Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at SEMICON Taiwan...
Speaking at the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) Global Summit on September 1, Jun He, TSMC Vice President of Advanced Packaging Technology and Service, noted that...
The EU is pressing ahead with the European Chips Act and discussing a second phase, but TSMC says public money alone will not secure a durable semiconductor base. The company argues...
Chinese foundry Hua Hong Grace Semiconductor (HHGrace) is preparing another major expansion of its 12-inch wafer capacity, reinforcing its specialty-process footprint after a sharp...
Taiwan built the last computing era by manufacturing other people's designs. Ching-Ray Chang wants it to try the same trick with quantum computing, and he is arguing the window is...
AI is reshaping demand well beyond chips, and GlobalWafers chair Doris Hsu said this shift is lifting the strategic importance of silicon wafers across the semiconductor supply chain...
Taiwan's semiconductor materials suppliers are seeking gains from square packaging and co-packaged optics as advanced manufacturing evolves. The changes could help local firms move...
The European semiconductor push is moving beyond factory construction toward demand, design support, and talent building, according to TSMC. For global readers, the shift matters because...
SEMICON Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...
As interconnect traffic in AI hyperscale data centers climbs, optical modules are moving toward the 1.6T and 3.2T generations. United Microelectronics Corporation (UMC), Taiwan's second-largest...
Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...
Industry players say Taiwan's push to localize semiconductor materials did not begin in 2026. The real turning point came in 2019, when the Japan-South Korea semiconductor trade dispute...
Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...
On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on...
As quantum commercialization gathers pace worldwide, Taiwan is linking up with multiple countries to push for an Asia hub for quantum technology, industrial applications, international...
