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Tuesday 14 April 2026
Samsung Electro-Mechanics reportedly to expand AI packaging with MLCC embedded substrate line in Vietnam
As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics...
Tuesday 14 April 2026
Samsung 2nm yields reportedly remain below mass production threshold

Samsung Electronics is nearing a technical milestone for its 2nm process, but yields are reportedly still below the level required for...

Tuesday 14 April 2026
JCET CEO sees robotics extending automotive semiconductor growth

China's leading OSAT provider JCET has sustained steady growth in automotive electronics, driven by the rapid expansion of new energy...

Tuesday 14 April 2026
JCET advances CPO, glass substrates to capture AI packaging demand
JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres,...
Tuesday 14 April 2026
Samsung Foundry advances space semiconductor chip and technology development
As global companies unveil plans for space AI data centers, South Korean firms are prioritizing space-related technology as a new growth driver. Samsung Electronics' foundry division...
Tuesday 14 April 2026
King Yuan Electronics posts record 1Q26 revenue, raises capex to NT$50 billion
Benefiting from continued demand driven by artificial intelligence (AI), high-performance computing (HPC), and application-specific integrated circuits (ASIC), semiconductor testing...
Monday 13 April 2026
Global chip equipment sales reach record US$135 billion as AI drives investment surge

Worldwide semiconductor manufacturing equipment sales rose 15% to a record US$135.1 billion in 2025 from US$117.1 billion a year earlier,...

Monday 13 April 2026
Japan funds AI chip ecosystem around Rapidus

Japan is accelerating efforts to rebuild a domestic advanced semiconductor ecosystem, with Rapidus at the center of a state-backed push...

Monday 13 April 2026
Gudeng targets record 2026 revenue on EUV pod and FOUP demand surge
Taiwan's Gudeng Precision Industrial is set to sustain double-digit revenue growth in 2026, buoyed by robust demand for EUV reticle pods and FOUP wafer carriers as advanced-node production...
Monday 13 April 2026
Taiwan's AI revenue boom masks deeply divided industry: 1Q26 data analysis
The headline numbers for Taiwan's listed tech companies in the first quarter of 2026 are strong, but a sector-by-sector breakdown of 238 companies reveals a story far more nuanced...
Monday 13 April 2026
Taiwan's monthly exports top US$80 billion for first time, fueled by AI demand

Taiwan's exports rose to a record high in March, supported by demand for artificial intelligence (AI) and memory-related products, according...

Monday 13 April 2026
Taiwan DDI makers see 1Q26 revenue decline; small to mid-size demand remains weak
Taiwanese display driver IC (DDI) manufacturers have reported broadly declining revenues for the first quarter of 2026, reflecting ongoing challenges in the small- and mid-size segments...
Monday 13 April 2026
Global chip sales expect to top US$1 trillion in 2026 on AI demand

Taiwan's semiconductor supply chain posted stronger-than-expected results in the first quarter of 2026, as artificial intelligence (AI)...

Monday 13 April 2026
Silicon photonics scaling hits wafer testing bottleneck
AI demand is pushing data transmission to its limits, making 2026 a critical year for silicon photonics (SiPh) and co-packaged optics (CPO) to move into large-scale deployment. The...
Monday 13 April 2026
Weekly news roundup: Shortages spread to MLCCs; SK Hynix reportedly in talks with Microsoft and Google
Below are the most-read DIGITIMES Asia stories from the week of April 6-April 13, 2026: