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Around the web

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11 Nov 2004

Micron overtakes Hynix in chip sales (Nov 11)

Taiwan WLAN shipments reach 16.2 million units in 3Q, up 23% sequentially (Nov 9)

iSuppli raises mobile-phone forecast despite inventory glut (Nov 10)

Superfast notebook graphics: NVidia's GeForce Go 6800 (Nov 10)

Samsung's 2005 Investment (Nov 10)

LCD selling prices drop by a quarter (Nov 10)

Samsung looking to expand in mobile handset LCD market (Nov 10)

Leadis Technology announces new CSTN LCD driver IC (Nov 10)

Korea-Japan technology war escalates (Nov 10)

In-Stat/MDR: Bluetooth shipments expected to double this year (Nov 09)

ST debuts megapixel camera chipset for mobile devices (Nov 8)

Vodafone rolls out 3G service in Europe (Nov 10)

Freescale claims 90nm lead, sees 65nm tape-out mid-2005 (Nov 10)

MSCI seen including KDDI, Hynix, Thai Oil (Nov 10)

Skype calls on Siemens phones (Nov 11)

10 Nov 2004

AMD and Chartered sign sourcing and manufacturing technology agreements

China mobilizing on 3G IP (Nov 8)

UMC head criticizes rival Chang (Nov 10)

Electronica: Xilinx focuses on low-power (Nov 9)

MRAM, FeRAM offer new levels of performance (Nov 9)

ASML lands lithography order from Matsushita (Nov 9)

The CEO interview: with Intel's Craig Barrett (Nov 9)

Sharp launches 23-inch LCD (Nov 9)

Television vendors laud reduced tax (Nov 9)

STMicroelectronics is set to drive SiC-device competition (Nov 9)

The next generation of Intel® Xeon™ processors

Infineon reports increased revenues and earnings for fourth quarter and fiscal year 2004 (Nov 9)

Samsung leads global TFT-LCD market (Nov 9)

RIM shares fall amid NTP jitters, WSJ article (Nov 9)

Skype lures developers with software giveaway (Nov 9)

9 Nov 2004

TI begins producing DSPs using 90-nm technology (Nov 8)

Hurdle looms over Hynix, ProMOS cooperation deal (Nov 8)

TI delivers smallest white LED power management solution for smart phones, cameras and handhelds (Nov 8)

Taiwan shares end up on financial gains (Nov 8)

Chinese LCD makers facing acid test (Nov 8)

Solid growth for LCD screens (Nov 9)

Nokia bows to cellcos in midrange (Nov 8)

STATS ChipPAC expands die stacking technology for high performance leadframe based packages (Nov 8)

STATS ChipPAC has further expanded its die stacking technology to include two leadframe based performance packages, exposed pad Thin QFP (TQFP-ep) and the Quad Flat No Lead (QFN) package family.

CyberLink launches new PowerDVD 6 solution (Nov 8)

Spansion plans new breed of chip (Nov 8)

1229/1505 pages

Texas Instruments executive discusses high-voltage power architecture for AI data centers
Texas Instruments (TI) plans to showcase its 800V power architecture-based AI data center solutions...

Meta's Manus acquisition blocked by China
On April 27, China's National Development and Reform Commission (NDRC) blocked Meta Platforms' acquisition of AI startup Manus, which was founded in...

Special reports

What Nvidia and Broadcom's CPO bets reveal about the future of AI infrastructure

The CPO market is projected to grow sharply by a 142% CAGR from 2026 to 2030 (excl. ELS) and as AI clusters scale and 3.2T data...

Accelerating enterprise AI: Hardware advancements and compute architecture transformation

According to DIGITIMES, six major AI applications - chatbots, software development, image generation, video generation, enterprise...

Google, Apple, Matter new smart home innovations

Google and Matter are aggressively pushing into smart home innovations, while Apple's deployment still needs more time to be...

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