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NEWS TAGGED SPIL
Wednesday 23 February 2022
ASE eyeing backend orders for Apple-designed 5G modem chips
ASE Technology, which owns Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), is in preliminary talks with Apple for backend orders associated with...
Monday 10 January 2022
AMD latest 3D desktop processor to adopt TSMC SoIC technology
AMD has launched its first 3D desktop processor for the consumer segment at CES 2022, which is expected to be fabricated by TSMC using 3D SoIC (system on integrated chips) technology,...
Wednesday 29 December 2021
Fan-out packaging demand to grow for mobile chips
Fan-out packaging demand will be rising, as Qualcomm and MediaTek reportedly are moving to adopt the technology for processing their handset-use APs and power management ICs (PMIC)...
Friday 17 December 2021
Taiwan OSATs gearing up for MediaTek 5G mmWave chips
ASE Technology and other Taiwan-based OSATs are gearing up for MediaTek's 5G mmWave chips solutions slated for launch in 2022, according to industry sources.
Friday 3 December 2021
ASE obtains major orders for new Qualcomm mobile SoC
Taiwan's leading backend house ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have obtained major orders for processing Qualcomm's just-unveiled flagship...
Thursday 25 November 2021
TSMC outsources part of CoWoS packaging production to OSATs
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
Monday 22 November 2021
Major US chipmakers gearing up for 6nm Wi-Fi 7 SoCs
Leading Wi-Fi chipmakers Qualcomm, Broadcom and even Intel are keenly developing Wi-Fi 7 SoCs, and may have their chips manufactured at TSMC using 6N RF process, looking to meet the...
Thursday 18 November 2021
Qualcomm to scale down modem chip supply for iPhones
Qualcomm will sharply cut back its modem chip supply for Apple's iPhones starting 2023, sparking speculation that Apple will have its in-house developed modem solution ready for the...
Monday 27 September 2021
OSATs in Suzhou concerned more about labor shortage than power reduction
Taiwan's OSATs have seen their plants in Suzhou, Jiangsu province little affected by a power supply cut enforced by China under its carbon reduction policy, but they are more concerned...
Friday 17 September 2021
AiP packaging demand set to be stimulated by new iPhone
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Monday 12 July 2021
ASE Technology to score big in 3Q21 from serving heavyweights
Taiwan's leading OSAT ASE Technology Holding will see big orders from major clients Apple, Qualcomm and MediaTek further power its revenue growth in the third quarter after posting...
Monday 28 June 2021
Backend demand for HPC chips strong, but ABF substrate support matters
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Friday 28 May 2021
Chipmakers striving to obtain stable aQFN leadframe supply
Chipmakers including MediaTek, Qualcomm and Realtek Semiconductor are striving to secure stable supply of leadframes for use in aQFN packaging, with related leadframe suppliers already...
Friday 21 May 2021
Backend houses gearing up for new orders from Qualcomm
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) reportedly will offer backend services for Qualcomm's newly-released Snapdragon 778G...