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Thursday 2 April 2026
Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM

Samsung Electronics and SK Hynix are reportedly stepping up efforts to advance hybrid bonding for next-generation high-bandwidth memory...

Thursday 2 April 2026
Kioxia sets cutoff for legacy NAND, phases out SLC and MLC lines by 2026
Japan-based NAND flash maker Kioxia has formally issued an end-of-life (EOL) notice for a wide range of legacy NAND products, underscoring an industry-wide shift toward advanced 3D...
Thursday 2 April 2026
TSMC says COUPE platform set for production as Samsung outlines SiPh push

TSMC said its COUPE silicon photonics platform is set to enter volume production this year, as rising demand for high-speed interconnects...

Thursday 2 April 2026
MG adopts semi-solid batteries to boost EV range in Europe

MG, the European arm of China's SAIC Motor Group, confirmed that its upcoming MG4 Urban will feature semi-solid battery technology to...

Wednesday 1 April 2026
SiPh and advanced packaging shine at Touch Taiwan
The annual Touch Taiwan exhibition will take place April 8-10, 2026, featuring over 300 companies from 12 countries across 820 booths. Jim Hung, chairman of the TDUA, highlighted that...
Wednesday 1 April 2026
Apple at 50: From PC to mobile, AI shift now in focus

Apple marks its 50th anniversary on April 1, after helping shape multiple waves of the technology industry, from personal computing to...

Wednesday 1 April 2026
Taiwan panel leaders pivot: AUO targets CPO, Innolux advances FOPLP
Taiwan's panel industry is undergoing a collective transformation, with its two major players adopting distinct technology paths.
Wednesday 1 April 2026
Huawei revenue hits US$122bn in 2025, nears peak as AI growth becomes key test

Huawei reported 2025 revenue of CNY880.9 billion, up 2.2% year-over-year, its second-highest on record, with net profit rising 8.63% to...

Wednesday 1 April 2026
TSMC eyes SiPh breakthrough as industry consensus forms
TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...
Wednesday 1 April 2026
Micron reportedly developing stacked GDDR to address shifting AI memory demand

Micron is reportedly developing vertically stacked graphics DRAM (GDDR) products to address shifting AI memory demand, according to...

Wednesday 1 April 2026
GaN in 800V systems on the rise; Infineon and TI IDMs continue expanding production
In the 800V power supply systems of AI data centers, market consensus has solidified around strong demand for wide bandgap semiconductors. The industry has broadly concluded that the...
Wednesday 1 April 2026
Northrop Grumman advances diamond chip for high-power military radar protection
Northrop Grumman's Microelectronics Center has announced a breakthrough in diamond-based receiver protection components after a device withstood more than 100 watts of power in extreme...
Wednesday 1 April 2026
Arm, Tesla chip push reshuffles supply chains, lifts AI memory demand
Global technology and semiconductor companies are moving to build independent chip ecosystems to meet rising artificial intelligence (AI) demand, a shift that stands to reshape semiconductor...
Wednesday 1 April 2026
Taiwan scientists rethink lithium-ion batteries, eye high-power EV applications

In a breakthrough that could redefine electric vehicle (EV) battery technology, a research team led by Professor Yu-Sheng Su at the International...

Wednesday 1 April 2026
Hiwin and other manufacturers bring high-load robotics hardware to Computex 2026

As global interest in robotics surges, Taiwan's technology trade shows are increasingly spotlighting the field. Beyond its longstanding...