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Friday 13 February 2026
E-glass capacity cuts trigger production shifts for Taiwan CCL makers
The global AI data center boom is straining not only high-end computing chips but also adjacent industries such as memory and upstream glass fiber cloth, where significant capacity...
Friday 13 February 2026
Winbond's two-year sell-out signals memory cycle shift and US$1.35bn capex push

Winbond Electronics is entering a powerful demand cycle, with tight supply conditions across DRAM, NOR flash, and SLC NAND extending beyond...

Thursday 12 February 2026
Mistral to invest EUR1.2bn in Swedish AI data centres to expand European compute capacity
Mistral AI will invest EUR1.2 billion (US$1.43 billion) to build large-scale AI data centres in Sweden, marking its first infrastructure expansion outside France. The move positions...
Thursday 12 February 2026
Tower Semiconductor revamps strategy after Intel deal collapses
Intel's decision to walk away from its September 2023 agreement for Fab 11X in New Mexico has prompted Tower Semiconductor to revamp its manufacturing roadmap, scrap the facility from...
Thursday 12 February 2026
SMIC warns AI pull-forward is rewriting chip cycle, lifts mature-node pricing
The global foundry industry is undergoing a structural shift, and it is emerging first in mature process nodes once widely considered oversupplied. SMIC stated on February 11 that...
Thursday 12 February 2026
Global Mixed-Mode's DDR5 PMIC push signals tighter memory supply and margin focus
Global Mixed-Mode Technology said it is expanding its DDR5 power management IC (PMIC) portfolio and prioritizing production for high-bandwidth memory (HBM), while warning that rising...
Thursday 12 February 2026
China claims five places in 2025 global OSAT top 10
The latest global ranking of the top 10 outsourced semiconductor assembly and test (OSAT) providers points to a shift in competitive balance. In 2025, five Chinese companies entered...
Thursday 12 February 2026
Micron begins high-volume HBM4 shipments as supply stays tight and capex rises
Micron Technology has begun high-volume production and customer shipments of its next-generation HBM4 memory, ramping volumes earlier than expected amid tight industry supply, CFO...
Thursday 12 February 2026
Taiwan's renewable backup mandate fuels energy storage growth
Taiwan's government has mandated that renewable energy power sellers and generators must maintain "backup power capacity" to address the issue of intermittency and its impact on grid...
Thursday 12 February 2026
TSMC spillover lifts Xintec testing orders, 2026 growth in sight
Xintec, the packaging and testing subsidiary of TSMC, held an investor conference in which Chairman CH Chen said full-year 2025 revenue maintained modest growth, driven primarily by...
Wednesday 11 February 2026
Rapidus aims for 2nm ramp in FY2027 with fourfold capacity boost
Rapidus is expected to begin full-scale production in fiscal 2028. Mass production of 2nm-class chips is scheduled to commence in the second half of fiscal 2027, according to Kyoto...
Wednesday 11 February 2026
GPTC management shakeup raises concerns over TSMC, ASE, Micron orders
Grand Process Technology Corporation (GPTC), a key wet process equipment supplier in the supply chains of TSMC, ASE, and Micron, posted record consolidated revenue of NT$6.514 billion...
Wednesday 11 February 2026
TSMC supplier AblePrint sees January 2026 revenue jump 142% on AI chips packaging boom
Taiwan-based AblePrint Technology, a key supplier of advanced packaging defoaming equipment for major clients including TSMC, reported record-breaking performance despite earlier regulatory...
Wednesday 11 February 2026
Topoint plans second price hike in 1Q26 as tungsten price rises
Affected by the continued rise in tungsten carbide prices, PCB drill manufacturer Topoint Technology said that it plans to implement another price increase in the first quarter of...
Wednesday 11 February 2026
South Korean IC designers face year-long packaging delays
Surging demand for artificial intelligence servers and high-performance computing (HPC) has tightened capacity across the semiconductor supply chain. For many small South Korean communications...