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Saturday 29 August 2026
Research Insight: Humanoid robots near mass production as suppliers face precision, ramp-up test
Research Insight: Humanoid robots near mass production as suppliers face precision and ramp-up test
Saturday 29 August 2026
Exclusive Interview: Turning scale into value — AUO chair's post-LCD ambition
Price wars. Capacity races. Years of losses steep enough to earn a lasting nickname.
Friday 28 August 2026
Apple's M6 marks a transitional step before wider 2nm adoption
Apple on August 25 unveiled the M6 and M5 Ultra chips without holding a launch event, with the M6 becoming the company's first processor built on TSMC's 2nm process and debuting in...
Friday 28 August 2026
China chip profits jump 18.5-fold on AI demand; advanced-node self-sufficiency seen at 66% by 2035
China's AI investment boom is translating into sharply higher semiconductor profits while accelerating a longer-term expansion of domestic advanced-node capacity, memory production...
Friday 28 August 2026
AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest...

Friday 28 August 2026
Hiroca Holdings 2Q26 loss narrows as China plant consolidation supports recovery
Automotive components manufacturer Hiroca Holdings stated on August 27 that although losses were still recorded in the second quarter of 2026 due to weak pull-ins from China's domestic...
Friday 28 August 2026
Long-term contracts tie up InP capacity due to data center optics demand
Compound semiconductor supply-chain players say China has recently eased some substrate export controls, but the upgrade of high-frequency transmission in AI data centers toward 200G...
Friday 28 August 2026
Exclusive: IC design faces wire bonding bottleneck in 2027
Surging AI chip demand continues to outstrip TSMC's advanced packaging capacity. At the same time, massive AI server shipments are driving up demand for CPUs, networking equipment,...
Friday 28 August 2026
YMTC builds China chip supply chain around Wuhan fabs with 'Wutong Tree' Plan
Competition in China's memory sector is extending beyond wafer capacity and process technology into semiconductor equipment, materials and components. YMTC is expanding its domestic...
Friday 28 August 2026
Lam Research breaks ground on Oregon lab expansion for AI chip development
Lam Research has begun work on a new Oregon research lab as part of a more than US$3 billion global investment aimed at speeding development of advanced AI chips. The expansion could...
Friday 28 August 2026
China reshapes helium supply chain as semiconductor demand rises, import risks persist
China is accelerating efforts to secure helium supplies as semiconductor manufacturing, commercial space launches, and medical imaging lift demand for a resource the country still...
Friday 28 August 2026
Regulators fast-track lithium battery M&As as China shifts from capacity expansion to consolidation
China's lithium battery industry is shifting from an era of aggressive capacity expansion toward consolidation, as regulators rapidly clear deals aimed at revitalizing existing assets...
Friday 28 August 2026
AI chip demand squeezes capacity, Data Image secures 1-year supply
As strong AI demand continues to soak up semiconductor capacity, some ICs and passive components are seeing shortages and longer lead times. Qisda's display maker Data Image has stepped...
Thursday 27 August 2026
Trump declares emergency over foreign grid equipment, likely eyeing Chinese power hardware
US President Donald Trump signed an executive order on August 26 declaring a national emergency over the security of America's electrical grid. It restricts the purchase, import, and...
Thursday 27 August 2026
Samsung signals zHBF push as memory race moves beyond HBM
Samsung Electronics is signaling a push into high bandwidth flash (HBF), extending its next-generation memory ambitions beyond HBM as rivals move to establish a new NAND-based memory...