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Wednesday 17 June 2026
Poland turns to Taiwan to build up chips as Foxconn seals EV assembly deal

Poland is seeking major Taiwanese investment to strengthen its manufacturing base, a shift that could reshape Europe's supply chains...

Wednesday 17 June 2026
Nvidia highlights role of optical networking as Coherent breaks ground on Texas AI chip facility
AI infrastructure is increasingly dependent on light, and more of that technology is being built in Texas. Coherent's new Sherman expansion, backed by public and private funding, could...
Wednesday 17 June 2026
EssilorLuxottica, Applied Materials team up on smart eyewear technology
EssilorLuxottica and Applied Materials have agreed to a long-term partnership to speed development of intelligent optical systems for augmented reality and AI-powered smart eyewear,...
Wednesday 17 June 2026
Topkey accelerates carbon fiber footprint into drones, robots, and LEO satellites
Taiwan-based carbon fiber composite maker Topkey is accelerating its expansion into high-growth technology sectors, with formal evaluations underway for applications in drones, industrial...
Wednesday 17 June 2026
Samsung Electro-Mechanics expands silicon capacitor push on integration edge

Samsung Electro-Mechanics (Semco) is rapidly gaining ground in the silicon capacitor market as AI infrastructure investment and technology...

Wednesday 17 June 2026
China's six-network plan signals a long-term infrastructure and technology self-reliance push

China's elevation of six infrastructure categories to national strategic priority status could reshape its industrial base, reduce...

Wednesday 17 June 2026
AI era reshapes power dynamics between software firms and model providers

As companies adapt to the rise of artificial intelligence, technology leaders are increasingly debating how to preserve their competitive...

Tuesday 16 June 2026
ASML, TSMC, and imec move 2D transistors closer to manufacturing reality
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor...
Tuesday 16 June 2026
Samsung reportedly moves closer to 5nm-class MRAM as TSMC advances its roadmap

Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial...

Tuesday 16 June 2026
China mass produces silicon-28 amid quantum computing race with US

China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) —...

Tuesday 16 June 2026
Walrus Pump sees stronger liquid cooling demand, eyes higher 2026 growth

AI server liquid cooling is driving demand for pump makers, a shift that could boost supply-chain resilience and margins for Asia-based...

Tuesday 16 June 2026
TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in...

Tuesday 16 June 2026
AMD to acquire MEXT to expand AI memory optimization tools
AMD said it will acquire MEXT, a move aimed at strengthening its AI and data center portfolio amid rising global memory demand. The deal is intended to help customers improve performance,...
Tuesday 16 June 2026
South Korea launches ultra-innovation economy push with major investment in next-generation power semiconductors
South Korea has begun planning a large-scale research and development program for next-generation power semiconductors as part of its broader "Ultra-Innovation Economy Project," according...
Tuesday 16 June 2026
TSMC PLP timeline faces skepticism from Taiwan industry sources

A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...