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Friday 31 July 2026
AWS backlog reaches US$496 billion; Amazon to double power capacity by end-2027

Amazon disclosed a US$496 billion AWS backlog growing at triple-digit rates in the second quarter, and CEO Andy Jassy used the call...

Friday 31 July 2026
Amazon Leo nears 400 satellites, initial service to begin this year

Amazon's low-Earth-orbit (LEO) satellite network is approaching 400 satellites in orbit, enough to begin initial commercial internet...

Friday 31 July 2026
EU launches AI Gigafactories call to boost Europe's computing capacity
The EU has opened a tender to build up to seven AI Gigafactories, a move that could reshape access to advanced computing for companies, researchers, and governments worldwide. The...
Friday 31 July 2026
Amazon lifts 2026 capex to US$220 billion, pins the increase on memory prices

Amazon has raised its 2026 capital expenditure plan by roughly US$20 billion and attributed the increase to a single input cost: me...

Friday 31 July 2026
TSMC reportedly develops EMIB-like packaging to counter Intel

TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

Friday 31 July 2026
AI server boom reshapes MLCC pricing as capacity shifts upmarket

The rapid expansion of AI infrastructure is reshaping one of the semiconductor industry's most overlooked component markets. Soaring...

Friday 31 July 2026
CHPT raises 2026 capex to NT$500M

Test interface maker Chunghwa Precision Test Tech (CHPT) held an investors' conference on July 29, saying revenue growth in the second...

Friday 31 July 2026
Delta Electronics raises 2026 capex to NT$70B, sees AI-related sales topping 25% of total

Delta Electronics expects capital spending to rise to roughly NT$70 billion in 2026 from NT$46.1 billion in 2025, driven by growing...

Friday 31 July 2026
AI strains mature-node and packaging capacity, leaving chip designers with orders but no supply

AI demand is tightening semiconductor capacity beyond TSMC's advanced nodes, with mature-process foundries and backend packaging providers...

Friday 31 July 2026
German joint ventures in China fall below 50% utilization as imports weaken
German auto joint ventures in China slipped below 50% capacity utilization in 2025 as weaker imported-car demand and the rapid rise of local brands reshaped the market. Mobility Global...
Friday 31 July 2026
Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...
Friday 31 July 2026
Montage Announces Industry-First Trial Production of CXL 3.2 MXC

Montage Technology today announced the industry's first trial production of its CXL 3.2 Memory eXpander Controller (MXC) chip, designed to address escalating demands...

Friday 31 July 2026
US manufacturing push draws Taiwan suppliers; electronics investment up nearly 500%

TSMC chairman C.C. Wei has announced an additional US$100 billion investment for building capacity in the US, on top of the company's...

Friday 31 July 2026
AI server BBU demand triples battery-module capacity ahead of 800V HVDC rollout

Backup battery units are set to become standard equipment in AI servers using 800V high-voltage direct current architectures, according...

Friday 31 July 2026
Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines
Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site...