BT substrate demand has begun to rise, driven by growing demand for mobile phones and memory chips, while ABF substrate demand is expected to pick up in the second half of 2024, according...
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
South Korean Flexible Printed Circuit Board (FPCB) manufacturer Siflex is set to join Apple's supply chain. Along with BH, it will supply Samsung Display (SDC) with Rigid flexible...
In the midst of the global Low Earth Orbit (LEO) satellite fervour, Taiwan's PCB industry is emerging as a pivotal player, mirroring the supply chains seen in the mobile phone and...
Japan-based Toppan announced a plan to build a plant in Singapore for producing FC-BGA substrates used in chip packaging, with operations expected to begin by the end of 2026. If...
Compound semiconductor IDM Transcom has seen a strong pull-in of power amplifier orders for niche application markets, such as aerospace, defense, and satellites, boosting its overall...
South Korean and Taiwanese Copper Clad Laminate (CCL) suppliers are vying for AI server orders, which are growing in demand as AI continues to sweep the globe, according to industry...
In recent years, the major High-Density Interconnect (HDI) board manufacturer Compeq Manufacturing Co. has been actively deploying in the low Earth orbit (LEO) satellite sector. Demand...
Taiwan's major IC distributors, including WPG Holdings, WT Microelectronics, Supreme Electronics, and Edom Technology, anticipate several significant trends for 2024 in the semiconductor...