The European Commission has given the green light to a EUR76 million (approx. US$86.3 million) German subsidy supporting QuantumDiamonds' plan to build a new semiconductor testing...
Hua Hong Grace Semiconductor (HHGrace) is seeing gains from both process technology and capacity expansion, with industry research showing its 40nm ultra-low-power specialty process...
Sigurd is expanding testing and packaging capacity as AI demand and steady customer orders keep its facilities fully utilized. For global readers, the move underscores how supply chains...
ASE Holdings COO Dr Tien Wu said the global semiconductor industry is growing faster than expected on the back of AI investment, with demand so strong that the capacity the company...
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape,...
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening...
As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics'...
ByteDance's reported plan to purchase at least 50,000 AI inference chips from Shanghai-based GPU developer Iluvatar CoreX could become one of the most significant commercial wins yet...
IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan,...
Techzone Technology Materials, a provider of one of Taiwan's few integrated waste treatment, renewable energy, and recycling solutions, is actively addressing the waste treatment demand...
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
Qualcomm's reported talks to provide custom chip-design services to TikTok owner ByteDance show how China's AI chip supply chain is moving beyond a simple Nvidia replacement story.
IBM is building a foundry to produce silicon wafers used in quantum-computing processors, seeking to become an indispensable part of the quantum economy under development. Called Anderon,...
