Skymizer said it unveiled HTX301, a decode-first accelerator chip for on-premises AI inference, at COMPUTEX 2026, to shift large-model serving away from cloud GPU racks and onto single...
Ion Electronic Materials announced that its Tongluo plant in Miaoli has completed construction of Phase 1 and Phase 2 and is entering a mass-production stage for new products and a...
Generative AI is moving at a speed scaling past critical computation thresholds, initiating a shift from a "chip-centric to an interconnect-centric" architecture era. The physical...
Thinking Electronics' outlook points to broader implications for global supply chains, as rising demand for protection components, AI data-center equipment, and electric vehicles tightens...
WinWay Technologies, a major test interface provider, followed ASE Holdings in holding a groundbreaking ceremony for its new plant at the Renwu Industrial Park in southern Taiwan....
Formosa Plastics disclosed on May 28 that it would expand into semiconductor chemicals, green energy and healthcare, announcing plans to invest NT$292 billion (approx. US$9.2 billion)...
Winbond Chairman Arthur Chiao said market sentiment in the second half of 2026 would carry the strong momentum seen in the first half, with the overall market remaining in a supply...
SpaceX's IPO prospectus details an early-stage "Terafab" initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty,...
Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment...
Quanta said demand for artificial intelligence (AI) infrastructure would be very strong in 2026 as the company pushed deeper into servers and wearable devices, and that it was expanding...
Anthropic's post-money valuation has reached US$965 billion after its newest funding round, more than doubling its value since February 2026 and putting it past its rival ChatGPT as...
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect...
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging...
Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply...
