Concerns over an overheating AI market have resurfaced, fueled by delays in data center construction, power and permitting bottlenecks, and the potential deferral of hundreds of billions...
Surging demand for advanced packaging driven by artificial intelligence (AI) has turned chip-on-wafer-on-substrate (CoWoS) from an "interesting" technology into a headache, making...
King Yuan Electronics (KYEC) general manager Gauss Chang said the company's plan to establish a US testing facility in Texas remains on schedule despite concerns that a shift in control...
India's push to expand semiconductor assembly and packaging capacity risks outpacing the development of its chip testing infrastructure, potentially increasing costs and prolonging...
Recent earnings reports from Apple and Intel highlight growing supply-chain strain driven by soaring memory costs and massive AI infrastructure build-outs. DIGITIMES analyst...
Taiwanese power management IC (PMIC) supplier Global Mixed-mode Technology (GMT) sees a potential slowdown in cloud AI spending as an opportunity to ease wafer capacity constraints...
Japan's Nittobo (Nitto Boseki) plans to invest an additional JPY20 billion (approx. US$127 million) to expand production of T-Glass, a specialized low-coefficient-of-thermal-expansion...
India's electronics sector is drawing fresh investment in semiconductors, optical connectivity and manufacturing capacity, even as AI-driven component shortages threaten production,...
The US AI data center expansion is entering a critical phase, with electricity supply and local governance emerging as major constraints. Democrat Gina Hinojosa's victory in the 2026...
DIGITIMES observes that as large language models (LLMs) and agentic AI development become increasingly widespread, it is driving not only significant growth in data center CPU demand...
Democrats swept the US midterm elections, reshaping the global technology and industrial landscape. Their victories in key gubernatorial races, including in Texas and Georgia, have...
National Silicon Industry Group (NSIG) expects to complete its expansion to 1.2 million 300mm silicon wafers per month by the end of 2026, positioning the Chinese semiconductor materials...
Samsung Electronics plans to begin structural work at its P5 Fab 2 facility in Pyeongtaek, South Korea, in January 2027, accelerating its memory capacity expansion as chip shortages...
The US midterm election and referendum results show broad public opposition to building more data centers, raising the prospect of tougher local-government reviews for large-scale...
Revenue from conventional DDR and LPDDR memory grew faster than that from high-bandwidth memory (HBM) in the third quarter of 2026, as global DRAM revenue surged 369% year over year...
