SK Hynix said customers are seeking more than twice the high-bandwidth memory (HBM) volume it can currently supply, as moves toward shorter memory stacks reflect supply shortages rather...
United Microelectronics (UMC) saw operating momentum strengthen in the third quarter of 2026, as demand for artificial intelligence (AI), high-performance computing (HPC), communications,...
Oracle has signed partnerships with Cerebras and other chipmakers to host their chips in its cloud infrastructure. The Cerebras deal gives the chipmaker a new large customer to anchor...
SK Hynix is reassessing how to finance the US manufacturing expansion of its NAND flash subsidiary Solidigm after shelving a potential initial public offering (IPO), as the South Korean...
SK Hynix is turning to high-bandwidth flash (HBF) to address growing memory bottlenecks in AI inference, as increasingly complex AI agents generate more data than can be economically...
Unimicron Technology is reshaping its global production footprint and steering resources toward Taiwan's higher-margin AI supply chain as surging AI and high-performance computing...
Anthropic recently disclosed details of its computing partnerships with Google, Amazon Web Services (AWS), Microsoft, Advanced Micro Devices (AMD), and other providers in its S-1 filing...
Seagate Technology told investors it is "still in the early days of a multi-year growth phase" for mass-capacity storage, with demand visibility "extending beyond 2030" and most of...
Seagate Technology's latest results show how stronger storage pricing and higher-capacity drives are lifting profitability as cloud customers plan further infrastructure investment...
Corning's third-quarter results show optical networking becoming a larger driver of the materials maker's business as AI infrastructure expands. Stronger sales and profitability support...
SK Hynix's third quarter suggests that, for now, the memory industry's familiar boom-and-bust pattern is giving way to something closer to a contracted, supply-constrained business...
Major package substrate makers, including Samsung Electro-Mechanics (Semco), are concentrating capital spending on large, high-layer-count ABF substrates, while capacity expansion...
AI is driving a steady upward revision in chip demand, but semiconductor equipment shortages are not the biggest obstacle to expanding AI chip production, according to industry sources...
South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers...
Google recently unveiled its flagship AI model, Gemini 4 Argon. The model consumed an unprecedented 25 trillion tokens within 72 hours of launch—three times the volume recorded...
