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Saturday 30 May 2026
TSMC's test arm Xintec ramps wafer testing capacity for 2H26 growth
Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment...
Saturday 30 May 2026
Analysis: Who's who at the trillion-dollar feast— Jensen Huang's Taipei dinners map AI's supply chain
When Nvidia CEO Jensen Huang stepped off a plane in Taipei on Saturday, May 23, he had already begun documenting the trip on X — night markets, fried food, and family. By the...
Saturday 30 May 2026
'Hardware is sexy again': Plug and Play CEO says AI boom has finally fulfilled his 2006 semiconductor dream
The building where Saeed Amidi runs his global venture empire was once one of the most important semiconductor facilities on the West Coast. Philips Electronics operated a fabrication...
Friday 29 May 2026
Chinese power chipmaker China Resources Microelectronics targets AI servers with PLP packaging
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more...
Friday 29 May 2026
Intel's foundry comeback hinges on advanced packaging
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect...
Friday 29 May 2026
EU seeks to spur government buying of homegrown chips
The European Commission wants governments to buy chips from EU startups as Brussels seeks to reduce the bloc's reliance on US and East Asian suppliers, Reuters reported, citing...
Friday 29 May 2026
Morgan Stanley: Supply constraints to drive next phase of the AI boom
As the global buildout of artificial intelligence infrastructure accelerates, Taiwan's technology industry has emerged as one of the most closely watched hubs in the world. Ahead of...
Friday 29 May 2026
Nvidia CEO says Huawei's Tau Scaling Law not a threat to TSMC
Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence...
Thursday 28 May 2026
Nvidia CEO Jensen Huang hosts trillion-dollar dinner for Taiwan AI suppliers
Nvidia CEO Jensen Huang hosted another "trillion-dollar dinner" at Juan Yau Restaurant in Taipei, Taiwan, on May 28, with chairmen and presidents from multiple Taiwanese artificial...
Thursday 28 May 2026
ASE launches first automated PLP line, eyes 1H27 production
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence...
Thursday 28 May 2026
Amazon and Snowflake expand alliance amid agentic AI race
Snowflake, the cloud data company at the center of the artificial intelligence boom, said on Wednesday that it would spend US$6 billion over the next five years on Amazon Web Services...
Thursday 28 May 2026
Semiconductors and AI are pillars of Taiwan's global prosperity, says Taiwanese president
During the 2026 Europe Day Dinner, Taiwanese President Ching-te Lai referenced how coal and steel formed the foundation of peace in Europe, comparing that to how semiconductors and...
Thursday 28 May 2026
Nvidia's move into Beitou-Shilin Tech Park raises AI power demand; Taipower uses dual-track strategy to push substation development
Nvidia's new Taiwan headquarters is expected to begin construction by the end of 2026 and officially open in 2030, and CEO Jensen Huang is propagating that Taiwan "needs more electricity"...
Thursday 28 May 2026
Chunghwa Precision completes board reshuffle as it plans rapid capacity expansion for AI chip testing
Chunghwa Precision Test Tech. completed its board election at the 2026 annual shareholders' meeting on May 27 as the semiconductor test interface maker prepared for rising AI chip...
Thursday 28 May 2026
Samsung foundry targets robotics, auto AI chips with Cadence platform
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive...