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Monday 13 July 2026
KYEC approves US$1.4 billion US plant to expand chip testing capacity
King Yuan Electronics (KYEC) approved a US plant investment of up to US$1.4 billion, or about NT$44.9 billion, on July 10 as the US continued pushing to expand domestic chip manufacturing...
Monday 13 July 2026
Arm CEO: AI agents to drive CPU demand as infrastructure shifts beyond GPUs
GPUs have dominated AI infrastructure discussions over the past two years, powering everything from large language model (LLM) training and inference clusters to high-bandwidth memory...
Monday 13 July 2026
Western automakers tap defense manufacturing to absorb idle capacity as military spending surges
Global automakers are accelerating their expansion into defense manufacturing as geopolitical tensions fuel record military spending and persistent challenges in the automotive sector...
Monday 13 July 2026
Column: Steel industry shifts from capacity to performance

As infrastructure upgrades, rail decarbonization, and the reshaping of critical materials supply chains accelerate, the steel industry...

Sunday 12 July 2026
Column: Compute is no longer the AI bottleneck. Memory is — and suppliers know it
After the semiconductor index nearly doubled in the first half of 2026 before a sharp pullback, the central question is whether the industry's AI-driven growth cycle has already peaked...
Sunday 12 July 2026
InP supply crunch leaves South Korea exposed
Coherent has agreed to prepay AXT US$22.3 million under a three-year agreement for committed 6-inch indium phosphide substrate capacity, showing how buyers are moving to reserve future...
Friday 10 July 2026
China recovers Long March 10B booster in reusable rocket milestone
China marked a major step in rocket reusability on July 10, 2026, after successfully recovering the first-stage booster of its Long March 10B rocket following an orbital launch mis...
Friday 10 July 2026
SK Hynix breaks Alibaba's US listing record — but HBM customers will wait until 2028 for the capacity it funds
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging...
Friday 10 July 2026
ASE Holdings posts record 2Q26 revenue, bets US$40M on South Korea as AI packaging demand surges

ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and...

Friday 10 July 2026
Sigurd posts record second quarter revenue as Hsinchu plant starts ramping up
Sigurd said its revenue hit a record in the second quarter of 2026 and for the first half of the year, driven by stronger demand from overseas customers. June sales stayed at a high...
Friday 10 July 2026
Insight: TSMC's 2nm lead widens, Intel 14A slips beyond 2030, Samsung 4nm fills on HBM4 demand

Samsung Electronics' preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence...

Friday 10 July 2026
TSMC CoWoS output reportedly to reach at least 200K wafers in 2027

TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly...

Friday 10 July 2026
JCET sets US$1.4bn capex for AI packaging expansion as China orders stay strong
JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected...
Friday 10 July 2026
Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

Friday 10 July 2026
GlobalWafers-Micron deal pushes US semiconductor localization beyond chip fabs
GlobalWafers and Micron have signed a 10-year supply agreement, alongside US$500 million in strategic financial support, in a move that underscores how artificial intelligence (AI),...