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Friday 17 July 2026
Ubiqconn raises North America output as June sales rebound
Ubiqconn Technology said its North America localization strategy was gaining traction in June 2026, with its US subsidiary contributing more revenue and becoming a larger base for...
Friday 17 July 2026
EU lags in critical raw materials as AI, EV and SDV demand rises
Europe's push for supply-chain security is lagging as AI, software-defined vehicles, and electric vehicles drive demand for critical minerals and local production. For readers worldwide,...
Friday 17 July 2026
China auto sales slump deepens as exports face rising trade scrutiny
China's passenger vehicle market posted its sharpest slowdown in years in the first half of 2026, with private passenger car sales falling 20% year on year, according to the China...
Friday 17 July 2026
AI-driven chip price increases put automakers on alert as shortages stay limited
Semiconductor suppliers have begun rolling out one to two rounds of price increases and tighter allocations in the first half of 2026 as demand from GenAI, geopolitical tensions and...
Friday 17 July 2026
Memory shortages deepen as suppliers turn to long-term contracts

Memory shortages are rippling through global electronics supply chains, as tightening supply in DRAM and NAND pushes manufacturers...

Friday 17 July 2026
SOFC gains traction in AI data centers, opening three paths for Taiwan suppliers
As AI ushers in an era in which computing capacity increasingly translates directly into power demand, energy has become the foundational layer of the "five-layer cake" framework outlined...
Friday 17 July 2026
US EV market steadies after federal tax credits expire as prices and charging remain hurdles
The US electric vehicle market showed signs of stabilizing in the second quarter of 2026 after federal clean-vehicle tax credits expired in September 2025, although sales remained...
Friday 17 July 2026
Memory suppliers push prices higher as Apple and automakers face tighter supply
Memory suppliers have regained pricing power as AI-driven stockpiling and advance capacity bookings tightened supply for consumer electronics and automotive customers. The shift has...
Thursday 16 July 2026
Taiwan OSATs expand non-China capacity with US and SEA push
As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China...
Thursday 16 July 2026
TSMC boosts US investment by US$100B as C.C. Wei outlines long-term capacity planning with customers

To address structural long-term growth in semiconductor demand, TSMC chairman C.C. Wei said the company works closely with customers...

Thursday 16 July 2026
Beyond AI: Resilient consumer demand widens semiconductor supply crunch
Reports of lengthening semiconductor lead times have become increasingly common in recent months, highlighting that the imbalance between chip supply and demand has not eased but is...
Thursday 16 July 2026
CXMT IPO raises fresh capital, but its own prospectus map shows distance still to close
The IPO prospectus filed by Changxin Memory Technologies (CXMT) ahead of its planned listing on Shanghai's STAR Market offers an unusually candid portrait of the global DRAM industry...
Thursday 16 July 2026
Commentary: Chip lead times extend as cloud AI squeezes capacity
Reports of longer chip lead times have been mounting. ADI has notified customers that, as recovering demand tightens supply, lead times for some analog chip products have stretched...
Thursday 16 July 2026
ASML's rumored move to raise lithography prices sets up rare clash with TSMC as AI hands toolmakers pricing power
An AI-fueled earnings beat has emboldened ASML to do something it rarely does: raise prices on the lithography machines that are essential to making advanced chips. That plan is now...
Thursday 16 July 2026
Exclusive: Advanced packaging outpaces front-end growth while NPO paves way for commercial CPO
Generative AI is accelerating demand for computing power, memory and data bandwidth, shifting semiconductor innovation beyond front-end processes toward advanced packaging, silicon...