ASE Technology Holding is expected to see its core IC assembly, testing and material (ATM) business register flat sequential revenue growth in the first quarter of 2020, thanks to...
IC substrate makers Nan Ya PCB and Kinsus Interconnect are both expected to post significant revenue and profit increases in 2020 as robust demand from segments of smartphones, servers,...
IC assembly and test services provider ASE Technology Holding has signed a MoU with Taiwan's STSP (Southern Taiwan Science Park) Bureau to secure 20 hectares of land at a new national...
China-based backend house Jiangsu Changjiang Electronics Technology (JCET), through its production subsidiary JCET STATS ChipPAC Korea (JSCK), has reportedly cut into the supply chain...
Taiwan PCB makers are expected to maintain strong shipments of rigid-flex boards at least throughout the first half of 2020 to meet robust demand for AirPods 2 and other TWS (true...
While 5G and AI will dominate new emerging tech applications to create cash flows for enterprises in the next decade, relevant semiconductor materials and technologies will not only...
While SiP substrates are increasingly needed to support function upgrades on wearables, TWS earbuds and other devices, rigid-flex PCBs will firmly stay as mainstream applications for...
Taiwan-based PCB specialist Zhen Ding Technology has decided to enforce a capital increment of US$50 million at its second IC substrate subsidiary to build new capacity for advanced...
Robust orders for 5G smartphone application processors from the world's major Android phone vendors will allow backend house ASE Technology Holding to enjoy a particularly strong first...
Qualcomm has launched new Arm-based processors for notebooks. Among the chips, the new Snapdragon 7c series designed for entry-level devices reportedly adopts ASE Technology's system-in-package...
The market for packaging materials for 5G mmWave transmission modules is set to heat up in 2020, with LTCC (low temperature co-fired ceramic) likely to replace LCP (liquid crystal...
Taiwan-based Nan Ya PCB is expected to double its 2020 capex from NT$3.5 billion (US$114.8 billion) in 2019 to expand capacity for ABF substrates for 5G network applications and SiP...
System-in-package (SiP) will gain significant growth momentum in 2020 as it will be badly needed to process wireless connectivity devices including RF front-end modules, antenna modules...
Taiwan-based backend equipment supplier All Ring Tech is optimistic about its business prospect for 2020 as it has tapped into the supply chains of Taiwan's leading wafer foundry and...
ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, will be ramping up its capex next year to better meet growing demand for packaging high-speed fiber-optic...
