CONNECT WITH US
NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Thursday 21 May 2026
LG Innotek wins long-term substrate deals as Intel and cloud giants secure supply
LG Innotek has secured substrate supply terms with major technology customers that increasingly resemble long-term agreements used in the memory-chip sector, boosting the South Korean...
Thursday 21 May 2026
OSE targets AI server SMT growth as memory demand lifts outlook
Orient Semiconductor Electronics (OSE) said that strong memory market demand is lifting its outlook and expanding its role in the memory supply chain, while also strengthening its...
Thursday 21 May 2026
AI server demand tightens passive component supply, lifting Taiwanese suppliers' share
Demand for artificial intelligence servers and related power systems is pushing lead times higher for high-end multilayer ceramic capacitors, elongated electrolytic capacitors, and...
Thursday 21 May 2026
TSMC's COUPE push puts Samsung's silicon photonics ambitions under pressure
Samsung Electronics has launched silicon photonics foundry services and entered pilot production, signaling during its latest earnings call that optical communication modules will...
Wednesday 20 May 2026
ASML to deliver first High-NA chips within months despite cost concerns
ASML expects its first advanced semiconductors made using next-generation High-Numerical Aperture (High-NA) extreme ultraviolet (EUV) lithography equipment to ship within months.
Wednesday 20 May 2026
China's OSATs chase bigger role as AI chips strain packaging supply

China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging...

Tuesday 19 May 2026
AEM targets semiconductor and AI markets, begins sampling anti-warpage film and PTFE materials
Flexible copper clad laminate (FCCL) manufacturer Asia Electric Material (AEM) said that its long-term investment in new product development has begun to yield results, with the company's...
Tuesday 19 May 2026
TDK expands bonding equipment investment, launches first mass production of nanocomposite materials
Japanese electronic components manufacturer TDK will make its largest-ever capital investment in fiscal 2026, running from April 2026 to March 2027, to address surging demand related...
Tuesday 19 May 2026
Commentary: Sanctions reshaped China's foundry sector — just not in the way markets expected
China's foundry sector is charting a different course as the global semiconductor market remains focused on AI GPUs, the 2nm process node, and advanced packaging. Led by Semiconductor...
Monday 18 May 2026
Prosperity Dielectrics sees AI server power customers chasing MLCC supply
Prosperity Dielectrics' surge in demand for high-end MLCCs, driven by higher-wattage AI server power systems, is extending lead times and prompting major capacity and material investments,...
Monday 18 May 2026
Lianyou Metals rides tungsten, cobalt squeeze to record quarter

Lianyou Metals reported record first-quarter results in 2026, as tightening global supplies of tungsten and cobalt and stronger demand...

Monday 18 May 2026
Nan Ya PCB to ramp up capacity as AI chips drive demand for advanced substrates

Nan Ya PCB, one of Taiwan's leading IC substrate...

Sunday 17 May 2026
Galatek targets advanced packaging market, eyes Taiwan foundries
Singapore-based AI automation startup Galatek said it is tackling yield bottlenecks in micron-level packaging with AI-embedded equipment as demand for AI and high-performance computing...
Friday 15 May 2026
China keeps tight InP export controls despite Trump-Xi talks
As the US and China continue to clash over geopolitics and critical materials supply, industry sources say China's restrictions on indium phosphide (InP) substrates for optical communications...
Friday 15 May 2026
Memory maker Biwin reapplies for listing on Hong Kong Stock Exchange
Biwin Storage Technology recently resubmitted its listing application to the Hong Kong Stock Exchange again, with Huatai Financial Holdings acting as the sole sponsor. The Chinese...