India's semiconductor companies have raised nearly half of their all-time equity funding since the start of 2025, and deal activity this year is already at a multi-year high. The figures...
Taiwan's ASIC design-service suppliers all posted year-over-year revenue growth in August 2026, but the underlying figures point to sharply different stages of the custom-silicon c...
Taiwan's semiconductor testing supply chain continued to ride strong AI and high-performance computing (HPC) demand in August 2026, with all four major suppliers posting year-over-year...
The exhibitor list for Semicon India 2026 suggests the country's semiconductor push has moved past announcements and into procurement. The show has drawn 535 exhibiting companies,...
AI demand remained the dominant force across semiconductors, memory, foundry and data-center infrastructure this week. Intel raised CPU prices while Qualcomm and MediaTek targeted...
India is accelerating its semiconductor and electronics ambitions, courting Taiwan, easing China restrictions, expanding local manufacturing and chip infrastructure, while global technology...
Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...
ASE announced at a news briefing on September 11, 2026, that ASE's board had approved the purchase of equipment, including automated optical inspection (AOI) and automated visual inspection...
Ahead of Chinese President Xi Jinping's expected visit to the US on September 24, US President Donald Trump has again discussed the issue of bringing chip manufacturing back to the...
German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what...
Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and...
