Genius Electronic Optical, a leading manufacturer of optical lenses and precision optical components, announced on October 15 that it had formed a strategic partnership with 3M, a...
Competition in the global PC market is shifting from a focus on shipment volumes of low-cost models towards premium, high-performance devices, intensifying the race in OLED display...
Vietnamese technology group FPT is lining up a second Japanese distribution channel for its in-house power chips, a move that would carry Vietnamese-designed semiconductors beyond...
IBM and MeitY Startup Hub, an initiative of India's Ministry of Electronics and Information Technology (MeitY), have signed a memorandum of understanding (MoU) to support India's deep...
RF antenna and communications technology company Auden Techno recently inaugurated its global headquarters and R&D center in Bade, Taoyuan. Chairman Chang Yu-Pin said the company's...
Nvidia will provide the UK with US$250 million worth of computing resources over five years to support AI safety research, as CEO Jensen Huang defended the industry's ability to manage...
The rapid expansion of AI and data center chip package sizes is accelerating the adoption of glass substrates, with SEMI's Beth Keser now forecasting market entry around 2028, two...
Topco Scientific (TSC) is evaluating a new base in Boise, Idaho, as the US enters a fresh wave of chip manufacturing expansion and Micron ramps up advanced memory investment. The company...
The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026；GMIF2026), co-hosted by the Shenzhen Memory Industry Association and the School of Integrated...
Asia Vital Components (AVC) unveiled new liquid-cooling solutions, including direct liquid cooling (DLC) and an In-Row CDU, at the Open Compute Project (OCP) Global Summit, held October...
Samsung Electronics and AMD have collaborated to validate Compute Express Link (CXL) memory technology designed to expand capacity and bandwidth for AI servers, as Samsung broadens...
LG Electronics is reportedly working with Bosch to develop automotive chiplets, a move that would mark LG's formal entry into the automotive semiconductor market if the technology...
As AI cluster sizes grow, networking systems face challenges beyond higher bandwidth, including power consumption, cooling, cross-site coordination, and large-scale device operations...
The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
Japan's digital technology innovation expo CEATEC 2026 opened on October 13 at Makuhari Messe in Chiba, bringing together 821 companies and organizations from Japan and overseas to...
