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Monday 20 July 2026
Moonshot reportedly eyes IPO after Kimi K3 success forces cap on new users
Moonshot AI's latest model launch is rapidly reshaping perceptions of China's artificial intelligence (AI) industry, with overwhelming demand forcing the company to suspend new consumer...
Monday 20 July 2026
Micron's 10-year deal with GlobalWafers signals tighter 12-inch supply

Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon...

Monday 20 July 2026
Huahsu expands capacity to tap AI and advanced packaging demand
Huahsu, a semiconductor materials supplier established in 1997 through a joint investment by Japan's Asahi Kasei and Wah Lee, has launched a new capacity expansion plan as demand for...
Monday 20 July 2026
Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms
South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that...
Sunday 19 July 2026
The AI investment race is building its own bust, BIS paper warns
The competitive race to dominate artificial intelligence is driving technology giants to over-build computing capacity by roughly half again more than is economically efficient —...
Saturday 18 July 2026
LG bets on India as its biggest AC base, as its third plant runs ahead of schedule
LG Electronics is on course to bring its third Indian plant online earlier than planned, a step that would make India the company's single largest air-conditioner production base and...
Saturday 18 July 2026
Commentary: Samsung, SK Hynix in Washington's crosshairs over memory fabs
On a recent podcast, DIGITIMES analyst Luke Lin reviewed two major updates in the chip industry: Intel's Ireland fab expansion and rising US scrutiny of Samsung Electronics and SK...
Friday 17 July 2026
TSMC's CoWoS capacity remains 'extremely tight' as OSAT partners ramp expansion

During its July 16 earnings conference, Taiwan Semiconductor Manufacturing Company (TSMC) offered an upbeat outlook on AI demand. Responding...

Friday 17 July 2026
Powertech and Broadcom expand AI ASIC push with US$400M Singapore FOPLP venture

Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom...

Friday 17 July 2026
TSMC limits mature-node expansion and eases pressure on PMIC suppliers
TSMC chairman C.C. Wei said at the company's July 16 earnings call that mature-node expansion will be limited, with future capacity additions focused mainly on overseas fabs in Japan...
Friday 17 July 2026
WAIC 2026 puts China's AI race on supernodes, domestic chips, and real-world deployment

China's AI industry is shifting from model scale to the infrastructure needed to train, deploy and commercialize AI, with supernodes, high-speed...

Friday 17 July 2026
TSMC says A14 process on track for 2028 volume production
TSMC said at its earnings call on July 16 that its A14 process technology is developing as planned, with risk production set for 2027 and volume production slated to begin in 2028.
Friday 17 July 2026
Power component prices keep rising as supply tightens

Power semiconductor makers say prices are still being adjusted as upstream raw material costs rise and AI-driven high-margin products...

Friday 17 July 2026
TSMC welcomes EMIB relief as MediaTek pressure eases

TSMC Chairman C.C. Wei said on July 16 that if more competitors can offer advanced packaging solutions that meet customer needs, the...

Friday 17 July 2026
Ubiqconn raises North America output as June sales rebound
Ubiqconn Technology said its North America localization strategy was gaining traction in June 2026, with its US subsidiary contributing more revenue and becoming a larger base for...