OCP APAC Summit 2026

The OCP APAC Summit 2026 takes place August 11-12 at the TaiNEX2 exhibition hall in Taipei.

The OCP APAC Summit 2026 takes place August 11-12 at the TaiNEX2 exhibition hall in Taipei. The OCP APAC Summit will showcase the latest innovations and technical advancements from around the world and feature talks from experts who are researching, designing, building, and running the next generation of hyperscale data center facilities and infrastructure.

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IN THE NEWS

Monday 17 August 2026

Lightmatter sets optical interconnect blueprint as AI hits copper wall

AI data centers are approaching a physical limit: as scale-up architectures stretch across multiple racks and SerDes speeds near 448G,...

Monday 17 August 2026

OCP APAC 2026: When AI starts running the hardware that runs it

The tech industry has long been fixated on one persistent bottleneck: the physical limitations of high compute in the AI era. But what if the industry's focus, rather than pouring...

Friday 14 August 2026

OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?

For years, the logic of AI infrastructure has been straightforward: move more data, push more power, transmit more signals, remove...

Friday 14 August 2026

Kioxia eyes customer trials for PCIe Gen6 optical SSD

Kioxia is developing a PCIe Gen6 optical SSD and hopes to work with customers on its next prototype, as the Japanese memory maker tackles...

Friday 14 August 2026

Intel tests system memory to ease AI KV-cache pressure

Intel tests presented at the OCP APAC Summit 2026 that moving the key-value cache used in large language model (LLM) inference from GPU memory to system DRAM can raise serving throughput...

Friday 14 August 2026

Rapidus targets 8-reticle interposers by 2030

Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...

Thursday 13 August 2026

Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

Thursday 13 August 2026

OCP APAC 2026: Ayar Labs CEO says copper is holding back open compute, sees optical interconnects as way forward

Speaking at the OCP APAC Summit 2026, Ayar Labs CEO Mark Wade argued that copper interconnects have become one of the biggest obstacles to realizing the vision of open computing.

Thursday 13 August 2026

Lightmatter white paper targets fragmented supply chain, barriers to photonic interconnect deployment

Bijan Nowroozi, Head of Ecosystem Development at Lightmatter, announced at the OCP APAC Summit 2026 that the company has released an infrastructure white paper aimed at building a...

Thursday 13 August 2026

OCP APAC 2026: Intel sees agentic AI shifting bottlenecks toward CPUs, memory

Intel sees agentic AI changing the balance of AI servers, as CPU orchestration, memory capacity and data movement emerge as performance constraints even when more GPU capacity is a...

Thursday 13 August 2026

409.6T switches could push industry toward CPO, Arista says

Co-packaged optics (CPO) has become a major focus of the optical networking industry, but pluggable modules remain the mainstream choice for optical interconnects. At a silicon photonics...

Thursday 13 August 2026

Can diamond rewrite the rules of AI chip cooling? Wiwynn is putting it to the test

As AI processors become more powerful, one of the industry's most stubborn constraints is becoming increasingly physical: there is only so much heat conventional materials can move...

Wednesday 12 August 2026

OCP APAC 2026: Google says 48V hits wall as AI racks head toward megawatt scale

Google used its keynote at the OCP APAC Summit in Taipei on August 11 to argue that the 48V power architecture widely used in data centers is running out of headroom as AI racks move...

Wednesday 12 August 2026

OCP APAC 2026: Ecosystem not yet ready for co-packaged optics, ASE's Nicole Tien warns

Co-packaged optics has become the inflection point for AI infrastructure, but the industry has not yet built the shared testing standards...

Wednesday 12 August 2026

OCP APAC 2026: AMD sees AI agents pushing CPU-GPU ratio toward 1:1

AMD expects the shift from chatbots to agentic AI to sharply increase CPU demand alongside GPU acceleration, potentially moving the traditional CPU-to-GPU ratio from roughly 1:4 toward...

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