ASE Industrial holding, the parent company of IC backend houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), is expected to report revenue...

As one of China's three leading IC backend service firms, Tongfu Microelectronics (TFME) has managed to provide one-stop packaging and testing solutions by expanding its operation...

ASE Industrial holding, the parent company of Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), will be diversifying its offerings to satisfy growing...

Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology.

Foxconn Electronics (Hon Hai Precision Industry) has set up a semiconductor subgroup, which is mulling 12-inch fab construction, industry sources have claimed.

Advanced Semiconductor Engineering (ASE) has reported consolidated revenues of NT$64.97 billion (US$2.22 billion) for the first quarter of 2018, down 22.6% sequentially and 2.4% on...

ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, returned to profitability...

The production value of Taiwan's IC packaging and testing industry sector is expected to increase 4-5% in 2018, according to the government-funded Industrial Economics and Knowledge...

Qualcomm and Universal Scientific Industrial (Shanghai), a subsidiary of Advanced Semiconductor Engineering, have signed an agreement to form a joint venture in Sao Paulo. This joint...

Advanced Semiconductor Engineering (ASE) expects its IC backend business sales to register strong sequential growth in the second quarter and grow through the fourth quarter. The company...

Universal Scientific Industrial (USI), a subsidiary of backend service provider Advanced Semiconductor Engineer (ASE), saw its net profits surge 63.1% to CNY1.31 billion (US$208.7...

Advanced Semiconductor Engineering (ASE) and Cadence Design Systems have collaborated to release a system-in-package (SiP) EDA solution that addresses the challenges of designing and...

High performance computing (HPC) will become the most crucial platform in the development of process technologies for AI (artificial intelligence) chips, and CoWoS (chip on wafer on...

Networking device supplier Gemtek Technology plans to fully acquire SiP module maker Ampak Technology to enhance its presence in the IoT and cloud-enabled communication market.

Shipments of Apple Watch 3 are expected to surge 20% on year to reach 23-25 million units in the coming year, which will greatly benefit Taiwan players in the supply, particularly...