Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon...

During its July 16 earnings conference, Taiwan Semiconductor Manufacturing Company (TSMC) offered an upbeat outlook on AI demand. Responding...

Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom...

China's AI industry is shifting from model scale to the infrastructure needed to train, deploy and commercialize AI, with supernodes, high-speed...

Power semiconductor makers say prices are still being adjusted as upstream raw material costs rise and AI-driven high-margin products...

TSMC Chairman C.C. Wei said on July 16 that if more competitors can offer advanced packaging solutions that meet customer needs, the...