News tagged UCIe at DIGITIMES

NEWS TAGGED UCIE

Thursday 26 February 2026

GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced it has successfully taped-out industry-leading, Universal Chiplet Interconnect Express. (UCIe.)...

Wednesday 24 September 2025

GUC Launches Next - Generation 2.5D/3D APT Platform Leveraging TSMC's Latest 3DFabric and Advanced Process Technologies

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate d...

Friday 22 August 2025

Research Insights: Chiplets gain ground in auto industry as carmakers forge global partnerships

Chiplet architecture, already entrenched in high-performance AI data centers, is beginning to penetrate the automotive sector. With its modular design and capacity for heterogeneous...

Thursday 21 August 2025

Research Insights: UCIe 1.1 upgrade aims at auto industry, boosts chiplet adoption

As automotive computing platforms increasingly demand higher performance, longer lifespans, and near-zero defect rates, chip architecture faces the challenge of balancing system reliability...

Monday 11 August 2025

UCIe 3.0 doubles bandwidth, expands chiplet ecosystem — Intel's Das Sharma on AI and compatibility

The Universal Chiplet Interconnect Express (UCIe) standard has taken a decisive step forward with the release of version 3.0, delivering up to 64 GT/s throughput and doubling bandwidth...

Wednesday 6 August 2025

Chiplet ecosystem gains momentum with Intel, TSMC, MediaTek backing

Leading semiconductor companies called for stronger adoption of open chiplet standards at the OCP APAC Summit 2025 in Taipei, highlighting...

Monday 21 July 2025

Is computing the wrong focus? Lightmatter's 3D photonics tackles AI's data bottleneck

As AI workloads hit data movement bottlenecks, MIT spinoff Lightmatter is betting that photonics, not more transistors, holds the key to next-generation infrastructure. After years...

Friday 18 July 2025

InPsytech finalizes UCIe 2.0 compliant SoIC design for 3D heterogeneous integration

InPsytech, a leading company under the Egis Technology Group specializing in high-speed semiconductor IP solutions, has completed its advanced design for TSMC's Face-to-Face (F2F)...

Tuesday 15 July 2025

GUC tapes out industry-leading UCIe face-up IP for TSMC SoIC-X

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP on...

Wednesday 18 June 2025

Samsung advances 4nm chiplet technology to boost AI chip foundry position

Samsung Electronics completed initial performance tests for 4nm chips using industry-standard chiplet packaging, marking progress in its effort to strengthen AI semiconductor foundry...

Monday 19 May 2025

Egis makes initial strides in South Korea as InPsytech joins SAFE

InPsytech, a leading provider of high-performance semiconductor intellectual property (IP) solutions under Egis, has been selected to join the Samsung Advanced Foundry Ecosystem (SAFE)...

Wednesday 2 April 2025

GUC announces tape-out of the world's first HBM4 IP on TSMC N3P

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented...

Thursday 13 March 2025

GUC announces successful launch of industry's first 32G UCIe silicon on TSMC 3nm and CoWoS technology

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving...

Tuesday 7 January 2025

GUC taped out UCIe 40Gbps IP using Adaptive Voltage Scaling (AVS)

Global Unichip Corp. (GUC), the Advanced ASICLeader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 40Gbps per lane on...

Thursday 7 November 2024

EgisTec partners with Asicland to jointly target South Korea's HPC market

Egis Technology (EgisTec), recently transformed into the ASIC business, has signed a strategic cooperation agreement with South Korean chip design company Asicland. The two companies...

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Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook