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Tuesday 13 October 2026
Charts: ASE tops NT$200B revenue in 3Q26 on AI OSAT demand
ASE reported September revenue of NT$88.13 billion (US$2.7 billion), up 7.15% month-over-month and 45.52% year-over-year, marking a record high for the third consecutive month. Third-quarter...
Tuesday 13 October 2026
Taisic Materials expands SiC capacity for AI data centers, 8-inch markets
Taisic Materials, a Foxconn-backed company under Kenmec Group, operates 65 crystal-growth furnaces as it expands silicon carbide (SiC) ingot and substrate production for AI data centers,...
Tuesday 13 October 2026
Chenbro unveils AI rack-level solutions at 2026 OCP Summit

Chenbro, a leading professional server chassis manufacturer, announced today its participation in the OCP Global Summit 2026, taking place from October 13 to 15 in San...

Tuesday 13 October 2026
Samsung sends yield engineers to Texas ahead of 2nm production ramp
Samsung Electronics has begun dispatching advanced-process yield engineers from South Korea to its Taylor, Texas, foundry ahead of planned 2nm chip volume production in 2027, South...
Tuesday 13 October 2026
AI substrate material shortages ease, but advanced equipment emerges as expansion bottleneck
As the customer base for AI accelerators expands rapidly and consumes IC substrate capacity, advanced packaging remains a critical industry bottleneck. Consequently, supply chain attention...
Tuesday 13 October 2026
AI demand squeezes capacitor, resistor capacity as Taiwan suppliers eye price hikes
Rising capital expenditures by global cloud service providers (CSPs) are accelerating orders for AI computing infrastructure, boosting both the specifications and volumes of passive...
Tuesday 13 October 2026
Nvidia and Cisco unveil new optics design to help scale AI factories
Nvidia and Cisco have introduced a new pluggable optics form factor to expand AI infrastructure without sharply increasing power use or network complexity. For global cloud operators,...
Tuesday 13 October 2026
AI server tracker: Taiwan's CCL, PCB and IC substrate suppliers see widening growth gap despite AI boom

Taiwan's copper-clad laminate (CCL), printed circuit board (PCB) and IC substrate suppliers are seeing uneven returns from AI infrastructure spending...

Tuesday 13 October 2026
South Korea's YMT targets fivefold rise in glass-substrate plating capacity
South Korean electronic materials supplier YMT is accelerating its expansion into glass-substrate electroplating. The company plans to increase related capacity to roughly four times...
Tuesday 13 October 2026
Intel CEO warns AI hardware shortages could last up to 3 years
Intel CEO Lip-Bu Tan warned in Singapore that demand for AI infrastructure continues to outpace supply, with hardware shortages unlikely to ease significantly over the next 2–3...
Tuesday 13 October 2026
Wistron expands Taiwan capacity with NT$8 billion investment
Wistron announced plans to invest roughly NT$8 billion (approx. US$250.67 million) to expand its production capacity in Taiwan. On October 12, the board approved an additional capital...
Tuesday 13 October 2026
TSMC power plant funding talks still conceptual, says Taipower
Electricity demand from semiconductor manufacturing, memory production, advanced packaging, and server assembly is rising rapidly, fueling reports that Taiwan Power Company (Taipower)...
Tuesday 13 October 2026
HCLTech signs Anthropic premier partnership as both firms deepen India AI bets
HCLTech has signed a Global Premier Partnership with Anthropic, tying one of India's largest IT services companies more closely to an AI developer that has spent 2026 building out...
Tuesday 13 October 2026
Nanya Technology's LTAs cover up to 70% of capacity as Pingtung 3D IC plant targets 2H28 production
Nanya Technology reported record profits in the third quarter of 2026, with president Pei-Ing Lee saying long-term agreements (LTAs) now cover approximately 50–70% of the company's...
Tuesday 13 October 2026
Podcast highlights: Is Elon Musk using TSMC talks as leverage against Intel and Samsung?
Elon Musk's recent confirmation that his "TeraFab" initiative is in talks with Taiwan Semiconductor Manufacturing Co. (TSMC) signals that a project originally framed as a challenge...