Vietnam is changing fast. The country is attracting more foreign investment, especially in manufacturing and artificial intelligence (AI). Big companies from the US, Europe, and Asia are setting up factories and research centers here. This is not just about cheap labor anymore. It's about technology, skills, and new ideas.Foreign investment keeps risingIn the first five months of 2025, Vietnam pulled in over US$18 billion in foreign investment. That's a big jump from last year. Most of this money is going into factories, digital technology, and AI. Real estate is still important, but the focus is shifting. Investors want to build things, not just buy land.The government is making it easier for companies to set up shop. They're fixing rules, building better roads, and supporting new businesses. They want Vietnam to be a place where high-tech companies can grow. This is part of a bigger plan to boost the economy and create more jobs.Why companies are choosing VietnamVietnam's location helps. It's close to China, Japan, and other big markets. Labor costs are lower than in China. The country is part of several trade deals, so it's easier to export goods. These things make Vietnam attractive for companies that want to build electronics, semiconductors, and other tech products.Big names like Samsung, Intel, and Foxconn are already here. Apple is moving some of its manufacturing from China to Vietnam. Google and Meta are expanding too. Even SpaceX and the Trump Organization have announced big investments.But it's not just about foreign companies. Local firms like FPT are growing fast. They're working with global tech leaders like NVIDIA to build AI factories and train workers.AI is more than a buzzwordAI is not just a trend in Vietnam. It's becoming part of daily life and business. The government has set up a national AI strategy. They want to train more people, build research centers, and support startups. The goal is to make Vietnam a leader in AI in Southeast Asia.Vietnam now ranks 5th in ASEAN for AI readiness and 59th in the world. That's a big jump in just a few years. The country is investing in data infrastructure and encouraging universities to teach AI skills. FPT, for example, is working with NVIDIA to build an AI factory. They want 3-5% of the population working in AI in the future.Real-world AI applicationsAI is already making a difference in several areas:*Manufacturing: Factories use AI to manage supply chains, reduce waste, and improve quality. This helps them compete globally. *Healthcare: AI tools help doctors diagnose faster and more accurately. Startups are building AI systems for medical imaging and patient care. *Agriculture: Farmers use AI to monitor crops, predict weather, and manage resources. This boosts yields and cuts costs. *Education: Schools are using AI to personalize learning. Universities are launching new AI courses and research programs. *E-commerce: Online shopping is booming. AI helps companies manage logistics, recommend products, and serve customers better.The semiconductor pushSemiconductors are a big deal. Vietnam wants to be a hub for chip manufacturing, and the industry is expected to be worth over $20 billion by the end of 2025. Companies from the US, Japan, and other countries are building factories here, for example, Amkor just opened a $1.6 billion plant in Bac Ninh. The US and Vietnam have signed agreements to develop the chip industry together.Training workers is a priority. Vietnam aims to train 50,000 semiconductor professionals by 2030. FPT corporation, one of Vietnam's largest technology companies, plans to train 10,000 of them. They have set up new university programs and are working with partners from India and the UK.E-commerce and digital growthVietnam's e-commerce market is now one of the top three in Southeast Asia. In 2024, online sales are expected to hit $16 billion. More people are shopping online, using smartphones, and paying digitally. Big platforms dominate, but smaller websites and social media shops are growing too.AI is helping e-commerce companies run smoother. It's used for everything from managing warehouses to chatting with customers. Experts think AI could add up to $130 billion to Vietnam's economy by 2040, mostly through better productivity and new products.Challenges to watchVietnam's growth story is impressive, but there are real challenges.*Infrastructure: Some rural areas still lack good internet and tech access. This makes it hard for everyone to benefit from new technology. *Skills Gap: There aren't enough trained workers in AI and advanced manufacturing. More training and education are needed. *Regulation: The government is working on better rules for investment and data privacy. But it takes time to get it right. *Origin Fraud: Some companies use Vietnam as a stopover to avoid tariffs, especially from China. This can cause trade problems. The government is trying to crack down on this. *Environmental Concerns: Not all investments are good. Projects that pollute or don't meet safety standards are being watched more closely.What's next for Vietnam?Vietnam is not just a place for cheap assembly anymore. It's becoming a center for high-tech manufacturing and AI. The government, local companies, and foreign investors are all pushing in the same direction. They want to build a strong, modern economy that can compete globally.The country is setting up an international financial center to attract more investment. They are also working to make the business environment more transparent and reliable. This should help build trust and bring in more long-term partners.What Vietnam's growth means for youVietnam's rise in manufacturing and AI is real. The country is attracting more investment, building new factories, and training more people. AI is moving from buzzword to reality, with real impact in factories, hospitals, farms, and schools. The semiconductor industry is growing fast, and e-commerce is booming.But there are still hurdles. Infrastructure, skills, and regulation need more work. The government and businesses know this and are taking steps to fix it.Fusion Worldwide has an office right here in Vietnam. That means we are on the ground, ready to help you source what you need, navigate local markets, and make decisions that support your long-term goals. When you work with us, you are gaining a partner who understands the landscape, speaks the language and is invested in your success.The opportunity isn't just to react to change, but to shape your future supply chain and technology strategy. With the right support, you can turn Vietnam's momentum into your own advantage, today and for the long run.Tony Leong, Fusion Worldwide Senior Director of Business Development, Asia

With the ongoing evolution of automotive electrification and intelligence, functional safety has expanded from advanced ADAS platforms to every electronic control unit (ECU) and module component in the vehicle. Traditionally, these lower-level modules (such as lamp controllers, HVAC modules, seat adjustment modules, etc.) have not emphasized functional safety design due to cost sensitivity and relatively lower application risks.However, as vehicle manufacturers (OEMs) increasingly focus on the integration risks of entire vehicle systems, and Tier 1 suppliers gradually include ISO 26262 compliance as a key evaluation criterion during bidding, ECU and module products are facing unprecedented pressure to upgrade. Many products that were not originally designed with functional safety in mind are now required to provide evidence of safety design in order to be integrated into the overall vehicle safety architecture.For small and medium-sized module suppliers, this is both a challenge and an opportunity. Those who can quickly implement functional safety without significantly increasing development costs and timelines will be the first to gain market recognition.ISO 26262 is an international standard for the functional safety of electrical and electronic systems in road vehicles. Its primary goal is to ensure that automotive electronic and software systems do not lead to unacceptable risks in the event of a malfunction.Market Competition Shifts from Hardware to Software and Verification SupportCurrently, there is a growing number of memory modules on the market that emphasize support for functional safety. Most solutions highlight their hardware design compliance with ASIL-B or ASIL-D requirements, including built-in error correction mechanisms (ECC), redundancy design, data backup, and power-off protection.However, truly effective solutions that help developers lower the verification threshold and quickly integrate into main systems are rare.In practice, even if the memory hardware itself meets ISO 26262 safety design requirements, the overall system cannot smoothly complete functional safety verification without corresponding software support and certification documentation. This is the pain point most module developers encounter when introducing safety memory:*Lack of directly integrable software components and APIs*Inability to provide Safety Requirements Documents (SRD) and software verification reports*Software does not comply with ISO 26262 Part 6 development process requirementsIn other words, in the battlefield of functional safety, hardware alone is not enough—comprehensive software integration and verification resources are also needed to truly solve the problem.Winbond W77Q / W77T Safety Solution: A Comprehensive, Compliant Secure Flash Memory SolutionTo address the above market needs, Winbond has launched the W77Q/T secure flash memory solution for automotive ECU and module applications, providing comprehensive support from hardware, software, to verification processes, helping customers quickly achieve ISO 26262 compliance.Differentiator 1: Software Package Certified to ISO 26262 Part 6We offer not just hardware, but a software package that has been fully validated through the functional safety development process. This software suite includes:*Secure memory access drivers (including ECC and redundancy mechanisms)*API interface documentation and sample code*Software Safety Requirements Specification (SSR), design documents (SDD), and test reports*Complete safety case documentationAll these materials are developed and validated according to ISO 26262-6 standards and can be directly referenced by system developers in their main system functional safety documentation. In practice, customers do not need to conduct their own functional safety analysis for the memory module; simply integrating our documentation and software supports the product verification process, greatly saving costs and time.Differentiator 2: Modular Hardware Design for New and Legacy SystemsTo address the characteristics of the module market, W77Q / W77T supports the following application features:*Drop-in replacement for existing modules: Can directly replace existing flash components without modifying the PCB or driver architecture, enabling seamless upgrades.