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    Cook's parting shot: Apple takes AI compute out of data centers
    42min ago
    NEWS TAGGED TECHNOLOGY
    Monday 24 August 2026
    India targets domestic mobile phone design capabilities with new US$7.5 billion manufacturing scheme
    India has announced an INR625 billion (US$6.53 billion) Mobile Phone Manufacturing Scheme aimed at moving the country's electronics industry beyond large-scale assembly and toward...
    Monday 24 August 2026
    Alibaba plans HKD80 billion share placement to fund AI expansion
    Alibaba Group Holding said it plans to raise HKD80 billion (US$10.2 billion) through the placement of newly issued shares to non-US investors outside the US, a move that could bolster...
    Monday 24 August 2026
    India advances Wi-Fi mmWave FWA trial as Gemtek eyes 100x shipments
    Gemtek has made new progress in its India-based Wi-Fi mmWave fixed wireless access (FWA) rollout after India's Telecommunication Engineering Centre (TEC), under the Department of Telecommunications...
    Monday 24 August 2026
    Taiwan's 'invisible champions' in chip materials are about to become visible, says GlobalWafers' Doris Hsu

    Advanced process technology and new device architectures are reshaping the semiconductor supply chain — and the pressure is shifting...

    Monday 24 August 2026
    India roundup: India's chip push moves beyond fabs as yield, supply chains and new technology become the next test
    India's semiconductor strategy is entering a more demanding phase, shifting from attracting fabs and assembly plants toward building the capabilities needed to sustain them. From wafer...
    Monday 24 August 2026
    Taiwan lifts 2027 tech budget, studies new TTA site in BSTP
    Taiwan's Executive Yuan approved a larger 2027 technology budget of NT$229.2 billion (approx. US$7.2 billion), an increase of NT$25.9 billion from 2026, as the government also raised...
    Saturday 22 August 2026
    Interview: Arbe Robotics on why radar is needed for autonomous driving and beyond
    Autonomous driving technology is maturing, and a future in which cars entirely drive themselves is quickly approaching in the rearview mirror. Yet safety and trust remain crucial barriers...
    Friday 21 August 2026
    DS Technology shifts from custom automation to modular systems, eyes Brazil and Mexico

    Taiwanese automation integrator DS Technology is shifting more of its highly customized robotic automation work toward standardized,...

    Friday 21 August 2026
    Broadcom reportedly eyes up to US$100B debt financing to expand AI chip push
    Broadcom is in talks with asset managers to raise more than US$60 billion in debt financing, with the potential package reaching as much as US$100 billion, as the chipmaker moves to...
    Friday 21 August 2026
    CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth
    Bosch Rexroth, the industrial technology subsidiary of Bosch, showcased advanced semiconductor and smart manufacturing solutions at the 2026 Taipei International Industrial Automation...
    Friday 21 August 2026
    Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
    Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
    Friday 21 August 2026
    Iris Optronics upgrades solar-powered ChLCD e-paper series, expands outdoor and indoor displays
    Iris Optronics, a manufacturer of cholesteric liquid crystal display (ChLCD) e-paper, announced upgrades to its Infinity solar-powered ChLCD e-paper series, including a mass-producible...
    Friday 21 August 2026
    FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

    Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

    Friday 21 August 2026
    Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
    The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
    Friday 21 August 2026
    Micron launches long-horizon research hub to push memory and AI development
    Micron's new US research hub could influence how future AI systems are built, stored, and scaled, with implications that extend well beyond America. The planned US$10 billion effort...
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    BIZ FOCUS
    Aug 25, 08:00
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
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