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    Samsung foundry partners with Anaflash to launch AI MCU, signaling turnaround
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    SK Telecom's new leadership double down on AI infrastructure as strategic focus
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    NEWS TAGGED PACKAGING
    Thursday 30 October 2025
    Singapore leverages advanced packaging to capture share of US$1 trillion chip market
    Terence Gan, Executive Director of Singapore's Institute of Microelectronics (IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling...
    Thursday 30 October 2025
    STATS ChipPAC targets 600mm panel-level packaging in roadmap for next-generation AI chips

    Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company's advanced packaging technology roadmap at the 2025 Advanced...

    Thursday 30 October 2025
    STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era
    IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge...
    Thursday 30 October 2025
    Commentary: China's JCET bets on AI to challenge global packaging giants
    Artificial intelligence (AI) is reshaping the global semiconductor supply chain and accelerating transformation in IC packaging and testing. As Qualcomm moves into the AI data center...
    Thursday 30 October 2025
    JCET unveils Singapore blueprint for next-gen semiconductor packaging
    Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the...
    Thursday 30 October 2025
    Glass substrates edge toward prime time in PCB and chip packaging sector

    As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of...

    Wednesday 29 October 2025
    Unified packaging standards seen as key to meeting AI and automotive demands
    Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence...
    Wednesday 29 October 2025
    Intel shifts assembly and testing to Vietnam, plans tech talent recruitment
    Intel is planning to relocate part of its assembly, packaging, and testing capacity to Vietnam as part of a global strategic adjustment aimed at optimizing its manufacturing layout...
    Wednesday 29 October 2025
    Commentary: Lessons from Arm China and Nexperia’s unraveling

    Over the past decade, China's tech sector has surged across chip design, foundry, and packaging. Yet beneath the slogan of "technological...

    Wednesday 29 October 2025
    Powertech secures full FOPLP bookings ahead of US$1B expansion
    Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's...
    Wednesday 29 October 2025
    Hanmi eyes AI chip packaging amid HBM market challenges
    Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...
    Wednesday 29 October 2025
    CPCA Show Plus 2025: China's PCB industry rallies around the AI boom
    The CPCA Show Plus 2025, one of Asia's largest printed circuit board (PCB) exhibitions, opened on October 28, 2025, in Shenzhen, drawing hundreds of global electronics manufacturers...
    Wednesday 29 October 2025
    Intel's 18A and advanced packaging boost Taiwanese IP design firms
    Intel, a leader in semiconductor integrated device manufacturing (IDM), is advancing its cutting-edge processes, such as 18A and 2.5D/3D advanced packaging. Taiwanese design service...
    Tuesday 28 October 2025
    Korean startup builds cardboard drones, deploys pollution trackers for combat and environmental monitoring
    At the Boom-Up Festival 2025, one of Korea's largest gatherings of startups and investors, WOW Future Tech CEO Munju Kim drew attention with an unconventional idea: building drones...
    Tuesday 28 October 2025
    Hon Precision ramps AI GPU and ASIC testing equipment with orders through 1H26
    Semiconductor IC testing equipment manufacturer Hon Precision has, in recent years, successfully entered high-power application markets such as AI, high-performance computing (HPC),...
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    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Thursday 30 October 2025
    Asian Power Devices Officially Launches New Vietnam Factory, Setting a New Global Production Milestone
    Thursday 30 October 2025
    BIWIN Mini SSD Named to TIME's 'Best Inventions of 2025'
    Thursday 23 October 2025
    Femtometrix Honored by the World's Leading Memory Manufacturer, for Pioneering Optical Process Control Technologies
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