Supply chain


High-bandwidth 1Gb LPDDR3 from Winbond helps latest Kneron KL720 SoC achieve new industry-high 1.4 TOPS throughput in edge AI applications

Tuesday 22 September 2020

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today revealed that the latest system-on-chip (SoC) from artificial intelligence (AI) pioneer Kneron, the KL720 launched in Aug, includes a 1Gb LPDDR3 DRAM die from Winbond.

Highlights of the day: 8-inch foundry quotes rising

Tuesday 22 September 2020

Supply of 8-inch foundry capacity has been tight, with delivery lead time extending to three to four months. Rush orders placed with 8-inch...

Wistron Medical expects rising sales in 2021

Tuesday 22 September 2020

Wistron Medical Technology, an affiliate of the Wistron Group, sees good progress in medical product developments and expects its medical solutions to drive up...

ASMPT total power solution to explore the future of new generation WBG power devices

Tuesday 22 September 2020

Power semiconductor plays a very important role for all electronics ranging from smartphone, home appliances, health care equipment, computer, networking, data...

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