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Monday 21 September 2026
Tower Semiconductor to make Japan its largest optical chip base

Tower Semiconductor plans to make Japan its largest manufacturing base for optical communications semiconductors after expanding silicon...

Monday 21 September 2026
TSMC builds Kaohsiung hub to speed advanced packaging tests
TSMC is building an advanced packaging validation hub in southern Taiwan as rapid chip-on-wafer-on-substrate (CoWoS) expansion puts pressure on equipment and materials suppliers to...
Monday 21 September 2026
Chinese image sensor maker GalaxyCore raises the stakes in high-end CIS
GalaxyCore Inc. plans to raise up to CNY4.2 billion (US$627 million) to expand 12-inch CMOS image sensor (CIS) capacity and develop 100MP and 200MP sensors, doubling down on higher-value...
Monday 21 September 2026
Samsung reportedly plans to double HBM4 output in 2027 as memory supply stays tight

Samsung Electronics is reportedly preparing to at least double production of its HBM4-family memory in 2027, accelerating a shift toward...

Monday 21 September 2026
ByteDance's China AI chip push hits substrate shortage

China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with...

Monday 21 September 2026
Acer founder says slowing AI development will be hard, amid call for AI slowdown

Acer founder Stan Shih stated that slowing artificial intelligence (AI) growth is not easy, as semiconductor capacity is still insufficient...

Monday 21 September 2026
DB HiTek gains pricing power as 8-inch supply tightens

South Korea's DB HiTek is gaining pricing power as tightening 8-inch foundry supply, high utilization, and stronger demand for power-management...

Monday 21 September 2026
AMAX expands liquid-cooled data center in push beyond hardware

Amax is expanding its self-built liquid-cooled data center as the company moves beyond hardware into infrastructure and engineering...

Monday 21 September 2026
DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...
Monday 21 September 2026
Tyntek optical communications MPD ramps quarterly, 2027 capacity triples
Tyntek is rapidly expanding into optical communications as AI data-center demand drives a surge in high-speed transmission needs, with shipments set to rise significantly from the...
Sunday 20 September 2026
AI capacity crunch drives up consumer tech costs, deepening China's deflation
Surging AI server demand is reshaping consumer electronics. Memory costs have risen sharply this year, prompting Huawei, Oppo, Xiaomi and Apple to raise prices on some smartphones...
Sunday 20 September 2026
Wiwynn brings cobots to L10 server assembly as AI rack testing drives factory redesign

Wiwynn is introducing collaborative robots (cobots) at its El Paso, Texas, facility and third plant in Mexico, alongside a central heat...

Saturday 19 September 2026
Power grids can't keep pace with AI data center boom in EU, US
According to supply chain players, most AI data center cost models used by analysts in both China and the West only count electricity consumption when estimating the cost of AI data...
Saturday 19 September 2026
Charts: Taiwan's memory makers are outgrowing TSMC by a factor of eight

Taiwan's chipmakers are having their best year in a decade, and the headline number belongs to TSMC. The more interesting one does n...

Saturday 19 September 2026
CXL adds memory capacity, but HBM retains its bandwidth edge

Growing memory requirements are increasing interest in Compute Express Link (CXL) as a way to add capacity beyond locally attached memory...