The rapid expansion of AI and data center chip package sizes is accelerating the adoption of glass substrates, with SEMI's Beth Keser now forecasting market entry around 2028, two...
Topco Scientific (TSC) is evaluating a new base in Boise, Idaho, as the US enters a fresh wave of chip manufacturing expansion and Micron ramps up advanced memory investment. The company...
The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026；GMIF2026), co-hosted by the Shenzhen Memory Industry Association and the School of Integrated...
Asia Vital Components (AVC) unveiled new liquid-cooling solutions, including direct liquid cooling (DLC) and an In-Row CDU, at the Open Compute Project (OCP) Global Summit, held October...
Samsung Electronics and AMD have collaborated to validate Compute Express Link (CXL) memory technology designed to expand capacity and bandwidth for AI servers, as Samsung broadens...
LG Electronics is reportedly working with Bosch to develop automotive chiplets, a move that would mark LG's formal entry into the automotive semiconductor market if the technology...
As AI cluster sizes grow, networking systems face challenges beyond higher bandwidth, including power consumption, cooling, cross-site coordination, and large-scale device operations...
The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
Japan's digital technology innovation expo CEATEC 2026 opened on October 13 at Makuhari Messe in Chiba, bringing together 821 companies and organizations from Japan and overseas to...
China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and...
Qualcomm is pushing to cut edge AI's energy cost as phones, cars, and other devices face tighter power and cooling limits than data centers. At the opening of Applied Materials' EPIC...
LG Energy Solution (LGES) is reportedly restructuring its energy storage system (ESS) battery equipment supply chain after major partner Daejin Machinery entered financial difficulties...
MiTAC Computing Technology featured a comprehensive suite of full-stack AI infrastructure at the Open Compute Project (OCP) Global Summit in San Jose, California, centered around the...
Senior executives from TSMC, Intel, and Samsung Electronics outlined the growing challenges of AI chip development, spanning advanced semiconductor processes, 3D integration, and research...
China's Geely has officially entered the Canadian market and plans to launch its first vehicles there in 2027, expanding its North American footprint. Geely has completed its Canadian...
