News tagged UCIe at DIGITIMES

NEWS TAGGED UCIE

Tuesday 4 August 2026

SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth

SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...

Tuesday 14 July 2026

Intel challenges HBM leaders with XBM and ZAM in a bid to reshape AI memory

Intel is developing a new memory architecture aimed at challenging the dominance of high-bandwidth memory (HBM), with commercialization...

Tuesday 26 May 2026

Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight

As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die —...

Tuesday 3 March 2026

MediaTek highlights 6G, Wi-Fi 8, and AI chip UCIe tech at MWC 2026

At the 2026 Mobile World Congress (MWC), MediaTek showcased a series of breakthrough technologies under the theme "AI for Life: From Edge to Cloud," emphasizing its leadership in chips...

Thursday 26 February 2026

GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced it has successfully taped-out industry-leading, Universal Chiplet Interconnect Express. (UCIe.)...

Wednesday 24 September 2025

GUC Launches Next - Generation 2.5D/3D APT Platform Leveraging TSMC's Latest 3DFabric and Advanced Process Technologies

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate d...

Friday 22 August 2025

Research Insights: Chiplets gain ground in auto industry as carmakers forge global partnerships

Chiplet architecture, already entrenched in high-performance AI data centers, is beginning to penetrate the automotive sector. With its modular design and capacity for heterogeneous...

Thursday 21 August 2025

Research Insights: UCIe 1.1 upgrade aims at auto industry, boosts chiplet adoption

As automotive computing platforms increasingly demand higher performance, longer lifespans, and near-zero defect rates, chip architecture faces the challenge of balancing system reliability...

Monday 11 August 2025

UCIe 3.0 doubles bandwidth, expands chiplet ecosystem — Intel's Das Sharma on AI and compatibility

The Universal Chiplet Interconnect Express (UCIe) standard has taken a decisive step forward with the release of version 3.0, delivering up to 64 GT/s throughput and doubling bandwidth...

Wednesday 6 August 2025

Chiplet ecosystem gains momentum with Intel, TSMC, MediaTek backing

Leading semiconductor companies called for stronger adoption of open chiplet standards at the OCP APAC Summit 2025 in Taipei, highlighting...

Monday 21 July 2025

Is computing the wrong focus? Lightmatter's 3D photonics tackles AI's data bottleneck

As AI workloads hit data movement bottlenecks, MIT spinoff Lightmatter is betting that photonics, not more transistors, holds the key to next-generation infrastructure. After years...

Friday 18 July 2025

InPsytech finalizes UCIe 2.0 compliant SoIC design for 3D heterogeneous integration

InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC's Face-to-Face (F2F)...

Tuesday 15 July 2025

GUC tapes out industry-leading UCIe face-up IP for TSMC SoIC-X

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP on...

Wednesday 18 June 2025

Samsung advances 4nm chiplet technology to boost AI chip foundry position

Samsung Electronics completed initial performance tests for 4nm chips using industry-standard chiplet packaging, marking progress in its effort to strengthen AI semiconductor foundry...

Monday 19 May 2025

Egis makes initial strides in South Korea as InPsytech joins SAFE

InPsytech, a leading provider of high-performance semiconductor intellectual property (IP) solutions under Egis, has been selected to join the Samsung Advanced Foundry Ecosystem (SAFE)...

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Jul 30, 08:00

EDOM Accelerates Edge AI Deployment with NVIDIA Technologies

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