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Wednesday 28 January 2026
Ministry of Economic Affairs Launches 2026 Best AI Awards
The Ministry of Economic Affairs (MOEA) officially announced the launch of the 2026 Best AI Awards during a press conference held on January 20, 2026. This prestigious competition serves as a strategic platform to bridge Taiwan's software innovation with its world-class semiconductor industry, aiming to solidify the nation's position as a global hub for artificial intelligence.
Wednesday 21 January 2026
iCatch and Jet Opto Announce 4K Automotive AI Imaging Solution
iCatch Technology
Monday 19 January 2026
KLA Strengthens Taiwan Presence, Investing NT$465M in Talent and Technology
The semiconductor industry stands at one of its most pivotal moments. As AI drives explosive demand for computing power, chip manufacturing grows exponentially - die sizes are scaling, tolerances are tightening, and the margin for error has nearly vanished.
Wednesday 14 January 2026
Trymax - Plasma-based etching, stripping and curing process equipment maker
Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation, light etching and processing, as well as UV photoresist curing and charge erase. It also manufactures UV curing equipment, focusing on equipment used in compound semiconductor processes...
Tuesday 13 January 2026
AGI Advances AI-Ready Next-Gen Storage Layout at CES 2026
AGI Technology, the innovative Taiwanese memory brand, has successfully concluded its showcase at CES 2026. Located at Bellini 2001B in The Venetian Resort, Las Vegas, AGI presented its next-generation high-speed and mobile storage solutions under the theme "Powering What's Next with AGI Innovation", attracting interest from global brand partners, system integrators, and professional creators.
Tuesday 13 January 2026
HQ Pack - global full-service provider of high-tech packaging from design to reuse
HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable again after use, as well as manage the packaging logistics of high-quality industrial products. They do so for clients in the semiconductor and other high-tech industries.
Friday 9 January 2026
Taiwan III launches national team to deliver DCBBS computer cabinet
Generative AI is fueling accelerated growth in worldwide computing power requirements, yet the industry encounters significant challenges...
Thursday 8 January 2026
EDOM Unveils NVIDIA Jetson T4000, Powering Lightweight and Stable Edge AI
EDOM Technology (TWSE: 3048), Asia’s best solutions provider, today announces the introduction of NVIDIA Jetson T4000 edge AI module, addressing the growing demand from system integrators, equipment manufacturers, and enterprise customers for balanced performance, power efficiency, and deployment flexibility...
Tuesday 6 January 2026
SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
Seoul, January 6, 2026 – SK hynix Inc. (or "the company", www.skhynix.com) announced today that it will open a customer exhibition booth at Venetian Expo and showcase its next generation AI memory solution at CES 2026, in Las Vegas from January 6 to 9 (local time).
Tuesday 6 January 2026
Portwell Acquires Wincomm Stake to Expand Medical Industrial Edge AI
Portwell, Inc., a leading provider of industrial and embedded computing solutions and a subsidiary of Posiflex Technology Inc., today announced its strategic investment in Wincomm Corporation, acquiring a 41% ownership stake and becoming its major shareholder.