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Monday 19 October 2026
Canon Taiwan sees strong global camera demand in 2026 and 2027
Canon Marketing Taiwan President Hu Da-gang said the global camera market performed well in 2026, with demand rebounding after the pandemic and smartphone photography helping cultivate...
Monday 19 October 2026
Solution Finders Part 1 of 2: the DARPA challenge behind TSMC's success
The foundations of TSMC's modern-day success can be traced back to a public call from the US Defense Advanced Research Projects Agency (DARPA) for innovative designs that could break...
Monday 19 October 2026
Von Ardenne's flexible equipment targets unsettled panel-level packaging market
German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions...
Monday 19 October 2026
Exclusive: Wooptix targets leading chipmakers with wafer metrology technology, eyes production adoption within 3-5 years
Spanish semiconductor metrology startup Wooptix, whose technology originated in astronomical observation, is accelerating efforts to enter the supply chains of leading semiconductor...
Monday 19 October 2026
Toyota to deploy gigacasting in China as Shanghai Lexus plant targets 2027
Toyota Motor will introduce its proprietary gigacasting technology in China to produce premium vehicles, while it has not disclosed whether it will use equipment from local Chinese...
Monday 19 October 2026
Interview: Zeiss SMO president says High-NA EUV ready for mass production, orders booked through 2027
Surging AI-driven chip demand has extended order visibility for Zeiss, a key supplier of extreme ultraviolet (EUV) lithography optics. Christoph Hensche, president of Zeiss Semiconductor...
Monday 19 October 2026
SK Hynix advances chip inspection technology as 3D memory pushes conventional metrology to its limits
SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges...
Monday 19 October 2026
AUO, Largan Micro LED debate highlights optical communications uncertainty
AUO chairman Paul Peng said Micro LED remains a potential option for optical communications, despite Largan Technology's doubts about pairing it with multimode fiber in co-packaged...
Monday 19 October 2026
China proposes tighter export controls on AI and solar technologies
China is moving to tighten oversight of technology transfers that support its companies' overseas expansion, proposing export bans and licensing requirements for artificial intelligence...
Monday 19 October 2026
AUO expands AI businesses as it seeks its next growth curve
AUO is expanding its push into AI-related businesses, including augmented reality (AR) glasses, low-Earth-orbit (LEO) satellite antennas, optical communications, and advanced semiconductor...
Monday 19 October 2026
Nvidia backs OpenClaw, putting robotics potential, agent security in focus
OpenClaw is drawing renewed attention after Nvidia CEO Jensen Huang endorsed the open-source AI agent framework as a foundation for future technology, especially robotics. His remarks...
Monday 19 October 2026
US defense startups turn to Taiwan for local production partnerships
US defense companies are increasingly setting up partnerships in Taiwan, moving beyond component procurement to joint development, system integration, local manufacturing, maintenance...
Monday 19 October 2026
Beyond displays: AUO eyes co-packaged optics, glass core substrates for AI-era growth
AUO is positioning its growth around artificial intelligence, diversification, and cooperation across the group as the display technology company marks its 30th anniversary. Chairman...
Monday 19 October 2026
Exclusive: Chinese energy storage giants reportedly exit US as two-way tech restrictions open door for non-Chinese suppliers
Major Chinese energy storage system suppliers that once dominated the US market have reportedly withdrawn almost entirely from US operations in 2026, amid mounting regulatory restrictions,...
Monday 19 October 2026
India roundup: Tata chip bets face execution test as India semiconductor ecosystem expands

Tata's Dholera fab faces customer and shareholder tests as India's semiconductor push broadens, with packaging, chip services, AI hardware and...