Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...
AI-driven demand for optical transceiver modules is rising rapidly, and LuxNet said its business in the second half of 2026 will grow sharply from the first half. With capacity coming...
Five listed Chinese outsourced semiconductor assembly and test providers reported first-half 2026 results in the last two weeks of August, showing net profit growth of up to 317%,...
Wuhan Xinxin Semiconductor Manufacturing Company (XMC) has laid out a 10-year expansion strategy centered on 3D integration, silicon photonics (SiPh), and specialty processes, targeting...
Demand for AI and high-performance computing (HPC) continues to drive semiconductor process development, with advanced nodes and advanced packaging entering a new cycle of capacity...
Marvell said on its fiscal second-quarter of 2027 earnings call that customers are actively planning to deploy scale-up optical solutions as early as 2027, with demand for near-package...
TSMC is sharpening its silicon photonics (SiPh) roadmap to address the widening gap between AI compute growth and chip-to-chip data movement, unveiling two bandwidth-scaling paths...
Silicon photonics (SiPh) will become mainstream in 2027, with market share topping 50%, as AI scale-out drives explosive growth in optical transceiver demand, said K.C. Hsu, TSMC's...
Gudeng Precision Industrial chairman Bill Chiu said on August 31, 2026, that trust is the core foundation of Taiwan's place in the global supply chain, as he commented on sensitive...
On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...
Seven Chinese silicon wafer producers reported first-half 2026 results in the second half of August, indicating an uneven sector recovery. Several semiconductor-grade wafer makers...
Taisic Materials, a subsidiary of Kenmec Mechanical Engineering, has successfully produced Taiwan's first 12-inch silicon carbide (SiC) boule using a crystal growth furnace independently...
Semiconductor investment, AI chips, advanced packaging and data center infrastructure dominated the week, with South Korea facing US pressure, India scaling chip manufacturing, and...
Taiwanese investment projects announced or under implementation in France are worth about EUR7.5 billion (approx. US$8.7 billion), according to the French Office in Taipei, led by...
