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Friday 6 February 2026
The Kumamoto master plan: behind TSMC's strategic leap to 3nm supremacy
TSMC is doubling down on Japan. By upgrading its second Kumamoto facility to 3-nanometer production, the chipmaking giant has turned what was once a secondary supply-chain hedge into...
Friday 6 February 2026
Commentary: Why TSMC is upgrading Japan's Kumamoto fab from 6nm to 3nm
TSMC has made a significant change in its process plan for the Kumamoto second fab, confirming an upgrade from the initially planned 6/7nm node to 3nm. This facility will become Japan's...
Friday 6 February 2026
ASE expects advanced packaging and testing revenue to double in 2026
OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting from the short supply of advanced packaging and testing capacity...
Friday 6 February 2026
Rapidus draws US$1b in private capital to revive Japan's leading-edge chip ambitions
Japanese semiconductor startup Rapidus has secured more than JPY160 billion (US$1.02 billion) in private funding for fiscal 2025, surpassing its initial JPY130 billion target, according...
Friday 6 February 2026
Infineon announces price hikes up to 25%; Taiwanese power semiconductor makers plan to follow in 2Q26
Given frequent price increases across precious metals, wafer foundry services, and packaging and testing, Infineon's announcement of price increases is very telling for the market...
Friday 6 February 2026
CSPs turn to custom silicon to break Nvidia dependence
The global boom in generative artificial intelligence is driving an insatiable demand for computing power. This is pushing the world's largest cloud service providers to rethink a...
Friday 6 February 2026
PSMC narrows losses as DRAM prices and AI demand boost revenue
Powerchip Semiconductor Manufacturing Corporation, one of Taiwan's smaller but strategically positioned chipmakers, reported a sharp narrowing of losses in the fourth quarter of 2025,...
Friday 6 February 2026
ASE Technology posts 3-year profit high on strong advanced packaging orders in 4Q25
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding held its earnings call, revealing that robust demand for advanced semiconductor packaging services...
Friday 6 February 2026
CHPT sees AI, AP drive load board shipments with January revenue up
Chunghwa Precision Test Tech (CHPT) reported year-over-year and month-over-month revenue growth in January. The surge was mainly driven by strong demand for AI, application processor...
Thursday 5 February 2026
Samsung strengthens semiconductor supply chain cybersecurity to prevent tech leaks
As global competition in the semiconductor industry intensifies, the focus is no longer limited to technology and production capacity. Protection of data, intellectual property, and...
Thursday 5 February 2026
Renesas posts first annual loss in six years as 1Q26 margin rebounds to 32%
Renesas Electronics forecast a sharp improvement in profitability for the January to March quarter as growth in data center and other industrial infrastructure demand offsets weakness...
Thursday 5 February 2026
The 3nm surprise: TSMC's C.C. Wei pulls PM Takaichi's own book from his pocket to seal US$17B deal
In a moment that blurred the lines between corporate diplomacy and fan-like devotion, TSMC CEO C.C. Wei turned a high-stakes semiconductor summit into a personal tribute on February...
Thursday 5 February 2026
Asia Photonics Expo 2026 opens in Singapore, spotlighting photonics-semiconductor ties
The third edition of the Asia Photonics Expo (APE) opened on February 4, 2026, at the Sands Expo and Convention Centre, bringing together the global photonics and semiconductor ecosystem...
Thursday 5 February 2026
Commentary: How TSMC's C.C. Wei solidifies global alliances from Washington to Tokyo
In the high-stakes theater of global chipmaking, TSMC Chairman C.C. Wei has mastered a rare skill: the art of the well-timed strategic masterstroke.
Thursday 5 February 2026
Skytech delivers self-made PLP equipment, eyes record 2026 growth
As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation...