Taiwan-based Group Up Industrial (GP), dedicated to supplying automation and semiconductor dry process equipment, has seen clear order visibility through the third quarter of 2019...
Powertech Technology (PTI) expects to post flat or slight sequential growth in revenues for the second quarter, followed by a substantial increase in the third quarter, accordin to...
ASE Technology has landed more customized SiP (system-in-package) backend orders than expected earlier this year thanks to growing demand for heterogeneous integration of 5G chips,...
Major Taiwan-based backend houses ASE Technology Holding and Powertech Technology (PTI) have both reported sequential decreases of 22.1% and 13.2%, respectively, in consolidated revenues...
Taiwan-based Keystone Mircrotech, a supplier of high-frequency and high-speed IC testing solutions, is optimistic about a double-digit revenue growth for 2019 as it is stepping up...
The Taiwan semiconductor industry is gearing up to tap huge business opportunities arising from AI and IoT applications, such as machine learning, cloud to edge computing and big data,...
ASE Technology Holding expects revenues to drop in the first quarter of 2019, due to inventory correction at customers engaged in the handset- and communication-related IC sector coupled...
Heterogeneous integration of diverse semiconductor components to support 5G, AI, automotive electronics, and IoT applications is gaining significant momentum, driving demand for SiP...
Taiwan-based Nan Ya PCB is gearing up to further upgrade its process technology and adjust product portfolios seeking to fully swing to profitability in the entire 2019 by cashing...
China-based OSAT (outsourced semiconductor assembly and test) firms are gearing up to tap into medium to high-end packaging fields, including the flip chip (FC) packaging segment where...
Taiwan-based IC fabrication and packaging material distributors including Topco Scientific, Niching Industrial and Wahlee Industrial are expected to end 2018 with impressive annual...
System in package (SiP) will continue to gain momentum to become the mainstream IC packaging process in the future as it can further complete heterogeneous integration of diverse chip...
ASE Technology Holding, the parent company of IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), has reported October consolidated revenues...
Amkor Technology will soon start operating a new factory at its manufacturing site in Longtan, northern Taiwan for wafer-level packaging (WLP) and wafer test services. The arrival...
Backend house ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in system-in-package (SiP) modules, will be stepping up its diversification...
