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Sunday 7 June 2026
Pegatron unit ASRock Rack wins order to supply 587 GPU servers for Thailand AI data center
ASRock Rack, a subsidiary of Pegatron Group's ASRock Inc., has won an order to supply 587 GPU servers equipped with Nvidia B200 accelerators to Japan-based AI infrastructure provider...
Sunday 7 June 2026
JCET opens 3D packaging plant to target AI power modules, CPO demand
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing,...
Sunday 7 June 2026
Aspeed sees 2027 demand surge as agentic AI tightens supply chain capacity
Aspeed chairman Chris Lin said on June 3 that rapid growth in agentic AI is boosting demand for AI and general-purpose servers, with the chip maker's main constraint now supply-chain...
Sunday 7 June 2026
Transcend says Samsung DDR4 supply secured through 2027 as memory prices rise

Transcend Information said revenue for April and May combined has already surpassed its first-quarter total, as tight memory supply and...

Sunday 7 June 2026
Japan injects JPY150B into Rapidus to push for 2nm production by 2027
Japan's Ministry of Economy, Trade and Industry announced on June 5, 2026, that the government completed an additional JPY150 billion (US$937.9 million) capital injection into Rapidus,...
Sunday 7 June 2026
Taiwan Mobile and GMI Cloud sign MOU to expand AI data center services into SEA and beyond
Taiwan Mobile announced at Computex 2026 that it signed a memorandum of understanding (MOU) with GMI Cloud to expand AI data center and high-end compute services across emerging markets...
Saturday 6 June 2026
Phison shifts to system AI solutions with 2027 memory crunch looming
Phison Electronics CEO K.S. Pua said the company is moving beyond its roots as an IC component supplier and repositioning itself as a system solutions provider, warning that AI-driven...
Friday 5 June 2026
Nexchip carves out BGBM assets to back Wuhu wafer project, refocuses on 12-inch foundry business
Nexchip Semiconductor plans to carve out its BGBM business by contributing specialised equipment assets to Anhui Ruijing Semiconductor, a newly established power device wafer-processing...
Friday 5 June 2026
AI demand strains PCB supply chains, lead times stretch past 20 weeks
Explosive demand for artificial intelligence is widening supply chain bottlenecks for global electronics makers, with shortages now reaching from advanced chips and packaging into...
Friday 5 June 2026
US targets China's PCB grip as AI and defense supply risks mount
As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed...
Friday 5 June 2026
GIS Holding pledges 100% green power across global sites by 2040
Touchscreen panel maker GIS Holding announced on World Environment Day, June 5, that it will join the RE100 initiative and aim to source 100% green power across its global operations...
Friday 5 June 2026
Marvell says SerDes and packaging are key hurdles in switch chip development
Marvell says the next gains in switch chip performance will depend on faster SerDes and better packaging — issues that affect network capacity, signal quality, and cost across...
Friday 5 June 2026
Commentary: Memory boom driven by DRAM now, but HBM will decide future
AI demand is fueling a broad semiconductor upswing and pushing the memory industry into what many see as a long-awaited super-cycle. Samsung Electronics and SK Hynix have both reported...
Friday 5 June 2026
TSMC says AI demand is straining entire supply chain, not just chipmakers
TSMC chairman C.C. Wei said on Wednesday that AI demand is rising so quickly that the whole supply chain is struggling to keep up, with bottlenecks spanning power, chip capacity, equipment,...
Thursday 4 June 2026
Samsung's rumored CIS production shift highlights industry debate over fab ownership
Samsung Electronics' decision to place a key image sensor production line under its System LSI division highlights a broader question facing the CMOS image sensor (CIS) industry: whether...