News tagged capacity at DIGITIMES

NEWS TAGGED CAPACITY

Monday 24 August 2026

AI chip boom lifts South Korean semiconductor materials makers' profits in 2Q26

The AI semiconductor investment boom is increasingly spilling over into the materials supply chain. South Korea's major semiconductor materials suppliers broadly improved profitability...

Saturday 22 August 2026

America's launch boom runs into a capacity problem as White House targets 1,000 annual space launches

The US commercial space sector is entering a phase in which launching more rockets is no longer the only test of industrial scale. As flight cadence rises and multiple providers push...

Saturday 22 August 2026

Column: Lessons in supply chain resilience from China Huadian's power-compute coordination model

As AI develops rapidly, data centers are driving equally rapid growth in electricity demand. The stability of future energy supplies will directly determine whether AI computing capacity...

Friday 21 August 2026

Broadcom reportedly eyes up to US$100B debt financing to expand AI chip push

Broadcom is in talks with asset managers to raise more than US$60 billion in debt financing, with the potential package reaching as much as US$100 billion, as the chipmaker moves to...

Friday 21 August 2026

Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge

The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...

Friday 21 August 2026

JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

JCET Group reported record first-half revenue for 2026, with demand from artificial intelligence infrastructure and high-performance...

Friday 21 August 2026

Automation Taipei 2026: German suppliers target aerospace's hidden manufacturing bottlenecks

Aircraft and spacecraft may be judged by thrust, payload capacity, and range, but the German Industry Solutions Session held at Automation Taipei 2026 on August 20 suggested that some...

Friday 21 August 2026

SK Hynix weighs Japan memory fab in Miyagi, but says no investment is final

SK hynix is considering a large-scale memory semiconductor investment in Japan, with Miyagi Prefecture emerging as a potential site, although the company has stressed that no decision...

Friday 21 August 2026

Alibaba's 45% AI cloud jump masked by 75% capex surge and margin squeeze

Alibaba Group's June quarter is the clearest statement yet that the company now runs as an AI infrastructure business with an e-commerce cash engine attached, rather than the other...

Friday 21 August 2026

Nitto Denko to expand HDD baseboard capacity for AI data center demand

Nitto Denko said it will invest JPY28 billion (US$176.68 million) through fiscal 2028 to expand production of thin-film metal base boards for hard disk drives, raising capacity by...

Friday 21 August 2026

China silicon wafer maker NSIG nears 1.2 million monthly 300mm capacity after 90% shipment jump

National Silicon Industry Group (NSIG) reported a 36.51% rise in first-half 2026 revenue as shipments of 300mm semiconductor silicon wafers increased more than 90%, though continued...

Friday 21 August 2026

DIGITIMES's Colley Hwang warns Taiwan AI data center capacity lags South Korea

The inference economy has arrived, and Taiwan's tech industry must transition from the "knowledge economy" to the "inference economy,"...

Thursday 20 August 2026

Samsung gains foundry pricing power as 4nm capacity stays tight through 2027

Samsung Electronics is gaining pricing power in its foundry business as AI and high-bandwidth memory (HBM) demand tightens advanced-node...

Thursday 20 August 2026

Nvidia, TSMC, chip gear makers ride AI boom into high-margin club

Strong AI demand is driving a wave of high profitability across the semiconductor supply chain, with equipment and materials suppliers increasingly joining a "high-margin club." Trailing...

Thursday 20 August 2026

Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September

Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea,...

1/116 pages

BIZ FOCUS

Aug 20, 11:00

Corning-IRICO Trade Secret Case Enters New Phase

MOST-READ
7 DAYS NEWS

Full list