News tagged IC manufacturing at DIGITIMES

NEWS TAGGED IC MANUFACTURING

Monday 8 December 2025

Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS

Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...

Monday 8 December 2025

Samsung reportedly gains momentum in foundry and memory with improved 4nm yields

Samsung Electronics is reportedly gaining momentum across its foundry and memory operations as higher yields on its 4nm process and a broad recovery in DRAM demand position the company...

Monday 8 December 2025

Geopolitics push AI chip packaging into Taiwan-US duopoly

Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip...

Monday 8 December 2025

TSMC expansion to drive record earnings for Taiwan engineering contractors through 2026

Taiwan's leading construction engineering contractors are on track to post record results in 2026 as TSMC accelerates advanced fab expansion...

Monday 8 December 2025

Weekly news roundup: TSMC veteran's Intel move sparks debate, Samsung reportedly secures TPU HBM4 nod

These are the most-read DIGITIMES Asia stories in the week of December 1 to December 7, 2025.

Monday 8 December 2025

Ritek revives growth by becoming an AI infrastructure dark horse

Ritek Group CEO Wang Ting-chang said the group has long invested in AI-linked fields such as power, semiconductor materials, and packaging...

Sunday 7 December 2025

South Korea bets on airport GSE to break 90% power chip import lock

South Korea is racing to slash its more than 90% dependence on imported power semiconductors. Industry leaders warn that this reliance threatens the country's competitiveness in electric...

Saturday 6 December 2025

Huawei patent reveals DUV method to replicate 2nm-class chipmaking without EUV

A newly released filing from China's National Intellectual Property Administration (CNIPA) shows Huawei submitted a patent in June 2022 outlining a method to achieve 2nm-class metal...

Saturday 6 December 2025

Fabship takes chip manufacturing into orbit as industry eyes Space-based fabs

As artificial intelligence (AI) accelerates the global semiconductor race—and as commercial space activity heats up—the idea...

Saturday 6 December 2025

Taiwan taps tech strengths to accelerate smart healthcare push

Taiwan's smart-healthcare sector is gaining momentum, powered by decades of accumulated expertise in electronics and information and...

Friday 5 December 2025

UMC expands US supply chain with 8-inch wafer MOU with Polar Semiconductor

UMC has finalized plans to invest in the US semiconductor manufacturing sector by signing a memorandum of understanding (MOU) with American foundry Polar Semiconductor on December...

Friday 5 December 2025

AMD's Lisa Su dismisses AI-bubble talk while it prepares taxed MI308 exports to China

At WIRED's Big Interview event in San Francisco, AMD CEO Lisa Su rejected claims that the technology sector is drifting into an AI bubble. Pressed on whether the industry...

Friday 5 December 2025

Commentary: Infineon-Innoscience GaN ruling delivers 'disputed victory' for both sides

The US International Trade Commission (ITC) has issued its initial determination in Infineon's Section 337 case against China-based GaN supplier Innoscience. In a telling move that...

Friday 5 December 2025

AI power boom exposes Western GaN dilemma as firms still route through China

TSMC's decision to exit the gallium nitride (GaN) foundry market has set off a major restructuring of the global power device supply chain toward China-independent models and sharpened...

Friday 5 December 2025

CHPT eyes double-digit growth in 2025 as Wei-kuo Hong becomes corporate representative

Testing interface manufacturer Chunghwa Precision Test Tech (CHPT) reported that due to seasonal factors at the end of the year, revenue for November 2025 declined both year over...

1/203 pages