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Tuesday 10 November 2026
Winbond to run Infineon flash unit as independent, fabless Spansion brand
Winbond Electronics will revive the Spansion brand for the NOR Flash and F-RAM business it is buying from Infineon Technologies and run it as a fully independent, fabless company,...
Tuesday 10 November 2026
Intel targets silicon photonics, in-memory computing beyond GPUs
As the global semiconductor industry continues to focus on Nvidia, Intel is looking beyond GPUs to determine where next-generation computing architectures will go. In an interview...
Tuesday 10 November 2026
Winbond chairman urges restraint in memory rally, expects 30-month bonuses as Nuvoton plans succession
Winbond Electronics chairman Arthur Chiao said memory prices and profits should not go any further at this stage, warning that a market in which memory thrives while other industries...
Tuesday 10 November 2026
Exclusive: Quantum beyond quantum—Photarix bets on a new era of semiconductor photonics
A future communications network capable of detecting certain forms of eavesdropping may depend on something remarkably small: a semiconductor device designed to emit individual particles...
Tuesday 10 November 2026
Taiwan exports hit record US$96.76 billion in October
Taiwan's exports rose 58.9% year on year to a record US$96.76 billion in October, as strong investment in global artificial intelligence infrastructure boosted demand across related...
Monday 9 November 2026
Taiwan President taps chip strengths for self-reliant space push
Taiwan will continuously elevate its self-reliant space technology capabilities while leveraging its long-standing strengths in semiconductors, electronics, telecommunications, and...
Monday 9 November 2026
Texas AI data-center expansion hits brakes under new governor
Texas' incoming Democratic governor, Gina Hinojosa, plans to reassess the state's partnerships with the technology sector and strengthen oversight of data-center expansion, potentially...
Monday 9 November 2026
US-approved Nvidia H200 handlers in China include firms with empty offices and blacklist ties
Washington's case for letting Nvidia sell H200 chips to China rested on case-by-case national-security screening. A New York Times investigation published on November 7 suggests...
Monday 9 November 2026
Paras Semiconductors teams with US-based BroadPak on advanced packaging plant in India
Paras Semiconductors, a subsidiary of Indian defense company Paras Defence & Space Technologies, announced a strategic technology partnership with US-based BroadPak Corporation...
Monday 9 November 2026
China's smart cockpits reach 100% domestic assembly, but foreign tech still controls over 70% of the core
China accounts for approximately 36% of the global smart cockpit market, with an established presence in automotive displays, head-up displays (HUDs), voice interaction and cockpit...
Monday 9 November 2026
Alphabet's Qualcomm stake signals deeper partnership as chipmaker targets AI data centers
Alphabet has acquired a stake worth nearly US$548 million in Qualcomm, strengthening the financial ties between the longtime partners as the chipmaker seeks to diversify beyond smartphones...
Monday 9 November 2026
Innodisk says AI applications now generate more than 40% of revenue as 3Q26 profit jumps
Innodisk said AI-related applications generated more than 40% of its revenue as demand for high-end AI server memory and storage lifted third-quarter results. The Taiwanese industrial...
Monday 9 November 2026
UKSC highlights three UK semiconductor strengths for Taiwan
Andy McLean, CEO of the UK Semiconductor Centre (UKSC), told DIGITIMES that strong AI growth is driving demand for energy-efficient processors, high-speed connectivity technologies...
Monday 9 November 2026
US Department of Defense commits US$75 million to Halo SiC wafer expansion
The Department of Defense's Office of Strategic Capital (OSC) has offered Halo Industries, a semiconductor startup based in Santa Clara, California, a conditional loan commitment of...
Monday 9 November 2026
Surging AI demand turns CoWoS into a headache; securing packaging capacity becomes top priority, says MediaTek deputy GM
Surging demand for advanced packaging driven by artificial intelligence (AI) has turned chip-on-wafer-on-substrate (CoWoS) from an "interesting" technology into a headache, making...