SEMI has raised its forecast for global wafer fab equipment (WFE) sales in 2028 to US$220 billion, up from about US$200 billion projected in July, as stronger investment in advanced...
TSMC's reported delay in placing 2027 advanced packaging equipment orders has sparked market speculation that the company sees excess CoWoS capacity ahead. But equipment suppliers...
Anthropic has reportedly signed a cloud-computing contract worth US$35 billion with Lambda, an Nvidia-backed cloud provider, under which Nvidia itself holds the data center lease,...
China's leading DRAM maker CXMT has gone from years of accumulated losses to one of the most profitable companies on the mainland market, propelled by an extraordinary memory upcycle...
JCET Group is sharply increasing spending as demand for artificial intelligence strains advanced packaging capacity worldwide. The Chinese chip tester and assembler said the shift...
India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims...
Nidec Chaun-Choung Technology plans to establish a dedicated liquid-cooling team and deepen cooperation with major cloud service providers, citing rising thermal-management demand...
Kaimei Electronics, a Yageo Group company, said order visibility remains strong for the second half of 2026 as AI server demand continues to ramp and automotive and industrial-control...
Silergy said at a recent earnings call that most of its applications, excluding its computing product line, posted quarter-over-quarter growth of more than 20% in the second quarter...
U-Best Innovative Technology, a unit of Sun Yad Group, is accelerating development of fluorine-free coatings to capture replacement demand driven by EU and US state-level regulations...
Nvidia reported second-quarter revenue for fiscal year 2027 of US$96.22 billion, a 106% year-over-year increase, driven by a 117% surge in data center revenue to US$89 billion. With...
Unimicron, a major Taiwanese IC substrate maker, came under intense supply chain scrutiny last week after reports that prosecutors and investigators searched the company over a suspected...
Kingboard Laminates, a leading Chinese copper-clad laminate (CCL) maker, has issued another price increase notice as shortages of core materials such as fiberglass cloth and copper...
Samsung Electronics' first passport-style foldable, the Galaxy Z Fold8, is reportedly facing tight display driver IC (DDI) supply as demand exceeds expectations. Samsung has continued...
