中文網
  • 繁體
  • 简体
    •
  • My account
  • Sign in
  • Sign up
    •
    Trending
    CONNECT WITH US
    NEWS TAGGED TSMC
    Monday 18 August 2025
    Intel demonstrates cutting-edge 18A process for non-x86 SoCs, aiming to challenge TSMC
    Intel has showcased a non-x86 reference system-on-chip built on its Intel 18A process, underscoring the US chipmaker's commitment to expanding its most advanced manufacturing technology...
    Sunday 17 August 2025
    TSMC’s top wafer testing partner posts 78% surge as new facility ramps
    Xintec Inc., TSMC's backend packaging and testing unit, posted a strong second-quarter 2025 rebound in wafer probe revenue, driven by increased outsourcing from TSMC and the accelerated...
    Saturday 16 August 2025
    Tesla’s Dojo shutdown marks a strategic turn in its AI ambitions

    Tesla's Dojo team has been disbanded—an announcement that has sent ripples through the tech industry. The decision to abandon Dojo...

    Friday 15 August 2025
    Can Tesla's chip shift uplift Samsung foundry services?
    Over the past two weeks, Tesla CEO Elon Musk has promoted his company's new partnership with Samsung Foundry for manufacturing its AI chips. At one point, South Korean media speculated...
    Friday 15 August 2025
    Exclusive: TSMC primes CoPoS supplier network for Chiayi, US fabs ahead of 2028 ramp
    TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...
    Friday 15 August 2025
    Asicland, Primemas team up for chiplet SoC efforts
    Leading South Korean IC design firm Asicland is partnering with fellow IC design startup Primemas to spearhead an ecosystem for chiplet-based system-on-chip (SoC) platforms.
    Thursday 14 August 2025
    Samsung reportedly plans US$170M in Japan packaging hub to challenge TSMC
    Samsung Electronics is reportedly investing JPY25 billion (approx. US$170 million) to set up an advanced packaging research institute in Yokohama and acquire a major office tower...
    Thursday 14 August 2025
    AblePrint seizes AI packaging edge with early WMCM, CoPoS deployment

    AblePrint Technology (APT), a key supplier of advanced degassing equipment to major chipmakers such as TSMC, reported strong second-quarter...

    Thursday 14 August 2025
    Samsung wins Apple iPhone image sensor deal in Texas, eyes Qualcomm next
    Samsung Electronics plans to begin producing its in-house–designed high-performance CMOS image sensors (CIS) at its Austin, Texas, wafer fab in 2027 for Apple's iPhones. Industry...
    Thursday 14 August 2025
    Samsung aims to meet Tesla's chip packaging demand with new panel-level technology
    Samsung Electronics is advancing development of its next-generation System-on-Panel (SoP) packaging technology, aiming to produce modules significantly larger than those possible...
    Thursday 14 August 2025
    TSMC integrates CoWoS packaging with Coupe photonics for AI performance boost
    Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining...
    Wednesday 13 August 2025
    TSMC leads with high gross margins, while second- and third-tier foundries operate at full capacity but struggle to profit
    The foundry industry faces operational pressures in 2025 due to external factors such as tariffs, exchange rates, and geopolitical tensions. Only TSMC continues to achieve record-breaking...
    Wednesday 13 August 2025
    Inside TSMC's 2nm leak involving TEL: How a job application became an international incident
    The alleged leak of Taiwan Semiconductor Manufacturing's (TSMC) 2-nanometer technology by former and current employees from TSMC and Tokyo Electron (TEL) has sparked intense speculation...
    Wednesday 13 August 2025
    TSMC GaN exit prompts Navitas to shift orders to PSMC for Nvidia AI servers
    TSMC will exit the gallium nitride wafer foundry business within two years, a move that has prompted US chipmaker Navitas Semiconductor to redirect its orders to Powerchip Semiconductor...
    Wednesday 13 August 2025
    Commentary: Trump's 50-hour ultimatum to Lip-Bu Tan reshaped Intel's future
    On August 7, 2025, Eastern Time, US President Donald Trump publicly accused Intel CEO Lip-Bu Tan of a conflict of interest due to his investments in China and demanded that he resign...
    4/60 pages
    SpecialReports
    BIZ FOCUS
    Aug 5, 11:49
    Cultivating OCP, embracing open source
    Wednesday 13 August 2025
    Advanced WLP and back-end solutions at SEMICON Taiwan 2025
    Wednesday 9 July 2025
    TRI unveils new multi-camera AOI, TR7500 SIII Ultra
    Wednesday 13 August 2025
    Alif Semiconductor vying for market dominance in battery-powered generative AI applications and Edge AI
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES