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    Memory price hikes squeeze Samsung smartphone HDI supply
    Sep 7, 18:58
    Samsung foundry S5 shift to DRAM faces major hurdles
    Sep 7, 18:58
    China semiconductor equipment makers expand localization into advanced packaging
    Sep 7, 18:57
    South Korea confirms US request for expanded semiconductor investment
    Sep 7, 18:57
    NEWS TAGGED CAPACITY
    Tuesday 8 September 2026
    Nvidia reportedly shifts Rubin Ultra toward 8-high HBM as memory costs rise

    Nvidia is reportedly shifting its Rubin Ultra AI accelerator toward an eight-high high-bandwidth memory (HBM) configuration, down from...

    Tuesday 8 September 2026
    Samsung allocates more than half of 4nm foundry capacity to HBM4
    Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI...
    Tuesday 8 September 2026
    Tungsten hexafluoride supply chain alerts as Peric expands
    Explosive capacity expansions by memory giants across South Korea, the United States, and China are driving surging demand for tungsten hexafluoride (WF6), a specialty electronic gas...
    Tuesday 8 September 2026
    Taiwan panel capacity shifts push TV brands to stock up as LCD price declines slow
    The global LCD TV panel market is gradually moving toward supply-demand balance as activity recovers across the supply chain, with price declines expected to ease in September. The...
    Tuesday 8 September 2026
    Infineon COO leaves a US fab open, says GlobalFoundries and ESMC already cover it
    Infineon COO Alexander Gorski said the company is balancing in-house production, outsourcing, and global expansion as supply-chain resilience becomes a key customer requirement. In...
    Tuesday 8 September 2026
    Nvidia underwrites its own demand, and that may be harder to copy than its chips
    Venture capital firm a16z recently hosted investor Gavin Baker and a16z partner David George for a discussion on Nvidia's competitive position. Baker argued that CEO Jensen Huang has...
    Tuesday 8 September 2026
    BYD weighs US$1B car-carrier order to support surging EV exports
    BYD is extending its global expansion beyond factories and sales networks into ocean transport, building greater control over the car-carrier capacity needed to support rapidly rising...
    Monday 7 September 2026
    HBM4 squeezes DRAM supply as Samsung, SK Hynix inventories fall below 10 days
    Memory inventories at Samsung Electronics and SK Hynix have fallen below 10 days of supply as AI infrastructure spending drives simultaneous demand for HBM, server DRAM and enterprise...
    Monday 7 September 2026
    Exclusive: Infineon Dresden fab to hit full capacity in 2-3 years, COO says
    Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at SEMICON Taiwan 2026 that the company's new Dresden fab is ramping at twice the pace of prior expansions,...
    Monday 7 September 2026
    Exclusive: Infineon COO says chip shortage recovery will take longer
    Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at Semicon Taiwan 2026 that the current global chip shortage is unlike the one during Covid-19 and will...
    Monday 7 September 2026
    Phison snaps up low-cost China NAND inventory, AI revenue share set to top 40%
    Phison CEO K.S. Pua expects NAND Flash supply to remain tight into 2027 despite capacity expansion across major memory makers, arguing that forecasts of a rapid return to oversupply...
    Monday 7 September 2026
    India's TCS unit secures land in Hyderabad for planned 1GW AI data center campus
    HyperVault, a Tata Consultancy Services (TCS) subsidiary, has secured 264 acres in Hyderabad to build a large AI data center campus capable of reaching 1GW of capacity. The project...
    Monday 7 September 2026
    Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens
    AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion,...
    Monday 7 September 2026
    Wah Lee sees faster growth in 2027 as supply stays tight
    Wah Lee Industrial expects growth to accelerate in 2027 as advanced packaging capacity comes online and foundries continue building overseas fabs, while tight supplies of semiconductor...
    Monday 7 September 2026
    China's JCET seeks US$968M for AI-driven packaging expansion

    JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity...

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    GlobalExhibition
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    Sep 8, 08:00
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    Keywave Technology innovative radar sensors spark a smart sensing revolution
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