As AI workloads hit data movement bottlenecks, MIT spinoff Lightmatter is betting that photonics, not more transistors, holds the key to next-generation infrastructure. After years...
InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC's Face-to-Face (F2F)...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP...
Samsung Electronics completed initial performance tests for 4nm chips using industry-standard chiplet packaging, marking progress in its effort to strengthen AI semiconductor foundry...
InPsytech, a leading provider of high-performance semiconductor intellectual property (IP) solutions under Egis, has been selected to join the Samsung Advanced Foundry Ecosystem (SAFE)...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving...
Global Unichip Corp. (GUC), the Advanced ASICLeader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 40Gbps per lane on...
Egis Technology (EgisTec), recently transformed into the ASIC business, has signed a strategic cooperation agreement with South Korean chip design company Asicland. The two companies...
Synopsys has announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate...
Taiwanese IC design company Egis Technology (EgisTec) is actively exploring innovative opportunities in the cloud AI market through a collaboration with Arm.
TSMC and Samsung Electronics are gearing up for a chiplet mass production race. Both industry giants are set to materialize the commercialization of UCIe (Universal Chiplet Interconnect...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 32Gbps per lane,...
While the Intel-initiated Universal Chiplet Interconnect Express (UCIe) consortium has attracted many participants, Japan's academic and industry players are also stepping up efforts...
Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium. The open industry standard defines interconnect between chiplets within a package, enabling an open...
