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Saturday 29 August 2026
Samsung bets on JWMT: can glass substrates flip the script for South Korea in advanced packaging?
As artificial intelligence (AI) chips continue to scale up in physical size, semiconductor competition is rapidly extending beyond front-end node scaling into advanced packaging. The...
Saturday 29 August 2026
Inside TSMC's 238-page sustainability report: nine things that matter more than they look
Buried in 238 pages of targets and inventories are the things nobody puts in a press release: a formal corporate policy on shoe soles, a fish that lives in a fab, a lizard evacuation...
Friday 28 August 2026
ASIC makers see CSP orders stay strong through 2028
The four major US cloud service providers (CSPs) have already rewritten their 2026 capital expenditure records, and ASIC vendors are increasingly confident that demand will remain...
Friday 28 August 2026
China chip profits jump 18.5-fold on AI demand; advanced-node self-sufficiency seen at 66% by 2035
China's AI investment boom is translating into sharply higher semiconductor profits while accelerating a longer-term expansion of domestic advanced-node capacity, memory production...
Friday 28 August 2026
AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest...

Friday 28 August 2026
Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...
Friday 28 August 2026
Long-term contracts tie up InP capacity due to data center optics demand
Compound semiconductor supply-chain players say China has recently eased some substrate export controls, but the upgrade of high-frequency transmission in AI data centers toward 200G...
Friday 28 August 2026
Analysis: Nvidia beats, Taiwan wins — and hyperscalers race to make AI pay
Nvidia reported revenue of US$96.221 billion in the second quarter of fiscal 2027, more than doubling from a year earlier and underscoring the global rush to build AI infrastructure...
Friday 28 August 2026
Exclusive: IC design faces wire bonding bottleneck in 2027
Surging AI chip demand continues to outstrip TSMC's advanced packaging capacity. At the same time, massive AI server shipments are driving up demand for CPUs, networking equipment,...
Friday 28 August 2026
Vanguard says Taoyuan fab fire did not disrupt production
Vanguard International Semiconductor said a fire broke out late on August 27 on the roof of its Wafer Fab 3 in Taoyuan City, Taiwan, but the incident caused no major impact on production...
Friday 28 August 2026
Lam Research breaks ground on Oregon lab expansion for AI chip development
Lam Research has begun work on a new Oregon research lab as part of a more than US$3 billion global investment aimed at speeding development of advanced AI chips. The expansion could...
Friday 28 August 2026
Renesas opens physical AI, robotics lab in Beijing
Renesas Electronics has opened a physical AI and robotics lab in Beijing, a move that could speed the development of safer, smarter machines for factories, logistics, and homes worldwide...
Friday 28 August 2026
IntelliEPI says Japan substrate outage hit 2Q26 revenue
IntelliEPI said on August 27 that revenue in the second quarter of 2026 was pressured after a Japanese substrate supplier shut down for nearly three weeks during the Golden Week holiday,...
Friday 28 August 2026
China reshapes helium supply chain as semiconductor demand rises, import risks persist
China is accelerating efforts to secure helium supplies as semiconductor manufacturing, commercial space launches, and medical imaging lift demand for a resource the country still...
Friday 28 August 2026
China's industrial reboot: AI, chips, robotics, 6G define next five years
China is setting out a five-year industrial strategy centred on artificial intelligence (AI), semiconductors, 6G, robotics and advanced manufacturing, seeking to strengthen the country's...