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Friday 22 May 2026
AMD deepens Taiwan supply chain ties with US$10B-plus push
AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum...
Friday 22 May 2026
Intel's foundry reset: 14A, 10A and tougher engineering rules
Intel CEO Lip-Bu Tan is reshaping the chipmaker's engineering culture and foundry strategy, confirming that 14A remains on track while revealing that early development has begun on...
Friday 22 May 2026
Lam Research launches PLP Center of Excellence, replacing wafers with panels
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology...
Friday 22 May 2026
Innovation at the edge: Semiconductor startup highlights from Plug and Play Silicon Valley May Summit 2026
At the recent Plug and Play Silicon Valley May Summit, the semiconductor and supply chain sessions highlighted a critical shift toward hardware-level security, energy efficiency for...
Thursday 21 May 2026
AMD CEO meets with TSMC CEO in Taiwan as it expands US chip output
Advanced Micro Devices (AMD) CEO Lisa Su stated that the company plans to invest more than US$10 billion in Taiwan's industrial ecosystem to accelerate the development of artificial...
Thursday 21 May 2026
Commentary: Trump's Taiwan chip claim tests TSMC's silence
US President Donald Trump, after recently concluding a visit to China, again publicly accused Taiwan of having "stolen our chip industry." This was not the first time he had made such...
Thursday 21 May 2026
Nvidia's China hopes dim as Beijing doubles down on domestic AI chips
Nvidia's H200 was a major focus after the Trump-Xi meeting, but hopes for sales into China have faded after US President Donald Trump's latest remarks. Trump said Chinese President...
Thursday 21 May 2026
Five weak links India Semiconductor Mission 2.0 must fix
India's first semiconductor mission brought fabs, OSAT units, and chip projects into the policy pipeline. Its second phase is being shaped around a harder question: whether India can...
Thursday 21 May 2026
Demand surge for power semiconductors reshapes data-center power and cooling, pushing suppliers toward SiC and GaN
Demand for power components is surging as AI servers adopt high-voltage direct current power delivery and advanced cooling technologies. This shift could increase component density...
Thursday 21 May 2026
Texas Instruments sues former exec over trade secret theft at GlobalFoundries
Bloomberg reports that Texas Instruments (TI) has sued former vice president Kannan Soundarapandian, alleging he joined GlobalFoundries without fully disclosing his new employer...
Thursday 21 May 2026
Tokyo Electron Taiwan drops appeal after court fines unit and jails ex-engineer in TSMC trade secrets case
Tokyo Electron's Taiwan unit said on May 21 that it respected judicial proceedings and would not appeal following a ruling in a trade secrets case involving TSMC. The decision came...
Thursday 21 May 2026
Tokuyama to build second high-purity IPA plant in Taiwan to bolster global semiconductor supplies
In a press release on May 20, Japan-based Tokuyama Corporation said it will build a second high-purity isopropyl alcohol plant in Kaohsiung through its joint venture with Formosa Plastics,...
Thursday 21 May 2026
Tech Forum 2026: How much longer can semiconductors sustain Taiwan?
During a keynote discussion session at Tech Forum 2026, DIGITIMES senior reporter Monica Chen and semiconductor analyst Andrew Lu shared their views on current AI server technology...
Thursday 21 May 2026
TSMC's cautious capex is averting an AI bubble, says investor
TSMC's restrained expansion strategy is helping the global market avoid an AI bubble, according to veteran semiconductor investor Gavin Baker, the chief investment officer at Atreides...
Thursday 21 May 2026
US targets Hua Hong's 7nm nodes while China targets South Korean partners to evade sanctions

The US Department of Commerce (DOC) has reportedly issued "is-informed" letters to several major wafer fab equipment (WFE) manufacturers, ordering...