中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    SMIC plans to single out AI chip revenue as demand outpaces its current reporting categories
    6min ago
    Alibaba Cloud pushes modular data centers in Wulanchabu
    Aug 13, 18:37
    Eternal Precision Mechanics accelerates advanced packaging push with wafer lamination
    Aug 13, 18:37
    Alibaba Cloud’s five super data centers shift into AI compute battlefields
    Aug 13, 18:37
    NEWS TAGGED IC MANUFACTURING
    Friday 14 August 2026
    Applied Materials sets 2028 capacity target as it commits new manufacturing hires
    Applied Materials used its fiscal third-quarter earnings call to lay out a multi-year capacity build rather than just a strong quarter. Alongside record results, the company said it...
    Friday 14 August 2026
    Hua Hong's fabs were already full — price is what finally made them profitable
    Hua Hong Grace Semiconductor has been running its fabs flat out for more than a year without earning an operating profit on the work. The June quarter ended that. Revenue reached a...
    Friday 14 August 2026
    SMIC's pricing power arrives as AI pushes mature-node work into China
    China's largest contract chipmaker has spent most of the past two years increasing volume without much to show for it in terms of margins. The June quarter broke that pattern. Semiconductor...
    Friday 14 August 2026
    Musk hints at FEL light source for Terafab; ASML eyes FEL-EUV push
    After EVs, rockets, and humanoid robots, Elon Musk appears to be turning his attention to optimizing the chip manufacturing process. When he unveiled a US$16.8 billion initial investment...
    Friday 14 August 2026
    Samsung chip design embraces AI, but loss of control and hallucinations remain a problem
    The AI wave is sweeping through the chip industry, but hallucinations, loss of control, and cybersecurity risks remain unresolved even as efficiency leaps. Youngsik Kim, head of the...
    Friday 14 August 2026
    Cerebras raises 2026 outlook as hardware sales weaken
    AI chip startup Cerebras Systems raised its full-year 2026 core revenue and gross margin outlook after reporting second-quarter results, but the company also disclosed declining hardware...
    Friday 14 August 2026
    SK Hynix advances Yongin fab construction for 2027 cleanroom launch
    SK hynix has pushed construction of its semiconductor campus in Yongin, Gyeonggi Province, South Korea, to 87% completion as it targets February 2027 for the start of operations at...
    Friday 14 August 2026
    Rapidus targets 8-reticle interposers by 2030
    Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
    Friday 14 August 2026
    Samsung and SK hynix push AI deeper into fabs as semiconductor manufacturing enters autonomous era
    As the world enters an AI-powered era where the persistent need for more complex architectures is driven by rising demands for higher computing performance, one bottleneck confronting...
    Friday 14 August 2026
    ABF substrate boom lifts Eternal Precision prices 20%

    Strong Ajinomoto Build-Up Film (ABF) substrate demand has driven a surge in orders for vacuum laminating equipment, with Eternal Precision...

    Friday 14 August 2026
    Beyond silicon and copper: OCP APAC looks under the hood of future AI infrastructure
    AI's appetite for compute is growing at such speeds that simply building bigger versions of today's data centers may no longer cut it.
    Friday 14 August 2026
    Korea's CNT pellicle race heats up as aweXome Ray pushes toward EUV commercialization
    As South Korea's major memory manufacturers race to secure next-generation lithography technologies for increasingly advanced process nodes, the approaching High-NA EUV era is adding...
    Friday 14 August 2026
    Grand Process's Challentech partners with Japan's Seiki for bonding tech

    Artificial intelligence (AI) and high-performance computing (HPC) continue to drive demand for advanced packaging, where bonding technology...

    Thursday 13 August 2026
    Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

    The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

    Thursday 13 August 2026
    Samsung delays High-NA EUV adoption until 1nm production in 2030
    Samsung Electronics plans to introduce high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography into mass production at its 1nm node around 2030, according to South Korean...
    1/241 pages
    Research_DB
    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
    reportAIglasses