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IN THE NEWS
Wednesday 25 December 2019
Samsung to source more HDI PCBs from Korea suppliers
Samsung Electronics reportedly will place more orders with its existing suppliers DAP and Korea Circuit, rather than their Taiwanese peers, after the withdrawal of its PCB supply...
Wednesday 25 December 2019
Intel to intro innovative thermal design for notebooks
At the upcoming CES 2020, Intel is planning to announce a new thermal module design that is able to enhance notebooks' heat dissipation by 25-30% with many brands also set to showcase...
Wednesday 25 December 2019
US may tighten ban on Huawei with mixed impacts on Taiwan IC designers
The US government is reportedly mulling adjusting regulations to tighten control on Huawei's access to US-originated technology, which may bring uncertainties to Taiwan-based IC design...
Wednesday 25 December 2019
Huawei reportedly to roll out 2nd-gen Mate X foldable phone in 2H20
Huawei reportedly plans to launch its next-generation Mate X foldable smartphone in the second half of 2020, seeking to maintain its leading position in the segment, according to...
Wednesday 25 December 2019
GlobalWafers sees order visibility improve
Silicon wafer manufacturer GlobalWafers has seen better-than-expected order visibility for the first quarter of 2020, particularly for 12-inch wafers, according to company chairperson...
Wednesday 25 December 2019
LCD heyday coming to an end
For the global LCD panel industry, the year 2019 has been mostly engulfed by oversupply due notably to rampant capacity ramps by Chinese makers. Oversupply coupled with the impacts...
Tuesday 24 December 2019
Highlights of the day: MediaTek embraces super-midrange smartphone concept
MediaTek introduced its super-midrange smartphone market concept in 2017, focusing on competitive midrange pricing for products with high-end specs. It has been adhering to the strategy,...
Tuesday 24 December 2019
Rigid-flex PCB makers to sustain robust shipments for AirPods 2 in 1H20
Taiwan PCB makers are expected to maintain strong shipments of rigid-flex boards at least throughout the first half of 2020 to meet robust demand for AirPods 2 and other TWS (true...
Tuesday 24 December 2019
China initiates new push to raise IC self-sufficiency
China has initiated a new round of efforts to accelerate the development of its homegrown chip industry, a move that is likely to create significant business opportunities for Taiwan-based...
Tuesday 24 December 2019
ASE, VisEra to enjoy robust demand for in-display fingerprint sensors
ASE Technology and VisEra Technologies are both being pinpointed as among the backend houses set to enjoy robust demand for optical in-display fingerprint sensors, according to industry...
Tuesday 24 December 2019
Goodix to be biggest client for TSMC 8-inch fab capacity
China-based fabless chipmaker Goodix has booked considerable 8-inch fab capacity at Taiwan Semiconductor Manufacturing Company (TSMC) for its optical in-display fingerprint sensor...
Tuesday 24 December 2019
China handset makers enhancing deployments in mobile SoCs
While Huawei has continued to ramp up self-sufficiency for mobile chips via its chip arm Hisilicon Technologies, other Chinese handset players including Xiaomi, Oppo and Vivo have...
Tuesday 24 December 2019
MediaTek to make aggressive 5G push in China
MediaTek is expected to embrace an ambitious strategy to grow its presence in the 5G smartphone SoC sector. It will focus its efforts on 5G chip solutions for the upper midrange smartphone...
Tuesday 24 December 2019
Record amount of IC capacity forecast to be added in 2021, says IC Insights
As much as 17.9 million wafers (200mm-equivalents) per year of new IC capacity could be added in 2020, followed by another 20.8 million wafers of new IC capacity in 2021, which would...
Monday 23 December 2019
Highlights of the day: Chinese chipmakers developing AI-based ASICs
Chinese IT firms have been stepping up efforts developing its own CPUs in line with the country's goal of replacing all foreign firms-made computers in use in government and military...