CONNECT WITH US
NEWS TAGGED TECHNOLOGY
Wednesday 12 August 2026
TSMC-Sony's US$4.69B sensor venture is a defensive play against Samsung and China

TSMC and Sony Group are betting that closer integration, not just closer proximity, is what it will take to keep their combined lead...

Wednesday 12 August 2026
Silicon Motion raises private placement to US$1B, targets agentic AI

Silicon Motion announced the pricing of a private placement of US$1 billion in aggregate principal amount of 0% convertible senior...

Wednesday 12 August 2026
Taiwan's 20-qubit superconducting quantum computer wins 2026 Future Tech Award

Taiwan's National Science and Technology Council (NSTC) announced the winners of its annual Future Tech Award on August 10, with the...

Wednesday 12 August 2026
Apple presses Samsung Display and LG Display for lower iPhone 18 OLED prices
Apple has asked Samsung Display and LG Display to sharply reduce OLED panel prices for the iPhone 18 as it works to offset rising production costs, according to South Korean media...
Wednesday 12 August 2026
South Korea elevates SMR to national strategy, boosts nuclear investment
The South Korean government has proposed adding small modular reactors (SMRs) to its national strategic-technology tax incentive program, a move backed by the country's nuclear industry...
Wednesday 12 August 2026
Taiwan ranks fifth globally for cyber threats, with semiconductors and finance prime targets

As companies accelerate the adoption of AI agents to reshape business processes, attackers are using the same technology to increase the...

Tuesday 11 August 2026
TSMC commits JPY282 billion to Sony sensor JV as AI demand outruns Sony's 40nm process

TSMC and Sony Semiconductor Solutions have signed a legally binding definitive agreement to establish Advanced Vision Semiconductor...

Tuesday 11 August 2026
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
Tuesday 11 August 2026
LiteOn teams with Wolfspeed on 800VDC power systems for AI data centers

LiteOn Technology plans to begin trial production of its 800V high-voltage direct current (HVDC) solutions in August as it prepares...

Tuesday 11 August 2026
Taiwan and China see more students choose STEM as tech demand rises
For students and employers worldwide, the shift toward science and engineering degrees in Taiwan and China underscores how artificial intelligence, advanced manufacturing, and semiconductor...
Tuesday 11 August 2026
China's AMIES lands repeat orders for 350nm lithography system

Shanghai-based AMIES Technology has secured repeat volume orders for its domestically developed AST6200 350nm stepper projection lithography...

Tuesday 11 August 2026
PSA, NTUT sign NT$50 million AI research and talent deal
Passive System Alliance (PSA) Group and National Taipei University of Technology have signed a three-year industry-academia agreement worth NT$50 million to advance artificial intelligence...
Tuesday 11 August 2026
Taiwan optical firms diverge in CPO push as Corning looms large

Co-packaged optics (CPO) remains a key focus in the AI era. Beyond advanced packaging and testing, compound semiconductors, and other...

Tuesday 11 August 2026
Europe and US IDM giants expand China EV share on capacity, tech edge
Major European and US integrated device manufactures (IDM) have faced strong competition from Chinese players within China's electric vehicle (EV) market in recent years, but many...