers
Collaboration combines GUC's ASIC design leadership with Lightmatter's industry-leading 3D CPO platform to redefine AI infrastructure scalability.Lightmatter, the leader in photonic interconnect solutions for AI, and Global Unichip Corp...