News tagged IC manufacturing at DIGITIMES

NEWS TAGGED IC MANUFACTURING

Friday 10 April 2026

MAtek sees record March revenue as AI and silicon photonics boost testing demand

MAtek's March revenue surge has implications for global chipmakers and AI infrastructure providers: rising demand for advanced material and failure analysis testing linked to AI chip...

Friday 10 April 2026

GlobalWafers' 12-inch line to run full in 2Q26 as wafer utilization rises

GlobalWafers reported March and first-quarter 2026 revenue that underscores transient operational disruptions with global implications: March consolidated revenue reached NT$5.45 billion...

Friday 10 April 2026

Taiwan accelerates SiPh and materials breakthroughs for next-gen AI computing

Taiwan is stepping up its global semiconductor leadership with a coordinated push into silicon photonics (SiPh) and advanced materials, aiming to meet surging demand for faster, more...

Friday 10 April 2026

Merck's material and equipment push could speed CPO and advanced packaging adoption

Merck presented integrated materials and inspection tools at Touch Taiwan 2026 as the panel industry pivots toward chip-on-panel (CPO) and advanced packaging. The company emphasized...

Friday 10 April 2026

MPI posts record 1Q26 revenue, invests NT$2B in Hsinchu plant expansion

Semiconductor test interface leader MPI reported a new quarterly revenue high in the first quarter of 2026, driven by strong demand for AI-related chip testing and signaling sustained...

Friday 10 April 2026

China's export controls spark 140x yttrium price surge, fueling chip equipment fears

Yttrium, a critical rare earth element used in semiconductor manufacturing equipment, has seen its global supply tighten sharply due to China's export restrictions, driving prices...

Friday 10 April 2026

TSMC smashes records with massive 45% revenue surge in March

Tech giant TSMC has released a blockbuster revenue report for March 2026, signaling an extraordinary acceleration in the semiconductor sector.

Friday 10 April 2026

China OSATs step up investment drive as AI demand lifts advanced packaging race

China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading...

Friday 10 April 2026

MetaOptics bets on Taiwan to scale metalens for AI, next-gen optics

MetaOptics, a Singapore-based metalens developer, is partnering with Taiwan's Pin-Jye Nano Technologies to scale production of next-generation optical components as the technology...

Friday 10 April 2026

Spingence and Advantech accelerate AI edge deployment plans in South Korea manufacturing

In response to strong demand for data security and on-premises AI deployment within South Korea's manufacturing and semiconductor sectors, Taiwanese AI company Spingence Technology...

Friday 10 April 2026

Exclusive: SpaceX delays FOPLP, PCB yield as execs plan April Taiwan visit

Elon Musk's SpaceX is facing production challenges at its newly built fan-out panel-level packaging (FOPLP) and printed circuit board (PCB) factories in Texas, delaying full-scale...

Friday 10 April 2026

Column: Corintis uses algorithms to target chip hotspots for precise cooling

As HPC and AI processors push computing performance to unprecedented levels, transistor density has reached a point where thermal behavior is no longer uniform. Instead of gradual,...

Friday 10 April 2026

Intel–Google alliance reframes AI infrastructure around CPUs

A newly expanded collaboration between Intel and Google signals a key shift in AI infrastructure: CPUs are back at the center of the conversation. Both companies emphasized that the...

Friday 10 April 2026

MediaTek builds an end-to-end challenge to Qualcomm and Broadcom

In recent years, MediaTek has steadily increased its influence in the global Wi-Fi chip market. Its market share gains have been driven not only by continued growth on the consumer...

Friday 10 April 2026

CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR

Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According...

1/218 pages

BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

MOST-READ
7 DAYS NEWS

Full list

RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook