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NEWS TAGGED SAMSUNG ELECTRO-MECHANICS
Wednesday 1 March 2023
Semco develops FC-BGA substrates for autonomous driving
Samsung Electro-Mechanics (Semco) has announced the development of FC-BGA substrates for advanced driver assistance systems (ADAS), as well as the expansion of its high-end automotive...
Thursday 2 February 2023
ABF substrate prices drop in 1Q23
ABF substrate prices are poised to drop in the first quarter of 2023, as makers see their supply loosened, according to industry sources.
Monday 12 December 2022
Zhen Ding eyes high-end IC substrates as growth driver for next 5-10 years
Taiwan's top PCB supplier Zhen Ding Technology will focus more on high-end IC substrates, particularly ABF substrates, to bolster its future revenue growth amid persistently strong...
Monday 4 July 2022
Semco to spend more on FCBGA substrate production
Samsung Electro-Mechanics (Semco) has announced plans to spend more on its FCBGA packaging substrate production in South Korea and Vietnam.
Thursday 5 May 2022
Semco gearing up for server package substrate production
Samsung Electro-Mechanics (Semco) is poised to step into the server package substrate sector with plans to build new production lines for high-end ABF substrates in South Korea and...
Tuesday 28 December 2021
Semco reportedly to build new ABF substrate capacity in Vietnam to serve Intel
Samsung Electro-Mechanics (Semco) reportedly will set up a new ABF substrate plant in Vietnam mainly to provide dedicated capacity for Intel, with construction slated to kick off...
Wednesday 1 December 2021
Nichidenbo upbeat about passive component demand in 2022
Taiwan-based Nichidenbo, which distributes capacitors, MLCCs and other passive components for vendors such as Nippon Chemi-Con and Samsung Electro-Mechanics (Semco), has expressed...
Friday 8 October 2021
Samsung reportedly to build additional ABF substrate capacity
Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with...
Friday 23 April 2021
Nichidenbo upbeat about passive component demand for 5G, EV
Taiwan-based Nichidenbo, which distributes capacitors, MLCCs and other passive components for vendors such as Nippon Chemi-Con and Samsung Electro-Mechanics (Semco), has expressed...
Wednesday 24 February 2021
High-capacitance MLCC prices set to rise
MLCC vendors including Samsung Electro-Mechanics (Semco) and TDK are likely to raise their quotes for high-capacitance MLCCs in response to stronger-than-expected demand for 5G handset...
Thursday 19 November 2020
Semco reportedly to exit rigid-flex PCB segment
Samsung Electro-Mechanics (Semco) reportedly will phase out its rigid-flex PCB (RFPCB) business in 2021 amid unfavorable factors on both the supply and demand sides, according to...
Tuesday 17 December 2019
Semco quits HDI market to focus on IC substrates
Samsung Electro-Mechanics (Semco), following the footsteps of LG Innotek, has announced quitting the HDI market, officially closing its plant in Kunshan, China to focus on production...
Monday 13 May 2019
Samsung enters AiP module production for 5G mmWave
Qualcomm has introduced the world's first 5G NR mmWave antenna modules and sub-6 GHz RF modules for smartphones and other mobile devices, but Samsung is fast catching up.
Thursday 1 November 2018
Chipbond posts record 3Q18 profit
LCD driver IC backend specialist Chipbond Technology has reported net profits climbed to a record high of NT$2.71 billion (US$87.6 million) in the third quarter of 2018. EPS for the...
Monday 29 October 2018
Samsung developing FOPLP for wearable devices
Samsung Electro-Mechanics (SEMCO) under the Samsung group has been engaged in the development of fan-out panel-level packaging (FOPLP) technology for the production of application...