VisionPower Semiconductor Manufacturing Company (VSMC), the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, opened its 12-inch wafer fab in...
As warnings about catastrophic AI risks intensify, Nvidia CEO Jensen Huang is making a different case: AI safety should be treated as an engineering challenge, not a justification...
The Washington summit between Donald Trump and Xi Jinping did not produce the speculated auto deal that would have allowed Chinese automakers to manufacture vehicles in the US. While...
US President Donald Trump has responded to mounting alarm over rogue AI agents with a voluntary industry pledge, two executive orders, and a new name for the technology rather than...
Garmin's decision to offer OLED options but no Micro LED version in its new flagship smartwatches, the fenix 9 and fenix 9 Pro, has revived debate over whether the emerging display...
GlobalFoundries (GF) is expanding its Singapore footprint following its acquisition of local silicon photonics foundry Advanced Micro Foundry (AMF), integrating 200mm and 300mm silicon...
Micro LED has reached mass production in several end-market applications in recent years, but it is still facing intense competition from OLED. Garmin's new fenix 9 smartwatch has...
Apple has launched its first foldable phone, the iPhone Duo, adopting under-display camera (UDC) technology long used by Samsung Electronics. The move puts all-screen design back at...
The US-China trade truce was extended after last week's Trump-Xi summit, but China's dominance of rare-earth supply chains remains a key pressure point as Washington tries to stabilize...
ProLogium Technology said it has signed a joint testing agreement with Mercedes-Benz, giving the automaker priority access to evaluate the battery maker's latest Gen4 cells. The companies...
Saimemory, a SoftBank subsidiary, has brought Shinko Electric Industries into its effort to commercialize Z-Angle Memory (ZAM), adding packaging-substrate, high-density integration...
Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific...
