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Thursday 29 October 2026
Intel CTO: process gap with TSMC down to a few points, but scale still lags
Technology podcast host Dwarkesh Patel recently released a special episode after spending two days touring Intel's fabs and research laboratories and speaking with several technology...
Thursday 29 October 2026
Anduril, Qualcomm team up on domestic computing to rebuild the hardware supply chain
In an effort to reduce national security vulnerabilities tied to foreign electronics supply chains, defense technology startup Anduril Industries and chipmaker Qualcomm Technologies...
Thursday 29 October 2026
ASM's earlier growth target puts supply chain execution in focus
ASM International's stronger outlook suggests that investment in advanced chipmaking is accelerating demand for its deposition equipment faster than the company had previously planned...
Thursday 29 October 2026
Lenovo previews CES 2027 lineup focused on AI agents, hybrid AI
Lenovo Group announced that its annual global innovation event, Tech World, will return to CES 2027 in Las Vegas, taking place at Sphere as part of the keynote program. The event will...
Thursday 29 October 2026
Advantech opens Tustin HQ to strengthen North American R&D
Industrial PC maker Advantech has opened its new North American headquarters in Tustin, California, expanding local R&D, manufacturing and system integration capabilities. The...
Thursday 29 October 2026
Analysis: SpaceX–Tesla merger could reshape AI industry integration, capital allocation, US-China tech rivalry
Elon Musk recently confirmed the possibility of a merger between SpaceX and Tesla, signaling an ambition to redefine competition in the AI era beyond individual products and technological...
Thursday 29 October 2026
Kinsus explores AlN ceramics beyond glass for AI advanced packaging
Kinsus Interconnect Technology is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass...
Thursday 29 October 2026
Anthropic's IPO filing highlights China AI rivalry as model distillation, chip export controls emerge as key risks
US AI startup Anthropic has formally filed for an initial public offering (IPO) with the US Securities and Exchange Commission (SEC), identifying competitive pressure from Chinese...
Wednesday 28 October 2026
Ex-TSMC CTO says Taiwan's research institutes get too much funding and train too little talent
Taiwan directs too much public research and development (R&D) funding to its national research institutes, according to Chenming Hu, a former chief technology officer of Taiwan...
Wednesday 28 October 2026
SK Hynix bets on EUV to extend 6F-squared DRAM as CXMT pushes 4F-squared
SK Hynix plans to extend the life of its existing 6F-squared DRAM cell architecture through extreme ultraviolet (EUV) lithography and process improvements, keeping 4F-squared and three-dimensional...
Wednesday 28 October 2026
Kentec targets CSP opportunities with AIDC infrastructure integration
Kentec, a subsidiary of Kenmec Group, is shifting beyond its traditional role as a contract manufacturer of components to become a systems integration provider (SIP) for complete AI...
Wednesday 28 October 2026
India-based Spintronics AI weighs GaN chip fab in Madhya Pradesh
Hyderabad-based Spintronics AI Semiconductors said on October 27 that it is evaluating the feasibility of establishing a gallium nitride (GaN) semiconductor fabrication facility at...
Wednesday 28 October 2026
SK Hynix's Solidigm ties US$45B US NAND fab to Washington nod on China tool upgrade
Solidigm, the US-based subsidiary of SK Hynix, is in talks with the US Department of Commerce over a potential US$45 billion investment in a new NAND flash memory fabrication plant,...
Wednesday 28 October 2026
SK Hynix's next bet goes beyond memory chips
SK Hynix is looking beyond its position as a leading supplier of high-bandwidth memory (HBM), using venture investments to gain a greater say in how next-generation AI infrastructure...
Wednesday 28 October 2026
Samsung DX division opens Suzhou robotics R&D hub
Samsung Electronics' Device eXperience (DX) division has established its first overseas research and development site for manufacturing technology in Suzhou, China, leveraging the...