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Monday 19 January 2026
Taiwan carves robotics niche as humanoids proliferate
"Physical AI"—the fusion of artificial intelligence with machines that move, sense, and act in the real world—emerged as a defining theme at CES 2026, where Chinese robotics...
Monday 19 January 2026
TSMC eyes rapid 2nm growth in 2026 through high capex and US-Taiwan expansion
TSMC posted record fourth quarter 2025 results driven by strong demand for its 3nm and 5nm process families, with a gross margin of 62.3%, surpassing prior guidance of 59-61%. The...
Monday 19 January 2026
Tesla accelerates AI chip development even with safety and software challenges
Tesla aims to shorten its in-house AI chip design cycle to one generation every nine months, targeting rivals Nvidia and AMD. However, industry analysts highlight automotive safety...
Monday 19 January 2026
Tariffs reshuffle global supply chains, but US manufacturing revival remains elusive
Geopolitics has become an unavoidable force shaping business decisions in 2026. Shifting tariff policies under President Donald Trump have pushed global supply chains away from pure...
Monday 19 January 2026
US-Taiwan trade pact clears path for tech supply chain hubs in America
The US and Taiwan have reached a trade breakthrough that lowers reciprocal tariffs to 15% and applies most-favored-nation treatment without stacking, creating new momentum for Taiwanese...
Monday 19 January 2026
China's Innosilicon launches LPDDR6 IP with commercial shipments
As AI smartphones and AI PCs surge, end devices demand unprecedented memory bandwidth. Recently, Chinese interface IP provider Innosilicon announced that its self-developed LPDDR6/5X...
Monday 19 January 2026
Weekly news roundup: memory shortages, packaging power, TSMC's global pivot
Below are the most-read DIGITIMES Asia stories of the week of January 12-18, 2026.
Monday 19 January 2026
OpenAI taps Cerebras for US$10 billion AI chip buildout
OpenAI said it would partner with the artificial intelligence chip maker Cerebras to build 750 megawatts of ultra-low-latency AI computing capacity, a project that will come online...
Monday 19 January 2026
Commentary: TSMC drives tariff talks as Taiwan eyes 40% chip capacity shift to US
After months of trade negotiations, Taiwan and the US have finalized a reciprocal tariff agreement that lowers rates to 15% without stacking most-favored-nation (MFN) tariffs. The...
Monday 19 January 2026
Commentary: US and Taiwan finalize tariff deal, securing favorable terms for semiconductor exports

The US and Taiwan have formally concluded a tariff agreement that sets a 15% rate on covered goods, alongside a sweeping package of Taiwanese...

Monday 19 January 2026
India roundup: Acer bets on growing PC penetration
Acer and Lenovo are optimistic about India's consumer electronics sector as the global market slows due to rising memory prices.
Monday 19 January 2026
Advantest ATE lead times remain tight as AI and memory markets expand
As demand strengthens in markets such as GPUs and high-bandwidth memory (HBM), Japan-based Advantest said orders for semiconductor automated test equipment (ATE) remain stable, with...
Monday 19 January 2026
Ardentec utilization rate rises through 2025 on chip testing demand from networking, automotive, and storage sectors
Semiconductor testing company Ardentec reported steady utilization growth through 2025, driven by strong chip-testing orders from the networking, automotive, and storage markets. The...
Saturday 17 January 2026
TSMC speeds up US expansion while keeping FX strategy simple
TSMC is speeding up its multibillion-dollar expansion in Arizona after posting strong earnings, signaling confidence in long-term artificial intelligence demand and the US push to...
Saturday 17 January 2026
NIAR launches chip-level advanced packaging platform to boost Taiwan's semiconductor edge
As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has...