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Monday 21 September 2026
Taiwan firms keen on investing in US manufacturing

A recent survey found that 36% of nearly 120 US manufacturers have already reshored or are actively reshoring production, while more than...

Monday 21 September 2026
South Korea-U.S. investment talks stall over commercial viability

South Korea and the US have hit an impasse in final-stage investment talks over commercial viability safeguards, with South Korean President...

Monday 21 September 2026
Kaohsiung's new industrial park targets advanced packaging suppliers for the post-Moore era
Baipu Industrial Park, located on the border of Kaohsiung's Gangshan and Ciaotou districts, broke ground on September 21 after receiving approval from Taiwan's Ministry of Economic...
Monday 21 September 2026
Samsung builds fab robot team, targets chip equipment maintenance

Samsung Electronics has formed a dedicated organization to develop and deploy robots in its semiconductor fabs, with equipment preventive...

Monday 21 September 2026
Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant

Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project...

Monday 21 September 2026
Physical AI opens a new growth window for FD-SOI as China builds domestic supply chain

AI's shift from data centers into cars, robots, wearables, and connected devices is widening the market for fully depleted silicon-on-insulator...

Monday 21 September 2026
Tower Semiconductor to make Japan its largest optical chip base

Tower Semiconductor plans to make Japan its largest manufacturing base for optical communications semiconductors after expanding silicon...

Monday 21 September 2026
TSMC builds Kaohsiung hub to speed advanced packaging tests
TSMC is building an advanced packaging validation hub in southern Taiwan as rapid chip-on-wafer-on-substrate (CoWoS) expansion puts pressure on equipment and materials suppliers to...
Monday 21 September 2026
Chinese image sensor maker GalaxyCore raises the stakes in high-end CIS
GalaxyCore Inc. plans to raise up to CNY4.2 billion (US$627 million) to expand 12-inch CMOS image sensor (CIS) capacity and develop 100MP and 200MP sensors, doubling down on higher-value...
Monday 21 September 2026
ByteDance's China AI chip push hits substrate shortage

China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with...

Monday 21 September 2026
Intel reportedly in talks with AUO on advanced packaging
Intel is reportedly in talks with AUO on Micro LED substrate-based advanced packaging for co-packaged optics (CPO) and high-density computing, as display makers look to turn large-area...
Monday 21 September 2026
Largan makes seventh land, factory purchase of 2026 in co-packaged optics push

Major Taiwanese optical lens maker Largan Precision announced on September 17 that it acquired around 7,468.43 square meters of land...

Monday 21 September 2026
DB HiTek gains pricing power as 8-inch supply tightens

South Korea's DB HiTek is gaining pricing power as tightening 8-inch foundry supply, high utilization, and stronger demand for power-management...

Monday 21 September 2026
IBM unit secures US$1 billion CHIPS Act award to expand quantum wafer manufacturing
Anderon LLC, an IBM company, has finalized a US$1 billion award under the US CHIPS and Science Act to expand quantum wafer manufacturing in Albany, New York. The move could help speed...
Monday 21 September 2026
Weekly news roundup: AI boom strains chips; Google's TPUs pay off, China eyes 3nm without EUV
This week's reports centered on intensifying competition and bottlenecks across the semiconductor and AI supply chains, from Sandisk's unusual engineering push in Korea and Google's...