*Support for scalable architectures: Modules can be selected for ASIL-C or ASIL-D levels, meeting different module application needs (e.g., power control vs. lighting control).*Automatic power-off backup and independent safety processing unit (Safety Island): Enhances the module's ability to maintain minimum safety functions in the event of unexpected situations.This dual support design for "legacy system upgrades + new system acceleration" is especially suitable for module suppliers undergoing functional safety transformation.One-Stop Compliance Support Opens New Channels for Module MarketsOverall, the W77Q/ W77T secure flash solution is not just a component, but a complete "functional safety compliance accelerator."Credit: CompanyFor module and ECU developers, such a solution not only reduces the burden on internal functional safety engineers but also enables rapid completion of customer-required functional safety reports, accelerating product adoption by OEMs. This truly achieves a transition from compliance to competitiveness.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP on TSMC's N5 process for integration with the TSMC SoIC-X technology. Targeted for AI, HPC, xPU, and networking applications, the IP achieves a breakthrough 36Gbps performance with Adaptive Voltage Scaling (AVS), delivering 2× better power efficiency at the required data rate. This solution offers an industry-leading bandwidth density of 1.5TB/s per mm of die edge. The chip was assembled using TSMC's advanced SoIC-X and CoWoS (Chip-on-Wafer-on-Substrate) packaging technologies.Earlier this year, GUC demonstrated UCIe-32G silicon on the TSMC N3P process at the TSMC 2025 North America Technology Symposium. In 2024, GUC also taped out its UCIe LP (Low Power) solution featuring AVS on the TSMC N5 process, aimed at meeting the growing bandwidth demands of multi-die integration in AI, HPC, and networking applications. Leveraging extensive experience in 3D interface IP and SoIC design, GUC developed a Face-Up version of UCIe LP IP, enabling robust die-to-die interconnect for the bottom die of SoIC-X configurations. Looking ahead, GUC is actively developing UCIe 64G IP, with plans to tape out by the end of 2025, addressing the ever-growing need for higher bandwidth in next-generation chiplet-based systems.To reduce PHY power consumption, all GUC UCIe LP IPs incorporate Adaptive Voltage Scaling (AVS), optimizing supply voltage and driving strength to improve power efficiency by up to 2x. A training algorithm dynamically selects minimal voltage and drive strength to meet eye margin criteria, ensuring reliable operation under varying voltage and temperature conditions. Additionally, the IP integrates proteanTecs' I/O signal quality monitors, allowing real-time performance monitoring without the need for re-training or data transfer interruption.For easy integration, GUC has developed bridges for AXI, CXS, and CHI buses utilizing the UCIe Streaming Protocol. These bridges are optimized for high traffic density, low latency, and low power, with efficient end-to-end flow control, facilitating a seamless transition from single-chip NoC architectures to chiplet-based systems. They support Dynamic Voltage and Frequency Scaling (DVFS), enabling on-the-fly changes in digital supply voltage and bus frequency while maintaining uninterrupted data flow."With industry-leading UCIe solutions now available on the TSMC N5 and N3P technologies, we are excited to introduce the brand new UCIe Face-Up IP for SoIC-X, supporting 36Gbps with twice the power efficiency," said Aditya Raina, CMO of GUC. "We've built a complete, silicon-proven 2.5D/3D chiplet IP portfolio across TSMC's 7nm, 5nm, and 3nm process technologies. Combined with our expertise in design, package integration, electrical and thermal simulation, DFT, and production testing, we deliver a comprehensive solution that accelerates development cycles and product ramp-up for AI, HPC, xPU, and networking customers.""Our mission is to provide the fastest and lowest-power 2.5D/3D chiplet interface IPs, enabling a smooth transition from monolithic SoCs to modular chiplet architectures," added Igor Elkanovich, CTO of GUC. "The convergence of 2.5D and 3D packaging, leveraging HBM3/4, UCIe, and GLink-3D interfaces, paves the way for highly modular processors that exceed traditional reticle limits."GUC UCIe LP Face-up IP HighlightsTo learn more about GUC's UCIe IP portfolio and TSMC's CoWoS and SoIC total solution, please contact GUC sales representative via email (https://www.guc-asic.com/en/contact)