TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced...

TSMC will hold its Supply Chain Management Forum (SCM Forum) on November 13, 2025. Notably, Yuan-Guo Huang, who was promoted to vice president of materials management in early August...

Marc Hijink, a technology reporter at Dutch daily NRC, has released "The ASML Way", a book that explores how the Dutch lithography champion rose to dominate semiconductor manufacturing...

The competition for advanced process leadership among TSMC, Samsung Electronics, and Intel is intensifying, making the pace of their new equipment acquisitions a key industry focus...

Following TSMC's confirmation in February 2025 that it will include 310×310 mm panels in its chip-on-panel-on-substrate (CoPoS) mass production, supply chain players—including...

Rebellions, a rising South Korean AI chipmaker, has become a focal point in the rivalry between Samsung Electronics and SK Hynix as the two giants compete for leadership in next-generation...

The CEOs of Infineon and NXP are scheduled to deliver keynote speeches at the upcoming SEMICON Taiwan 2025 this week.

These are the most-read DIGITIMES Asia stories from the week of September 1–September 7.

Micron is sharpening its case in the high-bandwidth memory (HBM) market, where it faces entrenched rivals and rising competition.

Intel CFO David Zinsner told investors at Citigroup's 2025 Global TMT Conference that 2026 will mark a turning point for the company's manufacturing plans, with the fate of its 14A...

Acer chair and CEO Jason Chen pointed out that in the first half of 2025, the impact of US reciprocal tariffs was significant but has since dulled. Signs of recovery are emerging...

Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs and ASICs)...

Nicky Lu, chairman of Etron Technology, emphasized at the DIGITIMES Tech Forum 2025 in Taipei that artificial intelligence (AI) and semiconductors form a "perfect match,"...

DIGITIMES chairman Colley Hwang pointed out that from 2025 to 2026, the technology industry will revolve around three key terms: artificial intelligence (AI), semiconductors, and...