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Thursday 30 July 2026
ASE sees full-year LEAP revenue topping US$3.5 billion amid tight packaging capacity
ASE Technology Holding said growing demand for advanced packaging and testing, combined with stronger momentum in its electronics manufacturing services (EMS) business, has tightened...
Thursday 30 July 2026
South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...

Thursday 30 July 2026
China's DUV shock: the secretive Aishengna rattles ASML with US$1B state backing

China's immersion DUV lithography programme has brought a little-known state-backed company into focus. Shanghai Aishengna Electronic...

Thursday 30 July 2026
South Korean suppliers win HBM4 tester orders from SK Hynix
South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172...
Thursday 30 July 2026
GlobalFoundries lands US$300M CHIPS backing for AI silicon photonics

GlobalFoundries has signed a letter of intent with the US Department of Commerce for a potential US$300 million award to accelerate...

Thursday 30 July 2026
Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
China's 28nm DUV lithography programme has entered a new phase after Shanghai Aishengna Electronic Technology delivered its first five immersion deep ultraviolet lithography system...
Thursday 30 July 2026
Samsung foundry to double 2nm design wins in 2026 on Broadcom talks; claims profit turnaround 'possible in near term'

Samsung Electronics' foundry business expects its 2nm project wins to more than double year-on-year in 2026, and the company is in...

Thursday 30 July 2026
Ennoconn deepens Singapore push with SMF pact and AI forum

Ennoconn Technologies held its 2026 Semiconductor x AI Applications Forum at Google's Asia-Pacific headquarters in Singapore on July...

Thursday 30 July 2026
Italy, US to sign Pax Silica pact on AI, chip supply chains

Italy and the US are set to sign a cooperation agreement tied to the US-led Pax Silica initiative on July 31, as Rome expands efforts...

Thursday 30 July 2026
Lam Research raises outlook as AI-driven semiconductor demand fuels record revenue and margin expansion
On July 29, Lam Research reported record fiscal fourth-quarter results and issued stronger-than-expected guidance, signaling that rising demand for artificial intelligence is accelerating...
Thursday 30 July 2026
Samsung memory sales up 471% in 2Q26; foundry targets double-digit second-half growth

Samsung Electronics' Device Solutions (DS) division posted the most profitable quarter in its history in 2Q26, generating operating...

Thursday 30 July 2026
UMC, Intel advance 12nm process collab with no next-gen plans at this time
United Microelectronics (UMC) stated that its collaboration with Intel to develop a 12nm process is progressing smoothly. The process design kit (PDK) is expected to be completed by...
Thursday 30 July 2026
UMC posts NT$42.26B profit on non-operating investment gains in 2Q26
United Microelectronics (UMC) reported consolidated second-quarter 2026 revenue of NT$68.73 billion (approx. US$2.12 billion) during its earnings call on July 29. The figure is up...
Thursday 30 July 2026
Greatek sees sustained AI demand, plans Philippines packaging plant acquisition
Greatek's latest investment and capacity plans signal how AI-driven semiconductor demand is rippling beyond Taiwan, with implications for global device makers, automakers, and industrial...