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Thursday 11 December 2025
Commentary: China's PCB edge survives G2 decoupling
As the US–China tech confrontation drags on, discussions consistently return to chips, semiconductors, rare earths, and tariffs. Despite accelerating supply-chain decoupling...
Thursday 11 December 2025
Oracle warns of rising depreciation strains as AI data-center buildout accelerates
Oracle's rapid expansion of AI data centers is intensifying concerns over depreciation and capital needs, prompting the company to outline new funding approaches and margin expectations...
Thursday 11 December 2025
Pentagon drone demand soars as Marines order Teledyne systems, Orqa ramps up production
Teledyne FLIR Defense won a US$42.5 million order for Rogue 1 loitering munitions from the US Marine Corps, while Croatian drone maker Orqa is expanding capacity to meet rising Pentagon...
Thursday 11 December 2025
Ta Liang PCB and advanced packaging orders surge, equipment lead times hit 6 months
PCB and semiconductor equipment manufacturer Ta Liang Technology reported a surge in orders as AI chip and AI server demand solidifies. Customers have been investing to expand capacity,...
Wednesday 10 December 2025
Scientech posts over NT$10B revenue in 11 months, order visibility extends to 2H26
Advanced packaging equipment and wafer reclaim solutions provider Scientech reported consolidated revenue of NT$958 million (US$30.77 million) in November 2025, up 9% sequentially...
Wednesday 10 December 2025
TSMC expands CoWoS capacity with Nvidia booking over half for 2026-27
Semiconductor equipment suppliers reveal that TSMC and non-TSMC players, including ASE, Amkor, and UMC, are accelerating the expansion of advanced packaging Chip on Wafer on Substrate...
Wednesday 10 December 2025
Taiwan and US race to buy 500,000 military drones, testing supply chain resilience

Taiwan and the US plan to procure nearly half a million military drones over the next two years, a rapid buildup that is driving manufacturers...

Tuesday 9 December 2025
Google and Microsoft prioritize speed over cost as CSPs scramble for memory
A major memory shortage is hitting the industry as the supply-demand gap widens. Some upstream memory manufacturers are prioritizing server shipments, while other companies have been...
Tuesday 9 December 2025
Samsung moves up Pyeongtaek Phase 4 timeline in aggressive HBM4 push
Samsung Electronics, fresh off completing sixth-generation HBM4 development, is reportedly accelerating DRAM capacity expansion in a renewed effort to reclaim leadership in AI memo...
Tuesday 9 December 2025
SK Hynix pivots to general-purpose DRAM with tenfold 1c capacity surge
Rumors have risen that SK Hynix is accelerating the expansion of its 10nm-class sixth-generation 1c DRAM capacity. Previously, to concentrate on producing high-bandwidth memory (HBM),...
Tuesday 9 December 2025
Taiwan drone giant pursues US$1 billion Pentagon drone contract
Thunder Tiger expects strong demand over the next two years as it prepares to compete for drone procurement programs in Taiwan and the US. General Manager Gene Su said the company...
Monday 8 December 2025
Yeong Guan boosts global wind presence with China surge and 2026 Thailand plant launch
Taiwan's major castings supplier Yeong Guan Energy Technology Group, a key producer of components for wind turbines, machine tools, and heavy industrial equipment, is deepening its...
Monday 8 December 2025
Geopolitics push AI chip packaging into Taiwan-US duopoly
Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip...
Monday 8 December 2025
VinFast to invest US$500 million to expand EV manufacturing and product lineup in India
VinFast plans to invest US$500 million in expanding its manufacturing operations in India, marking the second phase of its previously announced US$2 billion commitment to the count...
Monday 8 December 2025
Samsung shifts focus from HBM to DDR5 modules for higher profits
Samsung Electronics has shifted its internal strategy in response to intensified HBM market competition**,** reallocating capacity toward DDR5 RDIMM modules and freeing up around...