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    Commentary: Behind Micron's bet for a long memory demand cycles
    2h 57min ago
    Interview: Qnity's Taiwan investment to focus on advanced packaging, CPO and cooling
    2h 57min ago
    GPU and ASIC new platforms to drive stronger server shipments in 2H26
    2h 57min ago
    South Korean memory makers weigh stronger profits from general DRAM than HBM
    2h 57min ago
    MCU price hike expectations drive early 1H26 pull-ins
    2h 57min ago
    iPhone 18 Pro price hike: Memory costs or margin play?
    2h 57min ago
    NEWS TAGGED TECHNOLOGY
    Saturday 27 June 2026
    Hanmi targets advanced packaging market with FC Bonder 3.5

    Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...

    Saturday 27 June 2026
    US backs I-Pulse's $250M plan to use pulsed power for geothermal drilling
    A US$250 million award for I-Pulse's semiconductor and pulsed power research could have implications far beyond the US, potentially affecting energy, mining, defense, and chip supply...
    Saturday 27 June 2026
    ShunSin sees CPO potential, adds TSMC veterans as independents
    ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging,...
    Saturday 27 June 2026
    MediaTek frames orbit compute and NTN as next strategic R&D priorities
    MediaTek hosted MARC Workshop 2026 on June 24 through the MediaTek Advanced Research Center (MARC), recognizing the year's university-industry collaboration outcomes while outlining...
    Friday 26 June 2026
    Qualcomm HBC takes aim at HBM costs in AI data centers

    Qualcomm has unveiled its latest AI data center platform, Dragonfly, at its annual investor day, highlighting a new technology it calls...

    Friday 26 June 2026
    Agility Robotics IPO strengthens Foxconn's long-term robotics ambitions

    Humanoid robotics and physical AI pioneer Agility Robotics has announced plans to pursue a public listing, drawing significant attention from global capital markets...

    Friday 26 June 2026
    AIDC showcases advanced composite materials for next-gen aircraft, drones
    To meet the aerospace industry's push for lighter, more environmentally sustainable next-generation aircraft, Taiwan's Aerospace Industrial Development Corporation (AIDC) has stepped...
    Friday 26 June 2026
    Academia Sinica readies Taiwan-made quantum chip for engineering push
    Academia Sinica has built a 20-qubit quantum chip from scratch, and the team now says the next phase is less about lab breakthroughs and more about engineering a scalable, reproducible...
    Friday 26 June 2026
    IBM breaks sub-1nm barrier with 3D nanostack transistor platform
    On June 25, IBM unveiled what it calls the world's first sub-1nm chip technology: a 0.7nm — or 7 angstrom — transistor architecture built on an entirely new 3D platform...
    Friday 26 June 2026
    Alibaba chip unit T-Head triples registered capital amid AI push
    Alibaba Group's semiconductor design arm T-Head has more than tripled its registered capital, underscoring the Chinese technology giant's growing focus on artificial intelligence infrastructure...
    Friday 26 June 2026
    GlobalFoundries expands Singapore role as it targets physical AI hardware wave
    GlobalFoundries (GF) is positioning its Singapore operations as a core hub for the emerging era of physical AI, as the chipmaker expands investment in manufacturing capacity and next-generation...
    Friday 26 June 2026
    Europe aggressively pursues non-red supply chains; Thunder Tiger showcases unmanned combat systems in Poland
    Unmanned aerial vehicle (UAV) manufacturer Thunder Tiger recently participated in the Taiwan Expo in Europe 2026 in Warsaw, Poland, showcasing its combat solutions. It said European...
    Friday 26 June 2026
    Apple and Google consider adopting Chinese memory chips: three obstacles remain
    As AI demand prolongs shortages in memory chip supply, global technology companies are increasingly turning to Chinese-made semiconductors. However, industry analysts believe that...
    Thursday 25 June 2026
    Samsung chairman reviews HBM4 supply as revenue tops US$1 billion

    Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations,...

    Thursday 25 June 2026
    China specialty foundry Hua Hong Grace rides 40nm low-power process and Wuxi 12-inch ramp
    Hua Hong Grace Semiconductor (HHGrace) is seeing gains from both process technology and capacity expansion, with industry research showing its 40nm ultra-low-power specialty process...
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook